HP T310 G2 Instrucciones de instalación

EL-MF877-00 Page 1

Template Revision A

Product End-of-Life Disassembly Instructions

Product Category: Thin Client

Marketing Name / Model

[List multiple models if applicable.]

HP t310 G2 Zero Client

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions

for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU

directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).

1.0 Items Requiring Selective Treatment

1.1 Items listed below are classified as requiring selective treatment.

1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as

applicable.

Item Description Notes

Quantity

of items

included

in product

Printed Circuit Boards (PCB) or Printed Circuit

Assemblies (PCA)

With a surface greater than 10 sq cm

Batteries

All types including standard alkaline and lithium coin

or button style batteries

Mercury-containing components

For example, mercury in lamps, display backlights,

scanner lamps, switches, batteries

Liquid Crystal Displays (LCD) with a surface greater

than 100 sq cm

Includes background illuminated displays with gas

discharge lamps

Cathode Ray Tubes (CRT)

Capacitors / condensers (Containing PCB/PCT)

Electrolytic Capacitors / Condensers measuring

greater than 2.5 cm in diameter or height

External electrical cables and cords

Gas Discharge Lamps

Plastics containing Brominated Flame Retardants

Components and parts containing toner and ink,

including liquids, semi-liquids (gel/paste) and toner

Include the cartridges, print heads, tubes, vent

chambers, and service stations.

Components and waste containing asbestos

Components, parts and materials containing

refractory ceramic fibers

Components, parts and materials containing

radioactive substances

EL-MF877-00 Page 2

Template Revision A

2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where components

and materials requiring selective treatment can be removed.

Tool Description

Tool Size (if

applicable)

Description #1: Phillips screwdriver

Description #2: Diagonal cutting plier

Description #3 Nipper

3.0 Product Disassembly Process

3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:

1. Remove chassis labels on label mylar tab

2. Remove chassis rubber and screws

3. Remove upper plastic and metal chassis

4. Remove EMI contact fingers and heatsink EMI gasket from the upper metal chassis

5. Remove light shielding rubber from the upper plastic chassis

6. Separate upper metal chassis from upper plastic chassis

7. Separate PCBA board from the chassis using the screwdriver

8. Separate lower metal chassis from lower plastic chassis

9. Remove label mylar tab

3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items

contained in the product that require selective treatment (with descriptions and arrows identifying locations).

Otros manuales para t310 G2

Tabla de contenidos

Otros manuales de Servidor de HP

HP ProLiant DL140 Manual

HP ProLiant DL980 Manual de usuario

HP Rx2620-2 - Integrity - 0 MB RAM Manual del operador

HP Apollo 4200 Gen9 Manual

HP D7171A - NetServer - LPr Guía

HP ProLiant DL560 Instrucciones de uso

HP ProLiant ML115 G5 Guía de inicio rápido

HP DL385 - ProLiant - G5 Manual de usuario

HP D7171A - NetServer - LPr Manual de usuario

HP ProLiant SL4540 Manual de usuario

HP ProLiant BL620c G7 Manual de usuario

HP D7171A - NetServer - LPr Manual de usuario

HP ProLiant SL4545 Guía

HP ProLiant SL270s Generation 8 Instrucciones de uso

HP ProLiant DL360e Manual de usuario

HP Integrity NonStop NB54000c Manual de referencia

HP D5970A - NetServer - LCII Manual de usuario

HP Tc2110 - Server - 128 MB RAM Manual de funcionamiento

HP ProLiant DL160 Gen8 Manual

HP P5389A - Intel Pentium III-S 1.4 GHz Processor... Instrucciones de montaje

HP Indigo MegaRAID iTBBU02 Manual de usuario

HP ProLiant SL4545 G7 Manual

HP Integrity rx6600 Manual de usuario

Manuales populares de Servidor de otras marcas

Dell

Dell PowerEdge R410 Manual de usuario

PowerNAS

PowerNAS CMA Manual de usuario

Supero

Supero FatTwin F617R3-FT Manual de usuario

MSI

MSI P1-109N-L70 Manual de usuario

Dell

Dell PowerEdge XE9640 Manual

Dell

Dell PS4100 Instrucciones de montaje

EtroVISION

EtroVISION EV3151 Manual de usuario

NEC

NEC Express5800/T110j Manual de usuario

Compaq

Compaq ProLiant 3000 Manual

Dell

Dell PowerEdge 3YPMN Manual de usuario

iRobo

iRobo IPC2U Manual de usuario

Nortel

Nortel 1000 Con?guration guide Manual de usuario

Asus

Asus AP7500 Manual de operación y mantenimiento

Avid Technology

Avid Technology AirSpeed 5000 Manual de usuario

Milestone

Milestone Husky IVO 350T Manual de usuario

Planet

Planet NAS-7410 Manual de usuario

Lenovo

Lenovo ThinkSystem SR635 V3 Manual de usuario

Dell

Dell PowerEdge HS5610 Manual

HP t310 G2 Instrucciones de instalación

Manuales populares de Servidor de otras marcas