Panasonic KX-TS2365RUB Manual de usuario

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Service Manual

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ORDER NO. KM40305091C3

Telephone Equipment

●KX-TS2365RUB

Integrated Telephone System

Black Version

(for Russia)

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Table Of Contents
COVER 
ABOUT LEAD FREE SOLDER (PbF: Pb free) 
1 Suggested PbF Solder 
2 How to recognize that Pb Free solder is used 
FOR SERVICE TECHNICIANS 
CAUTION 
BATTERY 
1 Installing the Batteries 
2 Battery Replacement 
LOCATION OF CONTROLS 
DISPLAY 
CONNECTION 
1 Connecting the Handset/Telephone Line Cord 
2 Connecting a Communication Device 
SETTINGS 
1 Selecting the Dialing Mode 
2 Setting the PIN Code 
3 Dial Lock 
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3.1 To Set the Dial Lock 
3.2 To Cancel the Dial Lock 
4 Call Restriction 
4.1 To Set the Call Restriction 
5 How to Release the Establishment of Dial Lock 
OPERATIONS 
1 Making Calls 
2 Answering Calls 
3 FLASH Button 
DISASSEMBLY INSTRUCTIONS 
TROUBLE SHOOTING GUIDE 
1 Service Hints 
2 Pulse Dialing Problems 
3 Tone Dialing Problems (Handset) 
4 No Ringing Sound When Ring Signal is Input. 
BLOCK DIAGRAM 
CIRCUIT OPERATION 
1 Bell Detector Circuit 
2 Line Interface 
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3 Speakerphone Circuit 
3.1 Function 
3.2 Circuit Operation 
4 Telephone Line Interface 
4.1 Circuit operation 
5 Tone Detect 
5.1 Circuit operation 
6 Initializing Circuit 
6.1 Function 
6.2 Circuit operation 
CPU DATA 
1 IC801 
HOW TO SET THE FLASH TIME AND REDIAL TIME 
1 Flash Time 
2 Redial Time 
3 Speakerphone IC Data 
BLOCK DIAGRAM (IC 1) 
1 Communication ICs 
MODULE BLOCK DIAGRAM 
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1 MODULE BLOCK DIAGRAM 
2 CONNECTOR PIN ASSIGNMENT 
HOW TO REPLACE A FLAT PACKAGE IC 
1 Preparation 
2 Procedure 
3 Removing Solder from Between Pins 
TERMINAL GUIDE OF THE ICs, TRANSISTORS AND DIODES 
CABINET AND ELECTRICAL PARTS LOCATION 
ACCESSORY AND PACKING MATERIALS 
REPLACEMENT PARTS LIST 
1 Base Unit 
1.1 Cabinet and Electrical Parts 
1.2 Main P.C. Board Parts 
2 ACCESSORIES AND PACKING MATERIALS 
FOR SCHEMATIC DIAGRAM (SCHEMATIC DIAGRAM) 
SCHEMATIC DIAGRAM 
CIRCUIT BOARD 
1 Component View 
2 Flow Solder Side View 
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1 ABOUT LEAD FREE SOLDER (PbF: Pb free)

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Note:

In the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard

solder or solder that contains lead.

We will use PbF solder when discussing the lead free solder used in our manufacturing process which is

made from Tin (Sn), Silver (Ag), and Copper (Cu).

This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB.

For service and repair work we suggest using the same type of solder although, with some precautions,

standard Pb solder can also be used.

Caution

●PbF solder has a melting point that is 50°F ~ 70° F (30°C ~ 40°C) higher than Pb solder. Please

use a soldering iron with temperature control and adjust it to 700°F ± 50° F (370°C ± 10°C).In

case of using high temperature soldering iron, please be careful not to heat too long.

●PbF solder will tend to splash if it is heated much higher than its melting point, approximately

1100°F (600°C).

●If you must use Pb solder on a PCB manufactured using PbF solder, remove as much of the

original PbF solder as possible and be sure that any remaining is melted prior to applying the Pb

solder.

●When applying PbF solder to double layered boards, please check the component side for excess

which may flow onto the opposite side (See the figure below).

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1.1 Suggested PbF Solder

1.2 How to recognize that Pb Free solder is used

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1.1 Suggested PbF Solder

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There are several types of PbF solder available commercially. While this product is manufactured using

Tin, Silver, and Copper (Sn+Ag+Cu), you can also use Tin and Copper (Sn+Cu), or Tin, Zinc,

andBismuth (Sn+Zn+Bi). Please check the manufac turer’s specific instructions for the melting points of

their products and any precautions for using their product with other materials.

The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3mm,

0.6mm and 1.0mm.

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1.2 How to recognize that Pb Free solder is used

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(Flow Solder Side View)

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