EPOX EP-3S1M Manual de usuario
TRADEMARK
All products and company names are trademarks or registered
trademarks of their respective holders.
These specifications are subject to change without notice.
Manual Revision 1.1
September 26, 2000
An Intel 815 series chipset basedAn Intel 815 series chipset based
An Intel 815 series chipset basedAn Intel 815 series chipset based
An Intel 815 series chipset based
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EP-3S1MEP-3S1M
EP-3S1MEP-3S1M
EP-3S1M
EP-3S1M
User Notice
No part of this product, including the product and software may be reproduced,
transmitted, transcribed, stored in a retrieval system, or translated into any
language in any form without the express written permission of EPoX omputer
ompany (hereinafter referred to as EPoX) except for documentation kept by the
purchaser for backup purposes.
We provide this manual as is without warranty of any kind, either expressed or
implied, including but not limited to the implied warranties or conditions of
merchantability or fitness for a particular purpose. In no event shall EPoX be
liable for any loss of profits, loss of business, loss of use or data, interruption of
business or for indirect, special incidental, or consequential damages of any kind,
even if EPoX has been advised of the possibility of such damages arising from any
defect or error in the manual or product. EPoX may revise this manual from time
to time without notice. For updated BIOS, drivers, or product release information
you may visit our websites at http://www.epox.com or http://www.epox.com.tw.
Products mentioned in this manual are mentioned for identification purposes only.
Product names appearing in this manual may or may not be registered trademarks
or copyrights of their respective companies. The product name and revision
number are both printed on the mainboard itself.
Handling Procedures
Static electricity can severely damage your equipment. Handle the EP-3S1M and
any other device in your system with extreme care and avoid unnecessary contact
with system components on the mainboard. Always work on an antistatic surface to
avoid possible damage to the mainboard from static discharge. Always have the
power supply unplugged and powered off when inserting and removing devices
within the computer chassis. EPoX assumes no responsibility for any damage to the
EP-3S1M mainboard that results from failure to follow instruction or failure to
observe safety precautions.
CAUTION
The EP-3S1M mainboard is subject to damage by static
electricity. Always observe the handling rocedures.
EP-3S1M
Technical Support Services
If you need additional information, help during installation or normal use of this
product, please contact your retailer. Your retailer will have the most current
information about your configuration. If your retailer cannot help, you may visit
our online technical support website and/or contact our support technicians at the
locations listed below.
Record your serial number before installing your EP-3S1M mainboard. (The serial
number is located near the P I slots at the edge of the board.)
EP-3S1M serial number: _____________________
Contacting Technical Support
EPoX technical support is working hard to answer all of your questions online.
From our website you can find answers to many common questions, drivers, BIOS
updates, tech notes, and important technical bulletins. If you are still unable to
locate the solution you are seeking, you always have the option to contact our
support technicians directly.
North American website (English language)
http://www.epox.com
European website (Multi-language)
http://www.epox.nl
Taiwan website (Chinese language)
http://www.epox.com.tw
Thank you for using EPoX mainboards!
Copyright 2000 EPoX Computer Company. All rights reserved.
