ST UM2966 Manual de usuario

Introduction

The ASTRA platform (STEVAL-ASTRA1B) is a development kit and reference design that simplifies prototyping, testing and

evaluating advanced asset tracking applications such as livestock monitoring, fleet management, and logistics.

The kit consists of four boards (not available for separate sale): STEVAL-ASTRA1 (main board), STEVAL-ASTRA1SB (system

on board), STEVAL-ASTRA1BC (expansion board) and STEVAL-ASTRA1NA (flexible NFC antenna).

It comes with comprehensive software, firmware libraries, tools, battery, and plastic case. Thanks to its modular and optimized

design, it simplifies the development of tracking and monitoring innovative solutions.

The STEVAL-ASTRA1B is built around the STM32WB5MMG module and the STM32WL55JC SoC for short and long range

connectivity (BLE, LoRa, and 2.4 GHz and sub 1-GHz proprietary protocols). ST25DV64K for NFC connectivity is also available.

The on-board STSAFE-A110 enhances security features.

The kit embeds a complete set of environmental and motion sensors (LIS2DTW12, LSM6DSO32X, HTS221, STTS22H,

LPS22HH). Moreover, the Teseo-LIV3F GNSS module provides outdoor positioning.

The power management, built around ST1PS02 and STBC03, is optimized for long battery life.

Figure 1. STEVAL-ASTRA1B development kit

Getting started with the STEVAL-ASTRA1B multiconnectivity asset tracking

reference design based on STM32WB5MMG and STM32WL55JC

UM2966

User manual

UM2966 - Rev 1 - February 2022

For further information contact your local STMicroelectronics sales office. www.st.com

1Getting started

1.1 Precautions for use

Danger: Charge the STEVAL-ASTRA1B with a DC 5 V–500 mA USB charger at an ambient

temperature between 5°C to 35°C. Do not use a USB charger without short-circuit

protection to prevent fire hazard.

Use the STEVAL-ASTRA1B at the recommended working temperature range and store

it according to the permitted storage conditions (see Table 1). Never expose the kit to

excessive heat such as direct sunlight, fire, or heating equipment.

Use only the battery provided with the kit, the replacement of the battery with an incorrect

type might invalidate the safeguards.

LiPo batteries can be damaged and even explode if they are short-circuited or overcharged

or improperly used (mechanical crushes, hot oven, or battery cutting).

Table 1. Precautions for use

Parameter Range

Operating temperature 10°C to 35°C

Charging temperature 10°C to 35°C

Humidity From 50% to 80%

Operating altitude Up to 2000 m

1.2 Features

• Ultra-low-power and multiconnectivity asset tracking platform

•Two wireless SoCs:

–STM32WB5MMG 2.4 GHz wireless dual core SoC module as main application processor, which

supports Bluetooth® Low Energy 5.0

–STM32WL55JC sub 1-GHz wireless dual core SoC, which supports multimodulation (LoRa and GFSK)

•ST25DV64K for NFC connectivity

•Teseo-LIV3F GNSS module with simultaneous multiconstellation

• Environmental and motion sensors: STTS22H, LPS22HH, HTS221, LIS2DTW12, and LSM6DSO32X

•STSAFE-A110 secure element

• Battery-operated solution with smart power management architecture (ST1PS02, STBC03, and TCPP01-

M12)

•FP-ATR-ASTRA1 function pack compatible with STM32CubeMX, which can be downloaded from and

installed directly into STM32CubeMX

• End-to-end proof of concept ecosystem mobile app and cloud dashboard:

–DSH-ASSETRACKING web cloud dashboard

–STAssetTracking mobile app available on Google Play and App store

• 480 mAh LiPo battery

• Plastic case

• SMA antenna

• NFC antenna

• Operating conditions: +5 to 35°C

1.3 Kit components

The STEVAL-ASTRA1B is a development kit consists of three boards and a flexible NFC antenna (none of them

available for separate sale):

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• the STEVAL-ASTRA1SB system on board (with STEVAL$ASTRA1SBA finished good and AB0037 code

printed on the PCB);

•the STEVAL-ASTRA1 main board (with STEVAL$ASTRA1A finished good and AB0038 code printed on the

PCB);

• the STEVAL-ASTRA1BC expansion board (with STEVAL$ASTRA1BCA finished good and AB0058 code

printed on the PCB);

• the STEVAL-ASTRA1NA flexible NFC antenna (with STEVAL$ASTRA1NAA finished good and AB0077

code printed on the PCB).

Moreover, the kit includes, only for evaluation purposes, a plastic case to host the boards and the LiPo battery

included.

