ST X-NUCLEO-IKS4A1 Manual de usuario

Introduction

The X-NUCLEO-IKS4A1 is a motion MEMS and environmental sensor evaluation board kit consisting of the main board X-

NUCLEO-IQS4A1, which hosts the motion MEMS and environmental sensors, and the detachable add-on board STEVAL-

MKE001A, which hosts the Qvar swipe electrodes.

It is compatible with the Arduino UNO R3 connector layout and features the LSM6DSO16IS and LSM6DSV16X MEMS 3D

accelerometers, the LIS2MDL 3-axis magnetometer, the LIS2DUXS12 3-axis accelerometer, the LPS22DF MEMS pressure

sensor, the SHT40AD1B humidity and temperature sensor, and the STTS22H temperature sensor.

The X-NUCLEO-IKS4A1 interfaces with the STM32 microcontroller via the I²C pin or, for external sensors mounted on DIL24

adaptor, SPI Pins.

Figure 1. X-NUCLEO-IKS4A1 expansion board

Getting started with the X-NUCLEO-IKS4A1 motion MEMS and environmental

sensor expansion board for STM32 Nucleo

UM3239

User manual

UM3239 - Rev 1 - October 2023

For further information contact your local STMicroelectronics sales office. www.st.com

1 Getting started

1.1 Hardware requirements

The X-NUCLEO-IKS4A1 is designed to be used with STM32 Nucleo boards (visit www.st.com for further

information).

Figure 2. X-NUCLEO-IKS4A1 plugged on an STM32 Nucleo board

The X-NUCLEO-IKS4A1 must be connected on the matching pins of any STM32 Nucleo board with the Arduino

UNO R3 connector.

Note: X-NUCLEO-IKS4A1 components are ESD sensitive and, as the board has male/female pass-through

connectors, it is important to handle it with care to avoid bending or damaging the pins.

Related links

See the X-CUBE-MEMS1 product page for firmware and related documentation

UM3239

Getting started

UM3239 - Rev 1 page 2/23

2 System requirements

To complete the system setup, you need:

•a Windows® (7, 8, 10) PC

• a USB type A to mini-B USB cable to connect the STM32 Nucleo to the PC

• board firmware and software package (X-CUBE-MEMS1) installed on the user PC

UM3239

System requirements

UM3239 - Rev 1 page 3/23

3 Hardware description

The board lets you test the functionality of the motion MEMS accelerometer, gyroscope and magnetometer, and

environmental humidity, temperature and pressure sensors, via the I²C communication bus.

It also allows complete testing of all LSM6DSO16IS and LSM6DSV16X functionalities and Qvar touch and swipe

gestures. There is also the possibility to attach the STHS34PF80 IR sensor to enable presence and motion

detection applications.

The board features:

• LSM6DSO16IS: MEMS 3D accelerometer (±2/±4/±8/±16 g) + 3D gyroscope (±125/±250/±500/±1000/±2000

dps) with ISPU (Intelligent Processing Unit)

• LIS2MDL: MEMS 3D magnetometer (±50 gauss)

• LIS2DUXS12: ultralow power MEMS 3D accelerometer (±2/±4/±8/±16 g) with Qvar, AI, & anti-aliasing

• LPS22DF: Low-power and high-precision MEMS pressure sensor, 260-1260 hPa absolute digital output

barometer

• SHT40AD1B

• STTS22H: Low-voltage, ultralow power, 0.5 °C accuracy temperature sensor (-40°C to +125°C)

• LSM6DSV16X: MEMS 3D accelerometer (±2/±4/±8/±16 g) + 3D gyroscope

(±125/±250/±500/±1000/±2000/±4000 dps) with embedded sensor fusion, AI, Qvar

• DIL 24-pin socket available for additional MEMS adapters and other sensors

• Free comprehensive development firmware library and example for all sensors compatible with

STM32Cube firmware

• Equipped with Qvar touch/swipe electrode

• I²C sensor hub features on LSM6DSO and LSM6DSV16X available

• MIPI I3C® compatibility for communication with LIS2DUXS12, LSM6DSV16X and LPS22DF

• Compatible with STM32 Nucleo boards

• Equipped with Arduino UNO R3 connector

• Equipped with industrial connector for IR sensor (STHS34PF80) application development. It can be

connected at the same time of external MEMS through DIL24 adapter

• Available interface for external camera module applications coupled with LIS2DUXS12 through aux SPI

(3/4 w)

• RoHS compliant

• WEEE compliant

• UKCA compliant

Each device has a separate power supply to allow power consumption measurement of every sensor.

The expansion board is power supply compatible with STM32 Nucleo boards: it mounts an LDO to generate 1.8 V

for all the MEMS sensors except for the external sensor mounted on DIL24 adapter, which can be supplied both

from 1.8 V and 3.3 V (main supply from Nucleo board).

All signals between the sensors and the main board are translated by a level shifter.

3.1 Default solder bridge configuration

The user can configure several aspects of the X-NUCLEO-IKS4A1 through several solder bridges which can be

left open (not mounted) or closed (mounted) to configure different hardware settings.

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Hardware description

UM3239 - Rev 1 page 4/23

3.2 Block diagram

The LSM6DSO16IS and the LSM6DSV16X have an I²C sensor hub that allows them to behave as the I²C master

for other slave devices connected via an I²Caux bus. Various bus configurations are possible to select the I²C

master of the environmental/DIL24 sensors.

Mode 1: standard I²C bus connection (all sensors)

In standard I²C mode, all devices are connected to an external main board via the same I²C bus.

