Texas Instruments TMUX741 EVM Series Manual de usuario

User’s Guide

TMUX741xEVM and TMUX746EVM User's Guide

ABSTRACT

This document is the EVM user’s guide for the TMUX741-746EVM which provides a board for quick DC

parmeter testing for the TMUX741x and TMUX746x families in the QFN and TSSOP package families.

Table of Contents

1 1. Introduction.........................................................................................................................................................................2

1.1 Information About Cautions and Warnings.........................................................................................................................3

2 3. Features of This EVM......................................................................................................................................................... 4

3 4. TMUX741-746EVM Setup....................................................................................................................................................4

4 5. TMUX741-746EVM Jumper Connections and Test Points.............................................................................................. 5

5 6. Schematics..........................................................................................................................................................................6

6 7. Bill of Materials................................................................................................................................................................... 9

7 8. PCB Layouts......................................................................................................................................................................11

8 Related Documentation........................................................................................................................................................15

List of Figures

Figure 1-1. TMUX741-746EVM Top Side View............................................................................................................................2

Figure 1-2. TMUX741-746EVM Bottom Side View......................................................................................................................3

Figure 5-1. TMUX741-746EVM Schematic without DNP/DNI Markings......................................................................................6

Figure 5-2. TMUX741-746EVM with DNP/DNI Markings............................................................................................................ 7

Figure 5-3. TMUX741-746EVM Mechanical Hardware and Overlays......................................................................................... 8

Figure 7-1. 2D Top Side Layout View.........................................................................................................................................11

Figure 7-2. 2D Bottom View Layout...........................................................................................................................................12

Figure 7-3. 3D Top View of Layout.............................................................................................................................................13

Figure 7-4. 3D Bottom View Of Layout...................................................................................................................................... 14

List of Tables

Trademarks

All trademarks are the property of their respective owners.

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TMUX741xEVM and TMUX746EVM User's Guide 1

1 1. Introduction

This user’s guide describes the TMUX741-746 evaluation module (EVM) and its intended use. This board allows

for the quick prototyping and DC characterization of TI’s TMUX741x/TMUX746x Line of parts in either QFN

(RRP) or TSSOP (PW) packages. Figure 1-1 and Figure 1-2 show the top and bottom sides of the board

respectively.

Figure 1-1. TMUX741-746EVM Top Side View

1. Introduction www.ti.com

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Figure 1-2. TMUX741-746EVM Bottom Side View

1.1 Information About Cautions and Warnings

The information in the warning statement is provided for personal protection and the information in the caution

statement is provided to protect the equipment from damage. Read each caution and warning statement

carefully.

ATTENTION

STATIC SENSITIVE DEVICES

HANDLE ONLY AT

STATIC SAFE WORK STATIONS

This EVM contains components that can ptentially be damaged by electrostatic discharge. Always transport and

store the EVM in its supplied ESD bad when not in suse. Handle using an antistatic wristband. Operate on an

antistatic work surface. For more information on proper handling, see Electrostatic Discharge (ESD).

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TMUX741xEVM and TMUX746EVM User's Guide 3

2 3. Features of This EVM

The EVM has the following features:

• Four power supply decoupling capacitors from VDD to Ground (2 × 3.3 µF, 1 µF, 0.1 µF)

• One additional power supply decoupling capacitor pad from VDD to Ground (0.1 µF)

• One power supply decoupling capacitors from VSS to Ground (2 × 3.3 µF, 1 µF, 0.1 µF)

• One additional power supply decoupling capacitor pad from VDD to Ground (0.1 µF)

• Protection diode pads available near VDD and VSS input.

• 10 µF supply decoupling capacitor to Ground on both VFP and VFN supplies

• Protection diode pads available near VFP and VFN inputs

• Up to four auxiliary pathways available with jumpers

• Up to eight analog I/O pathways available

• All analog I/O pathways have pads available to load device

• All analog I/O pathways have pads available to support SMA connections to device.

• Fault indicator flag LED circuit included on EVM

3 4. TMUX741-746EVM Setup

1. If the default conditions on the board isn’t what you desired please refer to the following table to set up the

Auxiliary pathways which can be either VFP,VFN,SEL,DR, or NC depending on device installed.

