Texas Instruments LOG200EVM Manual de usuario

EVM User's Guide: LOG200EVM LOG200

LOG200 Evaluation Module

Description

The LOG200 evaluation module (EVM) is a

development platform for evaluating the LOG200,

which is a precision, high-speed logarithmic amplifier

with integrated photodiode bias and dark current

correction. The LOG200 is optimized for current

measurements across 160 dB wide dynamic range,

over several decades with unparalleled speed and

accuracy.

Features

• High-accuracy logarithmic transfer function

• Logarithmic ratio internally set to 250 mV/decade

of current-to-voltage conversion

• Footprint for photosensor connection

• Integrated photodiode bias and dark current

correction adaptive biasing circuit

• Integrated precision 1 µA current reference

• Integrated precision 1.65 V and 2.5 V voltage

references

• Single supply (+5 V) or dual supply (±5 V)

operation

• Sub-miniature version A (SMA) connectors and

test points allow for quick tests

Applications

•Optical modules

•Inter_DC interconnect

•Optical network terminal unit

•Chemistry/gas analyzer

LOG200EVM Hardware Board

www.ti.com Description

SBOU301 – JULY 2023

Submit Document Feedback

LOG200 Evaluation Module 1

1 Evaluation Module Overview

1.1 Introduction

The LOG200EVM is the evaluation module (EVM) for the LOG200 precision, high-speed logarithmic amplifier.

The device features two logarithmic amplifiers followed by a high-accuracy differential amplifier to convert

current signals into a single-ended voltage that represents the log-compressed ratio of the two currents. The log

amplifier ratio is internally set to 250 mV/decade of current-to-voltage conversion.

The LOG200 device integrates an uncommitted high-speed amplifier to allow the output to be configured for

differential or filtered responses.

The LOG200EVM operates over a 4.5 V to 12 V range unipolar supply or dual supply of ±2.25V to ±6 V supply.

See Table 2-2 for details. SMA and Test points provide convenient access to all critical functions of the LOG200.

For a full schematic of the LOG200EVM, see Figure 3-1.

1.2 Kit Contents

Table 1-1. LOG200EVM Kit Contents

Item Description Quantity

LOG200EVM PCB 1

1.3 Specification

The LOG200EVM offers the following features:

• The evaluation board enables users to connect the LOG200 to current sources through SMA connections via

series resistors.

• The PCB includes a footprint to mount an optional photodiode to the INUM input for optical power

measurement applications. The photosensor can be biased externally through a test point, or through the

use of the LOG200 IBIAS adaptive biasing current output function by modifying the EVM.

• Allows access to the integrated precision 1 µA current reference

• Allows the use of the Integrated precision 1.65 V and 2.5 V voltage references in different circuit

configurations

• The LOG200EVM provides access to the inputs and output of the secondary op-amp. The PCB provides

optional passive component footprints to support different op-amp or filter configurations.

1.4 Device Information

The EVM is built with the LOG200IRGT device in the 16-pin QFN package with the thermal pad.

Evaluation Module Overview www.ti.com

2LOG200 Evaluation Module SBOU301 – JULY 2023

Submit Document Feedback

2 Hardware

2.1 Read this first: EVM Cleaning Guidelines

Logarithmic amplifier applications requiring picoampere range performance are very sensitive to PCB board

contamination. Contaminants in the form of solder flux, oils and other impurities can form conductive paths

over the sensitive PCB traces that allow small currents to leak from the input traces or other sensitive nodes,

degrading performance. For best performance, make sure to keep the LOG200EVM as clean as possible. The

following list shows best practices to clean the evaluation board and to help prevent the EVM from becoming

contaminated:

• Leakage currents from solder flux contamination can disturb the logarithmic amplifier's operation, specially at

lower current levels. The LOG200EVM undergoes a standard cleaning protocol after the fabrication, soldering

and assembly process prior shipping to customers, providing picoampere level performance. The EVM must

be re-cleaned anytime devices are soldered into the PCB or modified near the logarithmic amplifier sensitive

nodes, if the LOG200 U1 device is replaced, or if these input sensitive connections become contaminated by

other means.

• The recommended cleaning procedure requires access to an ultrasonic deionized (DI) water bath:

– Place the EVM in the ultrasonic cleaner and fill with fresh deionized (DI) water.