The board configuration is:

• J4: 1-2, 11-12 (STM_SDA = SENS_SDA, HUB_SDx = GND)

• J5: 1-2, 11-12 (STM_SCL = SENS_SCL, HUB_SCx = GND)

Figure 3. X-NUCLEO-IKS4A1 standard I²C

Mode 2: LSM6DSO16IS I²C sensor hub (all sensors)

In this sensor hub I²C mode, it is possible to power-up the 6-axes IMU (Inertial Measurement Unit) functionalities

by collecting external data through a direct control of the on-board environmental sensors (temperature, pressure

and magnetometer) and external sensor (DIL24) through the auxiliary I²Cz bus "SENS_I2C". LSM6DSV16X,

LIS2DUXS12 and SHT40AD1B remains connected to the main bus "uC_I2C" coming from the external board.

The board configuration is:

• J4: 5-6 (HUB2_SDx = SENS_SDA)

• J5: 5-6 (HUB2_SCx = SENS_SCL)

Figure 4. X-NUCLEO-IKS4A1 LSM6DSO16IS I²C sensor hub

UM3239

Block diagram

UM3239 - Rev 1 page 5/23

Mode 3: LSM6DSV16X I²C sensor hub

In this sensor hub, it is possible to power-up the 6-axes IMU (Inertial Measurement Unit) functionalities by

collecting external data through a direct control of the on-board environmental sensors (temperature, pressure

and magnetometer) and external sensor (DIL24) through the auxiliary I2C bus "SENS_I2C". LSM6DSO16IS,

LIS2DUXS12 and SHT40AD1B remains connected to the main bus "uC_I2C" coming from the external board.

The board configuration is:

• J4: 7-8 (HUB1_SDx = SENS_SDA)

• J5: 7-8 (HUB1_SDx = SENS_SDA)

DIL24 adapter (to I²C2): SB16, SB21

Not mounted: SB6, SB10, SB12, SB14, SB18, SB19, SB20, SB22

Figure 5. LSM6DSV16X I²C sensor hub

Mode 4: DIL24 I²C sensor hub (all sensors)

In case a sensor with sensor hub embedded functionality is mounted to the board through DIL24 adapter, it is

possible to exploit this functionality as for LSM6DSO16IS and the LSM6DSV16X.

In this configuration, may be necessary to connect the DIL24 to the external board through SPI lines in order to

avoid an address conflict on I2C bus with the LSM6DSO16IS and the LSM6DSV16X. This is done by changing

the SBx configuration.

The board configuration is:

• J4: 9-10 (DIL_SDx = SENS_SDA)

• J5: 9-10 (DIL_SDx = SENS_SDA)

Figure 6. X-NUCLEO-IKS4A1 DIL24, I²C sensor hub (all sensors)

Mode 5: LSM6DSO16IS as Qvar controller

In this configuration, it is possible to use the equipped Qvar swipe electrode (by plugging it on JP6 and JP7

connectors) through the LSM6DSO16IS.

The board configuration is:

• J4: 3-4 (HUB1_SDx = QVAR1)

• J5: 3-4 (HUB1_Scx = QVAR2)

UM3239

Block diagram

UM3239 - Rev 1 page 6/23

3.3 Sensor I²C address selection

Most sensors allow I²C address LSB selection by pulling the SD0 pin low or high. The board has solder bridges to

control SD0 level.

Table 1. Solder bridges for I²C address

Address in bold are the default I2C addresses

Sensor SD0 low SD0 high

STTS22H (U8) ADD= 71h

LIS2DUXS12 (U5) SB19 ADD=31h SB20 ADD=33h

LSM6DSO16IS (U9) SB35 ADD=D5h SB34 ADD=D7h

LPS22DF (U6) SB31 ADD=B9h SB29 ADD=BBh

LIS2MDL (U7) ADD =3Ch ADD =3Ch

SHT40AD1B (U10) ADD= 89h ADD= 89h

DIL24 Adapter (J1) SB43/SB44 SB41/SB42

LSM6DSV16X (U4) SB17 ADD=D5h SB15 ADD=D7h

3.4 Sensor current consumption measurement

The X-NUCLEO-IKS4A1 expansion board is equipped with OR resistors that allow separate current consumption

measurement for each sensor.

To measure current consumption, connect an ammeter to the appropriate pads.

Note: As the sensors have very low current consumption, you should set a suitable range and use an ammeter with

low burden voltage.

Table 2. Resistors/jumpers for current consumption measurement

Sensor Resistor/jumper

LIS2MDL (U7) R18

LSM6DSO16IS (U9) R21

SHT40AD1B (U10) R22

LIS2DUXS12 (U5) R16

STTS22H (U8) R19

LPS22DF (U6) R32

DIL24 Adapter (J1) JP5

LSM6DSV16X R33

3.5 Sensor disconnection

To disconnect a sensor, you should disconnect the I²C bus as well as the power supply. See the table below for

the relevant jumpers and solder bridges.

Table 3. Link between sensors, jumpers and I²C solder bridges

Sensor SDA SCL

LIS2MDL (U7) SB30 SB26

LSM6DSO16IS (U9) SB38 SB36

SHT40AD1B (U10) SB39 SB37

LIS2DUXS12 (U5) SB22 SB16

UM3239

Sensor I²C address selection

UM3239 - Rev 1 page 7/23

Sensor SDA SCL

STTS22H (U8) SB33 SB32

LPS22DF (U6) SB28 SB25

DIL24 Adapter (J1) SB47, SB49, SB48 SB51, SB53, SB52

LSM6DSV16X SB21 SB18

3.6 Adapter board for DIL24 socket

An additional sensor can be connected as an adapter board to J6 DIL24 socket.

As there are a few different interrupt signal assignments for DIL24 pins, the appropriate pin can be selected using

the J2 header.

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