Panasonic Transistors 2SC3938G Manual de usuario
Transistors
1
Publication date: April 2007 SJC00364AED
This product complies with the RoHS Directive (EU 2002/95/EC).
2SC3938G
Silicon NPN epitaxial planar type
For high-speed switching
■Features
•Low collector-emitter saturation voltage VCE(sat)
•S-Mini type package, allowing downsizing of the equipment and
automatic insertion through the tape packing
■Absolute Maximum Ratings Ta=25°C
Parameter Symbol Conditions Min Typ Max Unit
Collector-base cutoff current (Emitter open)
ICBO VCB =40 V, IE=0 0.1 µA
Emitter-base cutoff current (Collector open)
IEBO VEB =4 V, IC=0 0.1 µA
Forward current transfer ratio *hFE VCE =1 V, IC=10 mA 60 200
Collector-emitter saturation voltage VCE(sat) IC=10 mA, IB=1 mA 0.17 0.25 V
Base-emitter saturation voltage VBE(sat) IC=10 mA, IB=1 mA 1 V
Transition frequency fTVCB =10 V, IE=−10 mA, f =200 MHz 450 MHz
Collector output capacitance Cob VCB =10 V, IE=0, f =1 MHz 2 6 pF
(Common base, input open circuited)
Turn-on time ton Refer to the measurement circuit 17 ns
Turn-off time toff 17 ns
Storage time tstg 10 ns
■Electrical Characteristics Ta=25°C ±3°C
Parameter Symbol Rating Unit
Collector-base voltage (Emitter open) VCBO 40 V
Collector-emitter voltage (E-B short) VCES 40 V
Emitter-base voltage (Collector open) VEBO 5V
Collector current IC100 mA
Peak collector current ICP 300 mA
Collector power dissipation PC150 mW
Junction temperature Tj150 °C
Storage temperature Tstg −55 to +150 °C
Rank Q R
hFE 60 to 120 90 to 200
Note) 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 measuring methods for transistors.
2. *: Rank classification
■Package
•Code
SMini3-F2
•Marking Symbol: 2Y
•Pin Name
1. Base
2. Emitter
3. Collector
2SC3938G
2SJC00364AED
This product complies with the RoHS Directive (EU 2002/95/EC).
hFE ICfTIECob VCB
ICVCE VCE(sat) ICVBE(sat) IC
220 Ω
0.1 µF
50 Ω
V
CC
= 3 V
V
OUT
3.3 kΩ
50 Ω
V
IN
= 10 V
3.3 kΩ
V
BB
= −3 V
V
IN
V
OUT
t
on
90%
10%
90%
10%
t
off
(Waveform at A)
V
IN
V
OUT
10%
10%
t
stg
910 Ω
0.1 µF
0.1 µF
A
90 Ω
V
CC
= 10 V
V
OUT
500 Ω
50 Ω
V
IN
= 10 V
500 Ω
1 kΩ
V
BB
= 2 V
t
on
, t
off
test circuit t
stg
test circuit
Measurement circuit
PCTa
0 16040 12080 14020 10060
0
200
160
120
80
40
Collector power dissipation PC(mW)
Ambient temperature Ta(°C)
0 1.21.00.80.2 0.60.4
0
120
100
80
60
40
20
T
a
=25°C
2.5 mA
2.0 mA
1.5 mA
1.0 mA
0.5 mA
I
B
=3.0 mA
Collector current I
C
(mA)
Collector-emitter voltage V
CE
(V)
0.1 1 10 100
0.01
0.1
1
10
100 I
C
/ I
B
=10
T
a
=75°C
25°C
−25°C
Collector-emitter saturation voltage VCE(sat) (V)
Collector current IC(mA)
1 10 100 1 000
0.01
0.1
1
10
100
T
a
=−25°C
25°C
75°C
Base-emitter saturation voltage V
BE(sat)
(V)
Collector current I
C
(mA)
0.1 1 10 100
0
600
500
400
300
200
100
VCE =1 V
Ta=75°C
25°C
−25°C
Forward current transfer ratio hFE
Collector current IC(mA)
−1−10 −100
−1 000
0
600
500
400
300
200
100
VCB =10 V
Ta=25°C
Transition frequency fT(MHz)
Emitter current IE(mA)
110100
0
6
5
4
3
2
1
I
E
=0
f =1 MHz
T
a
=25°C
Collector-base voltage V
CB
(V)
Collector output capacitance
(Common base, input open circuited) C
ob
(pF)
This product complies with the RoHS Directive (EU 2002/95/EC).
SMini3-F2 Unit: mm
0.30 +0.05
−0.02
0.13 +0.05
−0.02
2.00 ±0.20
(0.89)
0.90 ±0.10
(0.65)(0.65)
1.30 ±0.10
1.25 ±0.10
2.10 ±0.10
0.425 ±0.050
(0.49)
0 to 0.10
(5°)
(5°)
3
12
Request for your special attention and precautions in using the technical information and
semiconductors described in this book
(1)If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and
regulations of the exporting country, especially, those with regard to security export control, must be observed.
(2)The technical information described in this book is intended only to show the main characteristics and application circuit examples
of the products, and no license is granted under any intellectual property right or other right owned by our company or any other
company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other
company which may arise as a result of the use of technical information described in this book.
(3)The products described in this book are intended to be used for standard applications or general electronic equipment (such as office
equipment, communications equipment, measuring instruments and household appliances).
Consult our sales staff in advance for information on the following applications:
–Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support
systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the prod-
ucts may directly jeopardize life or harm the human body.
–Any applications other than the standard applications intended.
(4)The products and product specifications described in this book are subject to change without notice for modification and/or im-
provement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product
Standards in advance to make sure that the latest specifications satisfy your requirements.
(5)When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions
(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute
maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any
defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire
or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.
(6)Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,
thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which
damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages.
(7)This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of Matsushita
Electric Industrial Co., Ltd.
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