HP HSR6602-G Instrucciones de instalación

Product End-of-Life Disassembly Instructions

Product Category: Networking Equipment

Marketing Name / Model

[List multiple models if applicable.]

HP HSR6602-G Router(JG353A)

HP HSR6602-XG Router(JG354A)

HP HSR6602-G TAA-compliant Router(JG776A)

HP HSR6602-XG TAA-compliant Router((JG777A))

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions

for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU

directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).

1.0 Items Requiring Selective Treatment

1.1 Items listed below are classified as requiring selective treatment.

1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as

applicable.

Item Description Notes

Quantity

of items

included

in product

Printed Circuit Boards (PCB) or Printed Circuit

Assemblies (PCA)

With a surface greater than 10 sq cm

Batteries

All types including standard alkaline and lithium coin

or button style batteries

Mercury-containing components

For example, mercury in lamps, display backlights,

scanner lamps, switches, batteries

Liquid Crystal Displays (LCD) with a surface greater

than 100 sq cm

Includes background illuminated displays with gas

discharge lamps

Cathode Ray Tubes (CRT)

Capacitors / condensers (Containing PCB/PCT)

Electrolytic Capacitors / Condensers measuring

greater than 2.5 cm in diameter or height

External electrical cables and cords

Gas Discharge Lamps

Plastics containing Brominated Flame Retardants

weighing > 25 grams (not including PCBs or PCAs

already listed as a separate item above)

Components and parts containing toner and ink,

including liquids, semi-liquids (gel/paste) and toner

Include the cartridges, print heads, tubes, vent

chambers, and service stations.

Components and waste containing asbestos

Components, parts and materials containing

refractory ceramic fibers

Components, parts and materials containing

radioactive substances

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Template Revision B

2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where components

and materials requiring selective treatment can be removed.

Tool Description

Tool Size (if

applicable)

Screw driver

tweezers

Description #3

Description #4

Description #5

3.0 Product Disassembly Process

3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:

1. Unscrew the screws for mounting angle 1, and then remove the mounting angle 1 from the rack or cabinet.

2. Unscrew the screws on mounting angle 2, and then remove the mounting angle 2.

3. Remove all of the labels.

4. Unscrew the screws on fan-assembly 3, and then remove the fan-assembly 3.

5. Unscrew the screws on power mask 4, and then remove the power mask 4.

6. Remove the blank panel 5.

7. Unscrew the screws on top cover 6, and remove the top cover 6.

8. Unscrew the screws on power bracket 7, and then remove power bracket 7.

9. Unscrew the screws on PCB 8, and then remove PCB 8.

10. Unscrew the screws on PCB 9, and remove PCB 9.

11. Unscrew the screws on PCB 10, and remove PCB 10.

12. Remove shielding fingers 11.

13. Unscrew all the screws on the fan-assembly 3, and remove PCB 3.4.

14. Clear the yellow adhesive, if had, by the tweezers.

15. Pry the button battery up from socket.

3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items

contained in the product that require selective treatment (with descriptions and arrows identifying locations)

Figure 1Remove the mounting angle 2Figure 2 Treatments to rear panel

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Template Revision B

Figure 3Remove top cover 6 and PCB 8 Figure 4 Remove PCB 9 and PCB 10

Figure 5 Treatments to Fan assembly 3

Figure 6 Clear the yellow adhesives by the tweezers Figure 7 Pry up the button battery

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3.3 Material of the facility built

Facility Components Material Weight(g) Weight percentage

Selective treatment for materials

and components

Details

0.8%

Fe recycling

150

1.4%

Fe recycling

3.1

0.4%

Fe recycling

3.2

0.4%

Fe recycling

3.3

Cable

0.1%

3.4 Complex PCB 10 0.1%

The surface of PCB is greater

than 10 square centimeters;

3.5

383

3.6%

Fe recycling

3.6

50*5

2.4%

96*2

1.8%

Fe recycling

313

3.0%

Fe recycling

2515

23.7%

Fe recycling

759

7.2%

Fe recycling

8 Complex PCB 100 0.9%

The surface of PCB is greater

than 10 square centimeters;

9 Complex PCB 250 2.4%

The surface of PCB is greater

than 10 square centimeters;

10 Complex PCB 1200 11.3%

The surface of PCB is greater

than 10 square centimeters;

Be-Cu

0.1%

Cu recycling

4300

40.5%

Fe recycling

4. Revised record

Date

Version

Author

Modify content

2012.11.21

Wu Xuejun

Initial version

2013.07.19

Liu Ziye

Add the module JG776A and JG777A

EL-MF877-00 Page 4

Template Revision B

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