– Run the ultrasonic cleaner for 20 minutes at 45°C.

– Remove all moisture from PCB.

• If an ultrasonic bath is not available, then a manual cleaning procedure is possible:

– Scrub contaminants from the top layer I1 and I2 inputs at top layer.

– Use a toothbrush to gently scrub for 60 seconds. Focus on areas surrounding U1 I1, I2, VCM, and IREF

inputs, R9, R13, R16, R17, R35, D1, input SMA connectors J4 and J6 and guard traces.

– Scrub contaminants from the bottom layer around the diode D1 photosensor footprint and input SMA

connectors J4 and J6.

– Flush the scrubbed areas with fresh DI water, tilting the board to allow runoff to flow away from the input

areas.

– Remove all moisture from PCB.

• When handling the EVM, always hold the board by the edges.

• When not in use, place the EVM in ESD bag or other enclosure to prevent dust and other contaminants from

settling on the board.

www.ti.com Hardware

SBOU301 – JULY 2023

Submit Document Feedback

LOG200 Evaluation Module 3

2.2 Input and Output Connections

The current input signals for the logarithmic numerator, I1, and logarithmic denominator, I2, are provided through

SMA connectors J4 and J6. These inputs are located at the left of the EVM. The input connections of the log

amplifier have a series 10 kΩ resistors, R9 and R10. The logarithmic output connection is provided through SMA

J5 and test point TP4 at the right side of the EVM.

The secondary op-amp inputs are accessible through SMA J14 and the output amplifier connection is provided

through SMA connector J14, and test point TP16, located at the right side of the EVM. For a full schematic of the

LOG200EVM, see Figure 3-1 and Figure 3-2.

Table 2-1 summarizes the input and output connectors and corresponding test points.

Table 2-1. LOG200EVM Input and Output Connections

Designator Signal Connector Type Description

J4 I1_IN SMA Current input for logarithm numerator

J6 I1_IN SMA Current input for logarithm denominator

J5 OUT_A SMA Logarithm function voltage output

J13 IN_AMP_B SMA Secondary op-amp voltage non-inverting

and inverting input

J14 OUT_B SMA Secondary op-amp voltage output

J16 REF_GND Banana plug Optional ext voltage reference negative

J10 Ext_RefA Banana plug Optional ext Logarithm function voltage

output reference

J12 GND Banana plug EVM PCB ground

TP1 DBIAS Test point Optional ext Photodiode Vbias Cathode

TP4 OUT_A Test point Logarithm function voltage output

TP16 OUT_B Test point Secondary op-amp voltage output

TP11 VCM Test point Input common-mode voltage

TP14 REF1 Test point REF25: 2.5V reference output

TP15 REF2 Test point REF165: 1.65V reference output

TP18 REF_GND Test point Voltage reference negative

TP2, TP3,

TP8, TP12,

TP17

GND Test point EVM PCB ground

Hardware www.ti.com

4LOG200 Evaluation Module SBOU301 – JULY 2023

Submit Document Feedback

2.3 Power Requirements

The power-supply connections for the LOG200EVM are provided through standard banana jack connectors J1,

J2, and J3 at the top of the EVM. The LOG200EVM can be set up with a single unipolar supply or with dual

bipolar supplies by setting jumper J9. Table 2-2 summarizes the pin definition for supply connector J1, J2, and

J3 and the allowed voltage range for each supply connection when configured with either unipolar or bipolar

supplies.

Table 2-2. LOG200EVM Supply-Range Specifications

Connector

Number

Supply Connection Voltage Range

J1 (V+) supply Unipolar: +4.5 V to +12 V

Bipolar: +2.25 V to +6 V

J2 Ground 0 V

J3 (V-) Supply Unipolar: Do not Connect

Bipolar: –2.25 V to –6 V

The EVM is configured by default using bipolar supply by opening jumper J9. To configure the device with

unipolar supply, set jumper J9 to shunt pin 1–2.

Figure 2-1 shows the J1, J2, and J3 standard banana supply connectors, and jumper J9 configuration.