Jumper on Pathway Possible Signal Pull Up Resistor

Pad ID

Load Resistor Pad

Load Capacitor Pad

Additional

Capacitor Pad ID

J7 VFN / SEL R4 R17 C17 C10

J5 VFN / SEL N/A N/A N/A N/A

J8 VFP / SEL R6 R18 C18 C9

J6 VFP / SEL N/A N/A N/A N/A

J9 DR / SEL R7 R19 C19 N/A

J10 NC / SEL R8 R20 C20 N/A

2. If VFP and VFN are used in the application, attach a shunt on J5 and J6 to the appropriate VFP/VFN source.

3. Next, use the following table to set up the desired configuration of the analog channels:

Jumper on Pathway Pull Down Resistor

Pad ID

Pull Up Resistor

Pad ID

Load Resistor Pad

Load Capacitor Pad

TVS Diode Pad ID

J11 R33 R21 R34 C21 D6

J12 R35 R22 R36 C22 D7

J13 R37 R23 R38 C23 D8

J14 R39 R24 R40 C24 D9

J15 R53 R41 R54 C25 D10

J16 R55 R42 R56 C26 D11

J17 R57 R43 R58 C27 D12

J18 R59 R44 R60 C28 D13

4. Next, solder down the chosen TMUX74xx in either a PW or QFN package that is to be tested.

5. If using dual supplies, connect shunt from VSS to PAD on J19.

6. If using single supplies, connect shunt from VSS to GND on J4.

7. Next, power the board through J2. Follow the specific device data sheet as to what range the voltage should

be set to.

8. If VFP/VFN pins are used in the application and are using an external source power this through J3.

9. If the fault flag voltage (VFF) is used in the application, connect and power up this source through J1.

3. Features of This EVM www.ti.com

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4 5. TMUX741-746EVM Jumper Connections and Test Points

1. The auxiliary lines on the EVM have 3 prong jumpers attached to them. These are labeled on the board but

are also listed below:

Jumper ID Jumper Pin 1 Jumper Pin 2 Jumper Pin 3 Test Point 1 Test Point 2

J7 VDD VFN/SEL GND TP17 TP18

J8 VDD VFP/SEL GND TP19 TP20

J9 VDD DR/SEL GND TP21 TP22

J10 VDD NC/SEL GND TP23 TP24

2. The analog lines on the have 6 prong jumpers attached to them in a 2 × 3 formation. Only 4 pins have

signals attached to them. For reference this document refers to jumper pins that are closest to the IC as

Interior Jumper Pins and pins that face away from the IC as Exterior Jumper Pins. All interior pins are used,

only the middle exterior pin is used. Please see the table below for connections.

Jumper ID Top Interior Pin Mid. Interior Pin Bottom Interior

Mid. Exterior Pin Test Point 1 Test Point 2

J11 VDD D1 VSS GND TP25 TP26

J12 VDD S1 VSS GND TP27 TP28

J13 VDD S4 VSS GND TP29 TP30

J14 VDD D4 VSS GND TP31 TP32

J15 VDD D2 VSS GND TP33 TP34

J16 VDD S2 VSS GND TP35 TP36

J17 VDD S3 VSS GND TP37 TP38

J18 VDD D3 VSS GND TP39 TP40

3. Finally, the remaining test points and their location on board.

Test Point ID Signal Net Attached to Test Point

TP4 VFN_V

TP3 VFP_V

TP11 GND

TP10 GND

TP7 VSS

TP6 VDD

TP5 VFF

TP12 GND

TP13 GND

TP14 GND

TP2 VSS

TP1 VDD

TP15 GND

TP16 GND

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5 6. Schematics

Figure 5-1 shows the schematic without DNP/DNI markings. Figure 5-2 shows the scheamtic with DNP/DNI markings. Figure 5-3 shows mechanical

hardware and overlays.