EP-3S1M
Table of Contents
ection 1 Introduction
omponents hecklist ................................................... 1-1
Overview
Intel eleron processors (P.P.G.A.) 370 ...................... 1-2
Intel oppermine processors (F -PGA) 370 ............... 1-3
Intel® 815 Series hipset Feature .................................. 1-4
EP-3S1M Form-Factor .................................................. 1-6
I/O Shield onnector ...................................................... 1-7
Power-On/Off (Remote) ................................................ 1-7
System Block Diagram ................................................... 1-8
ection 2 Features
EP-3S1M Features.......................................................... 2-1
ection 3 Installation
EP-3S1M Detailed Layout ............................................. 3-2
Easy Installation Procedure
PU Insertion ................................................................. 3-3
Jumper Settings ............................................................... 3-5
System Memory onfiguration ...................................... 3-6
Device onnectors ......................................................... 3-8
External Modem Ring-in Power ON and
Keyboard Power ON Function (KBPO) ........................ 3-11
STR (Suspend To RAM) Function .................................. 3-13
ection 4 Award BIO etup
Main Menu ...................................................................... 4-1
Standard MOS Setup .................................................... 4-3
Advanced BIOS Features ................................................ 4-7
Advanced hipset Features............................................. 4-10
Integrated Peripherals..................................................... 4-14
Page
EP-3S1M
Power Management Setup .............................................. 4-18
PNP/P I onfiguration Setup........................................ 4-21
P Health Status ............................................................. 4-22
Frequency ontrol .......................................................... 4-24
Defaults Menu................................................................. 4-25
Supervisor/User Password Setting ................................. 4-26
Exit Selecting .................................................................. 4-27
ection 5 815 eries VGA and ound Driver Installation
Easy Driver Installation .................................................. 5-1
Appendix
Appendix A
Memory Map................................................................... A-1
I/O Map ........................................................................... A-1
Timer & DMA hannels Map ......................................... A-2
Interrupt Map................................................................... A-2
RT & MOS RAM Map ............................................... A-3
Appendix B
POST odes .................................................................... A-5
Appendix C
Load Optimized Defaults................................................ A-13
Appendix D
GHOST 5.1 Quick Users Guide .................................... A-15
EP-3S1M
Page Left Blank
IntroductionEP-3S1M
Page 1-1
Section 1
INTRODUCTION
Components Checklist
99
99
9A. (1) EP-3S1M mainboard
99
99
9B. (1) EP-3S1M users manual
99
99
9C. (1) Floppy ribbon cable
99
99
9. (1) ATA66 Hard drive ribbon cable
99
99
9E. (1) RS-232 9-PIN ribbon cable
F. (1) PS/2 to AT keyboard connector adapter (optional)
99
99
9G. (1) Onboard Graphic and Sound river
H. (1) TV2 adapter card (optional)
I. (1) PL2 adapter card (optional)
K. (1) AIMM card (optional)
USERS
MANUAL
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AF
C
D
E
G
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Introduction EP-3S1M
Page 1-2
Overview
Intel Celeron processors (P.P.G.A.) 370
The Intel Celeron processors provide power to handle the internet, educational
programs, interactive 3 games, and productivity applications. The Intel Celeron
processors at 700, 667, 633, 600, 566, 533, 500, 466 and 433 MHz include inte-
grated L2 cache 128Kbyte. The core for the 700, 667, 633, 600, 566, 533, 500,
466 and 433 MHz processors have 19M transistors due to the addition of the inte-
grated L2 cache 128Kbyte. All the Intel Celeron processors are available in the
plastic pin grid array (P.P.G.A.) form factor. The P.P.G.A. form factor is compat-
ible with the 370 pin socket. All the Intel Celeron processors are available in the
plastic pin grid array (PPGA) package. The PPGA package is compatible with the
370 pin socket and provides more flexibility to design low cost systems by en-
abling lower profile and smaller systems and providing the potential for reducing
costs of processor retention and cooling solutions. Like the Intel Celeron proces-
sors that utilize S.E.P.P., the Intel Celeron processors that use P.P.G.A., feature a
P6-microarchitecture-based core processor on a single-sided substrate without
BSRAM componentry.
The Intel Celeron processor at 700, 667, 633, 600, 566, 533, 500, 466 and 433
MHz. Includes Intel MMX[tm] media enhancement technology. Offers ynamic
Execution technology.
Includes a 32Kbyte (16Kbyte/16Kbyte) non-blocking, level-one cache that provides
fast access to heavily used data. Intel Celeron processors at 700, 667, 633, 600,
566, 533, 500, 466 and 433 MHz include integrated L2 cache 128Kbyte. All the
Intel Celeron processor utilize the Intel P6 microarchitectures multi-transaction
system bus at 66MHz. The 700, 667, 633, 600, 566, 533, 500, 466 and 433 MHz
processors utilize the Intel P6 microarchitectures multi-transaction system bus
with the addition of the L2 cache interface. The combination of the L2 cache bus
and the processor-to-main-memory system bus increases bandwidth and perfor-
mance over single-bus processors.