GND

VS+

10µF

C6 C5

TP5

VS+

12V

VS+

12V

GND

12V

LOG200

–

BIAS

–

1µA

2.5V 1.65V

VS+

100 nF

C11

100 nF

VS–

100 nF

VCM

IBIAS

IN– IN+

VS+

OUTB

OUTA

REFA

IREF REF25 REFGND REF165

TP6

VS–

10.0



10.0



10µF

VS–

PAD

Thermal Pad

Connected to

VCM

VS–

Power-Supply

Connector

Jumper J9

Shunt 1-2 for Unipolar Supply

Open 1-2 for Bipolar Supply

VS–

Shunt

GND

TP9

Figure 2-1. LOG200EVM Voltage Supply Connections

www.ti.com Hardware

SBOU301 – JULY 2023

Submit Document Feedback

LOG200 Evaluation Module 5

2.4 Jumper Information

Figure 2-2 details the default jumper settings of the LOG200EVM. Table 2-3 explains the configuration for these

jumpers.

Figure 2-2. LOG200EVM Default Jumper Settings

Table 2-3. Default Jumper Configuration

Jumper Function Default Position Description

J7 Out_A

SMA J5 reference Shunt 2-3 Shunt 2-3: SMA connector J3 referred to GND

Shunt 1-2: SMA connector J3 referred to REFA

J8 VCM

Select Shunt 1-2 Shunt 1-2: VCM input connected to GND

Shunt 3-4: Connects VCM input to 2.5V reference

J9 VS– connection Open

Open: Bipolar supply configuration

Shunt 1-2: Connects VS– to GND for unipolar supply

configuration

J11 REF A Select Shunt 7-8

Shunt 1-2: Sets log voltage REFA to external voltage through J10

Shunt 3-4: Sets REFA to REF25

Shunt 5-6: Sets REFA to REF165

Shunt 7-8: Sets REFA to GND

J15 Secondary

op-amp input Shunt 1-2 Shunt 1-2: Connects Aux AMP+IN to OUTA

Shunt 3-4: Connects Aux AMP -IN to OUTA

Hardware www.ti.com

6LOG200 Evaluation Module SBOU301 – JULY 2023

Submit Document Feedback

2.5 Optional Photodiode Connections

The LOG200EVM PCB board layout includes a photosensor footprint (D1) to install a radial photodiode on

current input I1 for the logarithmic numerator. See Figure 2-3 for the photosensor input and photosensor biasing

connections.

The photodiode IBIAS adaptive biasing current output is accessible through optional jumper resistor R2. The

adaptive current output biasing scheme creates a voltage to bias a photodiode with a current that is proportional

to the photocurrent. This allows small bias voltages for low photodiode currents, reducing the dark current of

the photodiode, and higher reverse-bias voltages as the photocurrent increases, reducing the capacitance of the

photodiode.

The IBIAS function produces a current that is approximately 1.1x larger than the numerator current I1. Since

the photosensor produces the input numerator current, the remaining 0.1*I1 current flows through the RBIAS

resistor R3. The RBIAS resistor R3 needs to be scaled depending on the photosensor biasing requirements, the

photosensor current range and the LOG200 supply voltage. The voltage at the IBIAS pin must not exceed (V+)

- 1 V at the photosensor maximum current. If the IBIAS function is not used, then leave the IBIAS pin floating by

removing resistor jumper R2.

Alternatively, the photosensor cathode can be reverse biased via test point TP1, DBIAS. Verify the resistor R2 is

removed when biasing the photosensor through TP1.

Capacitors C1 and C3 can help providing dynamic currents during fast transients and help to improve stability.

The value for best bias response depends on the photosensor and application requirements.

Figure 2-3 presents a simplified diagram of the photodiode connections. For a detailed schematic of the

photosensor connections, see Figure 3-1.

LOG200

–

PD BIAS

1.1x I1

–

1µA

2.5V 1.65V

VCM

IBIAS

IN– IN+

OUTB

OUTA

REFA

IREF

REF25 REFGND REF165

SMA

Connector

I2_IN

VCM2

R16



R2 0



RBIAS

GND

Photodiode

Guard

R1 TP1

DBIAS

Guard

GND

1000 pF

PAD / VCM

REF25

GND

Jumper J8

Shunt 1-2 VCM to GND

Shunt 3-4 VCM to 2.5V reference

Shunt

Figure 2-3. LOG200EVM Photodiode Connections

www.ti.com Hardware

SBOU301 – JULY 2023

Submit Document Feedback

LOG200 Evaluation Module 7

3 Hardware Design Files

3.1 Schematics

Figure 3-1 and Figure 3-2 show the EVM schematics.