The figure below shows how the boards are mechanically connected to each other:

• the STEVAL-ASTRA1SB system on board is soldered on top of the main board;

• the STEVAL-ASTRA1BC expansion board is connected to the main board through the 34-pin expansion

connector;

• the STEVAL-ASTRA1NA flexible NFC antenna is connected to the main board via an FPC connector.

Figure 2. STEVAL-ASTRA1B components and assembly

1.3.1 STEVAL-ASTRA1SB system on board

1.3.1.1 Architecture and pinout

The system on board hosts long and short-range connectivity as well as security functionalities. Moreover, it

embeds part of the power management circuitry.

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Figure 3. Block diagram of the STEVAL-ASTRA1SB system on board

This board main components are:

•The STM32WB5MMG (AB0037.U902) ultra-low-power, small-form factor, certified 2.4 GHz wireless module.

It integrates the high performance STM32WB dual core Arm® Cortex® M4/M0+, crystals, and the chip

antenna together with the matching network. The module implements a Bluetooth Low Energy stack,

but it can also support Zigbee, Open Thread and other 2.4 GHz proprietary protocols. As an application

processor, it exposes its main peripherals for application purposes and also acts as AT master towards the

STM32WL55JC.

• The STM32WL55JC (AB0037.U903) long-range wireless and ultra-low-power system-on-chip. It is a dual

core Arm® Cortex®-M4/M0+ that supports sub 1-GHz multimodulation, such as LoRa, GFSK, and others.

By default, the STM32WL55JC plays the role of network processor running the LoRaWAN modem AT

slave firmware. It is connected to the STM32WB5MMG through the LPUART interface together with wake-

up, reset, and interrupt signals. The STM32WL55JC drives the sub-GHz RF front end, acting on high

power, low power, and LNA networks. In this STEVAL-ASTRA1B version, the RF front end is tuned at

high frequency bands (868/915/920 MHz). Low frequencies bands can be achieved with a BOM change

of the STM32WL55JC RF network. By default, the sub-GHz antenna is connected to a SMA connector

(AB0037.J935) but you can optionally solder a micro-FL connector (AB0037.J936).

• The STSAFE-A110 (AB0037.U901) secure element hooked to the STM32WB5MMG for authentication and

secure data management services. It consists of a full turnkey solution for IoT, with a secure operating

system, running on the latest generation of secure microcontrollers.

• The ST1PS02CQTR (AB0037.U900) nano-quiescent synchronous step-down converter. It manages power

and can provide up to 400 mA regulated output current. You can select the output voltage via firmware (see

Section 1.3.1.2 ).

The figure below shows the main component placement on the system on board.

The PCB size is about 34 mm x 28 mm. It consists of six layers optimized for RF performance. The edge and

the bottom side of the PCB include several pads. The main peripherals and functionalities are exposed on the 56

edge pins and completed by the 110 pins on the bottom side.

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Figure 4. System on board - main component placement and pinout

The flexible architecture allows moving some functionalities from the STM32WB5MMG to the STM32WL55JC

microcontroller. You can reach this goal by acting on the 30 solder jumpers (AB0037.J900 to AB0037.J929),

which are placed on the top side of the system on board, close to the edge of the PCB. You can use a 0 ohm

(0402 package) resistor or a tiny solder drop to close the jumpers, thus creating a shortcut between the selected

STM32WB5MMG and STM32WL55JC pins.

Figure 5. Solder jumpers for remapping

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Table 2. System on board - edge pinout

Pin Function

E1 GND

E2 WL_RESET

E3 WL_PA14 SWCLK

E4 WL_PA13 SWDIO

E5 WL_VDD

E6 WB_PE0

E7 WB_PD9

E8 WB_PC7

E9 WB_PD11

E10 WB_PA3

E11 WB_PA2

E12 WB_PC5

E13 WB_PA0

E14 WB_PA1

E15 WB_PA15

E16 WB_PD15

E17 WB_PA5

E18 WB_PA4

E19 WB_PA6

E20 WB_PB5

E21 WB_PC1

E22 V_REG_EN

E23 WB_PB9

E24 WB_PB8

E25 WB_PC11

E26 WB_PB6

E27 WB_PB7

E28 WB_PE3

E29 WB_PC4

E30 WB_PD4

E31 WB_PD5

E32 WB_PA7

E33 WB_PD7

E34 WB_PD3

E35 WB_PB10

E36 GND

E37 WB_VDD_USB

E38 WB_PA12

E39 WB_PA11

E40 WB_PC13

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Pin Function

E41 WB_PD12

E42 WB_PD14

E43 WL_PA10

E44 WL_PA9

E45 WL_PB14

E46 WL_PB13

E47 WB_PB11 STSAFE_SDA

E48 WB_PC0 STSAFE_SCL

E49 WB_VDD

E50 WB_PA13 SWDIO

E51 WB_PA14 SWCLK

E52 WB_RESET

E53 V_REG_2

E54 V_REG

E55 V_UNREG

E56 GND

The bottom side of the system on board embeds 110 pins. Some of them form two extended debug connector

footprints. Each footprint is connected to a microcontroller (see Figure 6).

