Texas Instruments DSP-Codec Manual de usuario

DSP−Codec Development

Platform

September 2002 Data Acquisition Products

User’s Guide

SLAU090

IMPORTANT NOTICE

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EVM IMPORTANT NOTICE

Texas Instruments (TI) provides the enclosed product(s) under the following conditions:

This evaluation kit being sold by TI is intended for use for ENGINEERING DEVELOPMENT OR EVALUATION

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As a prototype, this product does not fall within the scope of the European Union directive on electromagnetic

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Should this evaluation kit not meet the specifications indicated in the EVM User’s Guide, the kit may be returned

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TI assumes no liability for applications assistance, customer product design, software performance, or

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Please read the EVM User’s Guide and, specifically, the EVM Warnings and Restrictions notice in the EVM

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Mailing Address:

Texas Instruments

Post Office Box 655303

Dallas, Texas 75265

EVM WARNINGS AND RESTRICTIONS

It is important to operate this EVM within the input voltage range of 3.3 V described in the EVM

User’s Guide.

Exceeding the specified input range may cause unexpected operation and/or irreversible

damage to the EVM. If there are questions concerning the input range, please contact a TI

field representative prior to connecting the input power.

Applying loads outside of the specified output range may result in unintended operation and/or

possible permanent damage to the EVM. Please consult the EVM User’s Guide prior to

connecting any load to the EVM output. If there is uncertainty as to the load specification,

please contact a TI field representative.

During normal operation, some circuit components may have case temperatures greater than

60°C. The EVM is designed to operate properly with certain components above 60°C as long

as the input and output ranges are maintained. These components include but are not limited

to linear regulators, switching transistors, pass transistors, and current sense resistors. These

types of devices can be identified using the EVM schematic located in the EVM User’s Guide.

When placing measurement probes near these devices during operation, please be aware

that these devices may be very warm to the touch.

Mailing Address:

Texas Instruments

Post Office Box 655303

Dallas, Texas 75265

Related Documentation From Texas Instruments

Preface

Read This First

About This Manual

This user’s guide describes the operation and use of the DSP-codec

development platform. A complete circuit description as well as schematic

diagram and bill of materials are also included.

How to Use This Manual

This document contains the following chapters:

-Chapter 1 –Introduction and EVM Overview

-Chapter 2 –Digital Interface

-Chapter 3 –Support Functions

-Chapter 4 –EVM Bill of Materials and Schematic

Related Documentation From Texas Instruments

To obtain a copy of any of the following TI documents, call the Texas

Instruments literature response center at (800) 477-8924 or the product

information center (PIC) at (972) 644-5580. When ordering, please identify

this booklet by its title and literature number. Updated documents can also be

obtained through the TI website at www.ti.com.

Data Sheets: Literature Number:

SN74LVC1G08DBVR SCES217J

SN74LVC74ADR SCAS287M

TPS70151PWP SLVS222A

Contents

FCC Warning

This equipment is intended for use in a laboratory test environment only. It

generates, uses, and can radiate radio frequency energy and has not been

tested for compliance with the limits of computing devices pursuant to subpart

J of part 15 of FCC rules, which are designed to provide reasonable protection

against radio frequency interference. Operation of this equipment in other

environments may cause interference with radio communications, in which

case the user at his own expense will be required to take whatever measures

may be required to correct this interference.

Contents

vii

Contents

1 Introduction and EVM Overview 1-1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1.1 Features 1-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1.2 Introduction 1-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

2 Digital Interface 2-1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

2.1 Introduciton 2-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

2.2 DSP-to-Platform 2-3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

2.3 Platform-to-Codec 2-3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3 Support Functions 3-1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3.1 Introduction 3-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3.1.1 MCLK Generation 3-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3.1.2 Reset Generation 3-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3.1.3 Power Options 3-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3.2 Key Signal Synchronization 3-3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

4 EVM Bill of Materials and Schematic 4-1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

4.1 EVM Bill of Materials 4-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

4.2 EVM Schematic 4-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Figures

2-1 DSP-Codec Development Platform 2-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Tables

2-1 J2 Connector Pinouts 2-3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3-1 Jumper W2 Function 3-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3-2 Jumper W1 Function 3-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Contents

viii

1-1

Introduction and EVM Overview

This chapter provides a brief overview of the DSP-codec development plat-

form.

Topic Page

1.1 Features 1-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1.2 Introduction 1-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Chapter 1

Features

1-2

1.1 Features

-Provides all necessary voltages for device under test

-Provides bit clock for codecs

-Flexible interface to popular TI DSPs

-General codec requirements are addressed

1.2 Introduction

The DSP-codec development platform provides all the supplementary control

signals necessary to interface a range of TI codecs to TI DSP starter kits

(DSKs).

The platform supports the following devices

-TLV320AIC1103

-TLV320AIC1106

-TLV320AIC1107

-TLV320AIC1109

-TLV320AIC1110

-TLV320AIC12

-TLV320AIC13

-TLV320AIC14

-TLV320AIC15

-TLV320AIC20

-TLV320AIC21

-TLV320AIC22

-TLV320AIC24

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