Pin1_I1

Pin2_Vcm

Pin3_I2

Pin4_Iref

Pin15_IBias

Pin16_Vcm2

Current Reference

Pin10_RefA

Pin11_OUTA

Vcm

GND

I1_IN

I2_IN

GND

GND Vcm

Vcm

GND GND

VCM

VCM2

REF25

REF165

VS+

VS- 7

IN+

IN-

IBIAS

IREF

OUTA 11

OUTB 12

REFA

Thermal_Pad

REFGND 6

LOG200RGT

Pin1_I1

Pin2_Vcm

Pin3_I2

Pin4_Iref

Pin5_Ref25

Pin6_RefGND

VS-

VS+

Pin9_Ref165

Pin10_RefA

Pin11_OUTA

Pin12_OUTB

Pin13_-IN

Pin14_+IN

Pin15_IBias

Pin16_Vcm2

Pin17_Pad

GND

TP8

GND

TP12

GND

TP4

OUT_A1

100

TP10

REFA1

TP3

GND

R14

R10

I2_IN

I1_IN 1

OUT_A1

TP1

DBias

GND

Vcm

R11

Vcm

R15

OUTA

100V

100pF

1 2

TP2

GND

Vcm

GND

1000pF

50V

Pin2_Vcm

C3C1

1000pF

50V

1 2

3 4

Vcm_Sel1

TP11

Vcm

Pin5_Ref25

249

R31

R32

GND

R12

C18

GND

R35

C10

OutA_Ref_conn

GND

10.0k

R13

R16

R17

Pin10_RefA Pin5_Ref25

Pin9_Ref165

Ext_RefA

J10

Ext_RefA1

TP14

Ref1

TP15

Ref2

1 2

3 4

5 6

7 8

J11

REFA_Sel

GND

REFA Diff Amp Select

LOG200

DNP

DNP DNP DNP

DNP

Note: DNP components are not populated.

Figure 3-1. LOG200EVM Schematic

Hardware Design Files www.ti.com

8LOG200 Evaluation Module SBOU301 – JULY 2023

Submit Document Feedback

GND

VS-

VS-_to_GND

Power Supplies

Pin17_Pad

Vcm

Voltage Reference Bypass Cap

Pin6_RefGND

GND

Pin9_Ref165

Pin5_Ref25

GND

Pin12_OUTB

Pin13_-IN

Pin14_+IN AMP_B

GND

AMPB_IN+

AMPB_IN-OUTA

LOG200 Operational Amplifier B

GND

VS-

GND

VS+

GNDVS+ VS-

TP5

VS+

VS+VS+

TP6

VS-

GND

VS+

VS-

TP9

GND

VS-GND

VS-

10.0

10uF

GND

10uF

GND

100nF

50V

100nF

50V

100nF

50V

C11

12V

R19

R26

TP17

GND

TP16

OUT_B1

R28

100

R25

R24

J12

GND

20pF

C13

R23

R30

J16

Ref_GND1

TP18

Ref_GND1

J13

IN_AMP_B1

J14

OUT_B1

1 2

3 4

J15

INB_SEL1

1.00k

R21

1.00k

R20

1.00k

R27

R29

20pF

C16

AMPB_IN+

AMPB_IN-

100V

100pF

C15

100V

330pF

C12

100V

330pF

C14

R18

R22

R33

Pin9_Ref165

C17

1.00k

R34

DNP

Note: DNP components are not populated.

Figure 3-2. LOG200EVM Schematic

www.ti.com Hardware Design Files

SBOU301 – JULY 2023

Submit Document Feedback

LOG200 Evaluation Module 9

3.2 PCB Layout

The LOG200EVM is a four-layer PCB design. Figure 3-3 to Figure 3-7 show the PCB layer illustrations.

The top layer routes the sensitive input current signal path traces. The logarithmic amplifier is optimized to

perform current measurements across several decades. At the low current level ranges, leakage current can

cause significant errors. To minimize leakage current paths, a complete guard ring is implemented with traces

that encircle the complete signal path of each high-impedance current input of the log amplifier. The guard

presents a low-impedance path for leakage currents of equal potential to the high-impedance traces that are

being guarded. The guard traces are driven to the input common-mode voltage (VCM); therefore, the current

flowing between the input current traces and the guard is negligible because both traces are similarly at the

same potential.