The supported connectors are: SAMTEC FTSH-107-01-F-DV-K-P-TR (STLINK-V3MINI receptacle) and SAMTEC

FTSH-111-01-L-DV-K-P-TR (neither of this connector is included in the kit). The remaining 62 pins support minor

features of the two microcontrollers.

Table 3. System on board - bottom pinout (from B1 to B68)

Pin Function

B1 WB_PD0

B2 WB_PD2

B3 WB_PD8

B4 WB_PH0

B5 WB_PD10

B6 WB_PB1

B7 WB_PH1

B8 WB_PD13

B9 WB_PC12

B10 WB_PE1 POWER GOOD

B11 WB_PB15

B12 WL_PA3

B13 WL_PA2

B14 WL_PA1

B15 WL_PB2

B16 WL_PA11

B17 WB_PD1

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Pin Function

B18 WB_PB0

B19 WB_PC6

B20 WB_PA8

B21 WL_PA15

B22 WL_PA12

B23 WB_PB12

B24 WB_PD6

B25 Not connected

B26 WB_PA13 SWDIO

B27 WB_PA14 SWCLK

B28 WB_PB3

B29 WB_PA15

B30 WB_RESET

B31 WB_PA9

B32 WB_PB4

B33 WB_PB2

B34 WB_PB13

B35 WB_PE2

B36 Not connected

B37 WB_VDD

B38 WB_GND

B39 WB_GND

B40 WB_PA14

B41 WB_GND

B42 WB_PA10

B43 WB_PB3

B44 WB_PC3

B45 Not connected

B46 Not connected

B47 Not connected

B48 WB_PB14

B49 WL_PC1

B50 WL_PC6

B51 WL_PC0

B52 WL_PB10

B53 WL_PA7

B54 WL_PA6

B55 WL_PA4

B56 Not connected

B57 Not connected

B58 Not connected

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Pin Function

B59 Not connected

B60 WL_PC3

B61 WL_PC4

B62 WL_PC5

B63 WL_PB11

B64 WL_PA5

B65 WL_PB0

B66 WB_PC2

B67 WL_PA9

B68 WL_PA10

Table 4. System on board - bottom pinout (from B69 to B110)

Pin Function

B69 Not connected

B70 WL_PA13 SWDIO

B71 WL_PA14 SWCLK

B72 WL_PB3

B73 WL_PA15

B74 WL_RESET

B75 WL_PB6

B76 WL_PB4

B77 WL_PB5

B78 WL_PA8

B79 WL_PC2

B80 Not connected

B81 WL_VDD

B82 WL_GND

B83 WL_GND

B84 WL_PA14

B85 WL_GND

B86 WL_PB7

B87 WL_PB3

B88 WL_PB4

B89 Not connected

B90 Not connected

B91 Not connected

B92 Not connected

B93 Not connected

B94 WL_PB15

B95 WL_VDD

B96 WL_PH3

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Pin Function

B97 WB_GND

B98 WB_VDD

B99 WB_PD13 D0_1_2

B100 WB_PE4

B101 WL_PA0

B102 WL_PB1

B103 WL_PB4

B104 WL_PB9

B105 WL_PB8

B106 WL_PC13

B107 WL_PB12

B108 WB_VDD

B109 WB_PH3

B110 WL_GND

Figure 6. Extended debug footprints and supported connectors

1.3.1.2 Power management

The ST1PS02CQTR step-down converter on the system on board is part of the power management circuit.

It generates the power domains (V_REG and V_REG_1) that translate the input voltage (V_UNREG). The

V_REG_EN signals, which come from the power switch on the main board, enable the step-down converter.

At startup the output voltages (V_REG and V_REG_1) are set at 2.5 V. By acting on the D0_1_2 signal, it is

possible to switch to 3.3 V. POWER GOOD reports when the output voltage target is reached.

The STM32WB5MMG microcontroller activates the second energy domain (V_REG_2) acting on the

VOUT2_CTRL signal.

The following figure shows the power management block diagram of the system on board. It also shows the edge

and bottom pins that allow accessing the signals.

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