IntroductionEP-3S1M
Page 1-3
Intel MMX technology includes new instructions and data types that allow
applications to achieve a new level of performance. Intels MMX technology is
designed as a set of basic, general-purpose integer instructions that are easily
applied to the needs of a wide diversity of multimedia and communications
applications. The highlights of the technology are:
* Single Instruction, Multiple ata (SIM ) technique
* 57 new instructions
* Eight 64-bit wide MMX technology registers
* Four new data types
Intel Coppermine processors (FC-PGA) 370
These Coppermine-128K and Coppermine-256K processor is the next addition to the
P6 micro architecture product family. The FC-PGA package is a new addition to the
Intel IA-32 processor line and hereafter will be referred to as the Coppermine FC-
PGA processor, or simply The processor. The package utilizes the same 370-pin
zero insertion force socket (PGA370) used by the Intel Celeron processor. Thermal
solutions are attached directly to the back of the processor core package without the
use of a thermal plate or heat spreader.
The Coppermine processor, like the Intel Celeron, Intel Pentium II and Pentium III in
the P6 family processor, implement a ynamic Execution micro architecture --- a unique
combination of multiple branch prediction, data flow analysis, and speculative
execution. This enable these processors to deliver higher performance than the Intel
Pentium processor, while maintaining binary compatibility with all previous Intel Ar-
chitecture processors. The processor also executes Intel MMX technology instruc-
tions for enhanced media and communication performance just as its predecessor the
Intel Pentium III processor. Additionally the Coppermine FC-PGA processor executes
streaming SIM (Single-Instruction Multiple ata) Extensions for enhanced floating
point and 3- application performance. The concept of processor identification, via
CPUI , is extended in the processor family with the addition of a processor serial
number. The processor utilizes multiple low-power states such as AutoHALT, Stop-
Grant, Sleep and eep Sleep to conserve power during idle times.
Introduction EP-3S1M
Page 1-4
The processor includes an integrated on-die, 128KB or 256KB, 8-way set associa-
tive level-two (L2) cache with a separated 16KB level one (L1) instruction cache
and 16KB level one (L1) data cache. These cache arrays run at the full speed of the
processor core. As with the Intel Pentium III processor, the Coppermine FC-PGA
processor has a dedicated L2 cache bus, thus maintaining the dual independent bus
architecture to deliver high bus bandwidth and performance. Memory is cacheable
for 4GB/64GB of addressable memory space, allowing significant headroom for
desktop system.
Intel(R) 815 Series chipset features
The Intel(R) 815 series chipset that S RAM interface supports 100MHz and
133MHz operation, the Intel(R) 815 series chipset has re-engineered the Value
PC, providing next generation features and great graphics performance.
The 82815 series Graphics Memory Controller Hub (GMCH) features : Intel(R)
graphics technology and software drivers, using irect AGP (integrated AGP) to
create vivid 2 and 3 effects and images. The 82815 series chip feature
integrated Hardware Motion Compensation to improve soft V video quality.
The Inte(R) 82815 series chipset use Intel(R) ynamic Video Memory Technol-
ogy ( .V.M.T.) is an architecture that offers breakthrough performance for the
(motherboard) PC through efficient memory utilization and irect AGP. The system
OS uses the Intel software drivers and intelligent memory arbiter to support richer
graphics applications.
The Intel(R) 82815 series provides an AGP universal connector to support the
AGP 2.0 including 4X AGP data transfers.
The 82801AA I/O Controller Hub (ICH1) employs the Intel(R) Accelerated Hub
Architecture to make a direct connection from the graphics and memory to the
integrated AC97 controller, the I E controllers (ATA/66 or ATA/33), dual USB
ports, and PCI add-in cards.
The Accelerated Hub Architecture provides twice the bandwidth of the PCI bus at
266 MB per second. This allows a wider flow of rich information from the I/O
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