The LOG200EVM provides a footprint to connect a photodiode to the I1 input pin. The photosensor is kept in

close proximity to the I1 input to minimize parasitic capacitance. The evaluation board provides all the necessary

photosensor and adaptive bias circuit connections through resistor R2, R3 and optional capacitors C1, C3. For a

detailed explanation, refer to the photodiode connections section of the User Guide.

Decoupling capacitors C7, C8 and C11 are positioned on the top layer as close as possible to the power-supply

pins of the device. Similarly, reference bypass capacitor C12 and C14 are located in close proximity to the

reference pins.

The second internal layer is a dedicated to the power supplies connections and contains a common-mode

(VCM) plane. The third internal layer and bottom layers contain a ground plane and route additional auxiliary

amplifier/reference signals.

Figure 3-3. Top Overlay PCB Layout

Hardware Design Files www.ti.com

10 LOG200 Evaluation Module SBOU301 – JULY 2023

Submit Document Feedback

Otros manuales de Placa madre de Texas Instruments

Texas Instruments

Texas Instruments WL1837MODCOM8I Manual de usuario

Texas Instruments

Texas Instruments ADS1147EVM Manual de usuario

Texas Instruments

Texas Instruments TPS40100 Manual de usuario

Texas Instruments

Texas Instruments TPSM33625EVM Manual de usuario

Texas Instruments

Texas Instruments TPS54225 Manual de usuario

Texas Instruments

Texas Instruments LMK04808B Manual de usuario

Texas Instruments

Texas Instruments TDC7201-ZAX-EVM Manual de usuario

Texas Instruments

Texas Instruments LMR10530 Manual de usuario

Texas Instruments

Texas Instruments SWIFT TPS54350EVM-235 Manual de usuario

Texas Instruments

Texas Instruments ISO5500EVM Manual de usuario

Texas Instruments

Texas Instruments ADS7861 EVM Manual de usuario

Texas Instruments

Texas Instruments Tiva TM4C1294 Manual de usuario

Texas Instruments

Texas Instruments AN-1993 LM3406HV Manual de usuario

Texas Instruments

Texas Instruments TPS54KC23EVM Manual de usuario

Texas Instruments

Texas Instruments ADS9110EVM-PDK Manual de usuario

Texas Instruments

Texas Instruments LP8860-Q1EVM Manual de usuario

Texas Instruments

Texas Instruments TPS61050EVM-215 Manual de usuario

Texas Instruments

Texas Instruments TPS543320EVM Manual de usuario

Texas Instruments

Texas Instruments LP2951EVM Manual de usuario

Texas Instruments

Texas Instruments TMS320C6745 DSP Manual de usuario

Texas Instruments

Texas Instruments TAS5518 Manual de usuario

Texas Instruments

Texas Instruments TVP9900EVM Manual de usuario

Texas Instruments

Texas Instruments ADS794xEVM Manual de usuario

Texas Instruments

Texas Instruments TMAG5123EVM Manual de usuario

Manuales populares de Placa madre de otras marcas

DFI

DFI SD170 Manual de usuario

ASROCK

ASROCK ROMED8-2T Manual de usuario

Asus

Asus P2L97A Manual de usuario

Winmate

Winmate IC70 Manual de usuario

Asus

Asus MES-B Manual de usuario

Grantech

Grantech SYS8F377VGGA-3OMN Manual de usuario

Telit Wireless Solutions

Telit Wireless Solutions SL869-3DR Manual de usuario

Gigabyte

Gigabyte GA-9IVDT Manual de usuario

Commell

Commell MS-C73 Manual de usuario

IBT Technologies

IBT Technologies MB860 Manual de usuario

Nvidia

Nvidia TEGRA DG-04927-001_V01 Manual de usuario

Biostar

Biostar M7VIT Bravo Instrucciones de funcionamiento e instalación

Intel

Intel D33217CK Manual de usuario

Asus

Asus F1A55-M LX PLUS R2.0 Manual de usuario

EPC

EPC EPC9147C Manual de usuario

Asus

Asus EX-B760M-V5 D4 Manual de usuario

EPOX

EPOX MU-8KHA0010 Manual de usuario

Ski-Doo

Ski-Doo Bombardier MPEM 219 700 090 Manual de usuario