Huawei ME309-562 Instrucciones de instalación

HUAWEI ME309-562 eMTC LGA Module

Hardware Guide

Issue 03

Date 2017-07-18

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HUAWEI ME309-562 eMTC LGA Module

Hardware Guide

About This Document

Revision History

Document

Version

Date Chapter Descriptions

01 2017-03-23 - Draft release

02 2017-05-26 - 1.Cancel SPI/I2C function;

2.Cancel wake_up out function, use

RING to replace it;

3.Update the pin map interface picture

because the change above.

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HUAWEI ME309-562 eMTC LGA Module

Hardware Guide

Contents

1 Introduction....................................................................................................................................5

2 Overall Description ......................................................................................................................6

2.1 About This Chapter........................................................................................................................... 6

2.2 Function Overview............................................................................................................................ 6

2.3 Circuit Block Diagram....................................................................................................................... 7

2.4 Application Block Diagram ............................................................................................................... 8

3 Description of the Application Interfaces..............................................................................10

3.1 About This Chapter......................................................................................................................... 10

3.2 LGA Interface ................................................................................................................................. 10

4 Mechanical Specifications.........................................................................................................20

4.1 About This Chapter......................................................................................................................... 20

4.2 Storage Requirement..................................................................................................................... 20

4.3 Moisture Sensitivity ........................................................................................................................ 20

4.4 Dimensions..................................................................................................................................... 20

4.5 Customer PCB Design................................................................................................................... 22

4.5.1 PCB Surface Finish............................................................................................................... 22

4.5.2 PCB Pad Design.................................................................................................................... 22

4.5.3 Solder Mask........................................................................................................................... 24

4.5.4 Requirements on PCB Layout............................................................................................... 24

4.5.5 Stencil Design........................................................................................................................ 24

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HUAWEI ME309-562 eMTC LGA Module

Hardware Guide

1 Introduction

This document describes the hardware application interfaces and air interfaces

provided by HUAWEI ME309-562 eMTC LGA module (hereinafter referred to as the

ME309-562 module).

This document helps hardware engineer to understand the interface specifications,

electrical features and related product information of the ME309-562 module.

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2 Overall Description

2.1 About This Chapter

This chapter gives a general description of the ME309-562 module and provides:

Function Overview

Circuit Block Diagram

Application Block Diagram

2.2 Function Overview

Table 2-1 ME309-562 module features

Feature Description

Physical

Dimensions

Dimensions (W × L × H): 18 mm × 24 mm × 2.5 mm

Weight TBD

Operating

Bands

HD-FDD LTE: Band 2, Band 4, Band 12, Band13

Operating

Temperature Normal operating temperature: –30°C to +75°C (Characteristics

guaranteed)

Extended operating temperature[1]: –40°C to +85°C (Normal

working)

Storage

Temperature –40°C to +95°C

Power

Voltage 3.3 V to 4.2 V (3.8 V is recommended.)

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Feature Description

Application

Interface

(120-pin LGA

interface)

GPIO x 5

UART interface (one 8-wire UART0, two 4-wire UART1&UART2,

and UART2 is only for debugging)

Standard SIM interface

ADC interface x 2

SPI interface (software not support)

I2C interface (software not support)

LED interface x 2

JTAG interface

Power supply interface

Power on/off interface

Hardware reset interface

Wake in/out interface

Antenna

Interface RF antenna pad x 1

Data Services LTE FDD: DL 300kbps; UL 375kbps @1.4MHz BW catM1

[1]: When the ME309-562 module works at –40°C to –30°C or +75°C to +85°C, NOT all its

RF performances comply with the 3GPP specifications.

2.3 Circuit Block Diagram

Figure 2-1 shows the circuit block diagram of the ME309-562 module. The major

functional units of the ME309-562 module contain the following parts:

Baseband controller

Nor flash

RF Circuit

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Figure 2-1 Circuit block diagram of the ME309-562 module

2.4 Application Block Diagram

Figure 2-2 Application block diagram of the ME309-562 module

UART Interface: The module supports 3 UART interfaces. Two are 4-wire

UARTs, and the other one is 8-wire UART. Uart02 is only for

debugging.

SIM Interface: The SIM interface provides the interface for a SIM card.

GPIO: General Purpose I/O pins.

External Power

Supply: DC 3.8 V is recommended.

ADC: Analog-to-Digital Converter

I2C: Inter－Integrated Circuit

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SPI: Serial Peripheral Interface

RF Pad: RF antenna interface.

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3 Description of the Application Interfaces

3.1 About This Chapter

This chapter mainly describes the external application interfaces of the ME309-562

module LGA Interface.

3.2 LGA Interface

The ME309-562 module uses a 120-pin LGA as its external interface. For details

about the module and dimensions, see 4.4 Dimensions.

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