Figure 5-1. TMUX741-746EVM Schematic without DNP/DNI Markings

6. Schematics www.ti.com

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Figure 5-2. TMUX741-746EVM with DNP/DNI Markings

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Figure 5-3. TMUX741-746EVM Mechanical Hardware and Overlays

6. Schematics www.ti.com

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6 7. Bill of Materials

Designator Quantity Value Part Number Manufacturer Description Dimensions

C1, C2 2 10 µF C5750X7S2A106

K230KB

TDK CAP, CERM, 10

µF, 100 V, ± 10%,

X7S,

C3, C4, C5, C6 4 3.3 µF CKG57NX7T2E33

5M500JH

TDK CAP, CERM, 3.3

µF, 250 V, ± 20%,

X7T, AEC-Q200

Grade 1, 6 × 5 ×

5mm

6 × 5 × 5 mm

C7, C8 2 1 µF C4532X7T2E105K

250KA

TDK Multilayer Ceramic

Capacitors 1 µF

±10% 250 V X7T

SMD 1812

1812

C11, C13, C15,

C16

4 0.1 µF C3216X7T2W104

K160AE

TDK CAP, CERM, 0.1

µF, 450 V, ± 10%,

X7T, 1206

1206

D5 1 Red HLMP-Q150-

F0011

Avago LED, Red, SMD 2.08 × 2.21 mm

H1, H2, H3, H4 4 SJ-5303 (CLEAR) 3M Bumpon,

Hemisphere, 0.44

× 0.20, Clear

Transparent

Bumpon

J1 1 OSTVN02A150 On-Shore

Technology

Terminal Block,

2.54 mm, 2 × 1,

Brass, TH

Terminal Block,

2.54 mm, 2-pole,

Brass, TH

J2, J3 2 691 101 710 003 Wurth Elektronik Terminal Block, 5

mm, 3 × 1, Tin, TH

Terminal Block, 5

mm, 3 × 1, TH

J4 1 PEC02SAAN Sullins Connector

Solutions

Header, 100 mil, 2

× 1, Tin, TH

Header, 2 PIN,

100 mil, Tin

J5, J6, J7, J8, J9,

J10, J19

7 PBC03SAAN Sullins Connector

Solutions

Header, 100 mil, 3

× 1, Gold, TH

PBC03SAAN

J11, J12, J13, J14,

J15, J16, J17, J18

8 61300621121 Wurth Elektronik Header, 2.54 mm,

3 × 2, Gold, TH

Header, 2.54 mm,

3 × 2, TH

LBL1 1 THT-14-423-10 Brady Thermal Transfer

Printable Labels,

0.650 inch W ×

0.200 inch H -

10,000 per roll

PCB Label 0.650

× 0.200 inch

Q1 1 -8V Si2329DS Vishay-

Semiconductor

MOSFET, P-CH,

-8 V, -5.3 A,

SOT-23

R1 1 176 RT0805BRD0717

6RL

Yageo America RES, 176, 0.1%,

0.125 W, 0805

0805

R2 1 1.02k CRCW08051K02F

KEA

Vishay-Dale RES, 1.02 k, 1%,

0.125 W, AEC-

Q200 Grade 0,

0805

R3, R5, R9, R10,

R11, R12, R13,

R14, R15, R16,

R25, R26, R27,

R28, R29, R30,

R31, R32, R45,

R46, R47, R48,

R49, R50, R51,

R52

26 0 PMR10EZPJ000 Rohm RES, 0, 0%, W,

AEC-Q200 Grade

0, 0805

0805

SH-J1, SH-J2,

SH-J3, SH-J4,

SH-J5

5 881545-2 TE Connectivity Shunt, 100 mil,

Gold plated, Black

Shunt 2 pos. 100

mil

TP1, TP3, TP6 3 5005 Keystone Test Point,

Compact, Red, TH

Red Compact

Testpoint

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TMUX741xEVM and TMUX746EVM User's Guide 9

Designator Quantity Value Part Number Manufacturer Description Dimensions

TP2, TP4, TP7 3 5126 Keystone Test Point,

Multipurpose,

Green, TH

Green

Multipurpose

Testpoint

TP5 1 5003 Keystone Test Point,

Miniature, Orange,

Orange Miniature

Testpoint

TP10, TP11,

TP12, TP13,

TP14, TP15, TP16

7 5011 Keystone Test Point,

Multipurpose,

Black, TH

Black

Multipurpose

Testpoint

TP17, TP18,

TP19, TP20,

TP21, TP22,

TP23, TP24,

TP25, TP26,

TP27, TP28,

TP29, TP30,

TP31, TP32,

TP33, TP34,

TP35, TP36,

TP37, TP38,

TP39, TP40

24 5122 Keystone Test Point,

Compact, Blue,

Blue Compact

Testpoint

7. Bill of Materials www.ti.com

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