Texas Instruments MUX36D04EVM-PDK Manual de usuario

SBAU255A–January 2016–Revised March 2016

MUX36D04EVM-PDK

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User's Guide

SBAU255A–January 2016–Revised March 2016

MUX36D04EVM-PDK

This user guide describes the characteristics, operation, and use of the MUX36D04 evaluation module

(EVM) performance demonstration kit (PDK). This kit is an evaluation platform for MUX36D04, an analog

multiplexer (mux) that offers 4:1 differential or 8:2 single-ended channels. This user guide includes setup

and operating instructions, complete circuit descriptions, schematic diagrams, printed circuit board (PCB)

layout, and a bill of materials (BOM).

NOTE: The MUX36D04EVM may also be used to evaluate the performance of the MUX509 as the

two parts are pin compatible. The MUX509 would have to be separately ordered and

manually soldered on the MUX36D04EVM.

Throughout this document, the terms MUX36D04EVM, demonstration kit, evaluation board, evaluation

module, and EVM are synonymous with the MUX36D04EVM-PDK.

The following related documents are available through the Texas Instruments web site at www.ti.com.

Related Documentation

Device Literature Number

MUX36D04 SBOS705

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MUX36D04EVM-PDK

Contents

1 Overview...................................................................................................................... 3

1.1 MUX36D04EVM-PDK Features................................................................................... 3

2 EVM Setup.................................................................................................................... 4

2.1 Powering Up the EVM.............................................................................................. 4

2.2 Digital Signal Connections......................................................................................... 5

2.3 Analog Signal Connections........................................................................................ 5

3 Evaluation Using the MUX36D04EVM-PDK ............................................................................. 6

3.1 Channel Selection Logic........................................................................................... 6

3.2 Key Specifications .................................................................................................. 6

4 Bill of Materials, PCB Layout, and Schematics.......................................................................... 7

4.1 Bill of Materials...................................................................................................... 7

4.2 PCB Layout.......................................................................................................... 8

4.3 Schematic............................................................................................................ 9

List of Figures

1 Power Connections for Single Supply (Left) and Dual Supply (Right) Operation ................................... 4

2 PCB Layer 1: Top Layer.................................................................................................... 8

3 PCB Layer 2: GND Plane................................................................................................... 8

4 Schematic: Electrical ........................................................................................................ 9

5 Schematic: Mechanical ..................................................................................................... 9

List of Tables

1 J1 and J13 Header Description............................................................................................ 4

2 Digital Signal Locations ..................................................................................................... 5

3 Analog Signal Locations .................................................................................................... 5

4 Channel Selection Truth Table............................................................................................. 6

5 Bill of Materials .............................................................................................................. 7

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Overview

SBAU255A–January 2016–Revised March 2016

MUX36D04EVM-PDK

1 Overview

The MUX36D04 is a CMOS analog multiplexer that offers 4:1 differential or 8:2 single-ended channels,

operates with either dual supplies (±5 V to ±18 V) or a single supply (10 V to 36 V), and supports true rail-

to-rail input and output. The MUX36D04 has very low on- and off-leakage currents and low quiescent

current that make it ideally suited for portable applications.

1.1 MUX36D04EVM-PDK Features

The MUX36D04EVM-PDK includes the following features:

• Hardware required for evaluation of the with industry-standard TSSOP package MUX36D04.

• Multiple connectors on input and output pins for ease of evaluation.

• Layout as per the reference layout in data sheet.

• In addition to basic switching operations, the EVM can be used to test the crosstalk and off-isolation,

as per the data sheet.

PSU PSU

VDD

J18

VSS

VDD

GND

J18

GND GNDVDD VSS

VSS

VDD

GND

1 2 3 1 2 3

EVM Setup

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2 EVM Setup

This section describes the power supply and jumper configuration options available on the

MUX36D04EVM-PDK.

2.1 Powering Up the EVM

The MUX36D04 can operate with either dual supplies (±5 V to ±18 V) or a single supply (10 V to 36 V). It

can operate with both symmetric supplies (such as VDD = 12 V, VSS = –12 V), and unsymmetric supplies

(such as VDD = 12 V, VSS = –5 V).

The MUX36D04EVM-PDK provides connections for the power supply pins with either a single or dual

power supply, from a minimum VDD – VSS range of 10 V to maximum of 36 V. The VDD supply must be

connected at pin 1 and VSS at pin 2 of J18 from a tabletop power-supply unit (PSU) as shown in Figure 1.

For single-supply operation, connect VSS to GND through a wire-bridge between pin 2 and pin 3 of J18.

VDD and VSS can be monitored using TP10 and TP22, respectively.

Figure 1. Power Connections for Single Supply (Left) and Dual Supply (Right) Operation

Jumpers J1 and J13 are provided to enable monitoring of the currents drawn from each of these supplies

by the MUX36D04 using ammeters. In case ammeters are not used, headers J1 and J13 must be shorted

using shunts for normal operation, as listed in Table 1. The EVM ships with these shunts inserted.

Table 1. J1 and J13 Header Description

Signal Location Description

VDD J1 pin 1 to pin 2 Positive power supply for the MUX36D04

VSS J13 pin 1 to pin 2 Negative power supply for the MUX36D04

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EVM Setup

SBAU255A–January 2016–Revised March 2016

MUX36D04EVM-PDK

2.2 Digital Signal Connections

The digital signals of the MUX36D04 are brought out to headers. Each of these signals can be connected

to VDD or VSS by using shunts as listed on Table 2.

Table 2. Digital Signal Locations

Signal Location Description

EN J3 pin 2 Active high digital input. When this pin is low, all switches are turned off.

When this pin is high, the A[2:0] inputs determine which switch is turned on.

A0 J4 pin 2 Address line A0

A1 J5 pin 2 Address line A1

Alternatively, these signals may be driven directly from a processor by removing the shunts, and wiring the

processor general-purpose I/Os to pin 2 of J3, J4, and J5 jumpers.

2.3 Analog Signal Connections

The analog signals of MUX36D04 are accessible at multiple locations on the MUX36D04EVM-PDK.

Table 3 lists all the locations. These signals may be used as input or output signals because the device

acts as a switch between the input and output terminals.

Table 3. Analog Signal Locations

Signal Header SMA Testpoint Description

S1A J16 pin4 J2 TP12 Source terminal 1A

S2A J16 pin3 J6 TP14 Source terminal 2A

S3A J16 pin2 J8 TP18 Source terminal 3A

S4A J16 pin1 J10 TP20 Source terminal 4A

S1B J16 pin7 J11 TP21 Source terminal 1B

S2B J16 pin8 J12 TP24 Source terminal 2B

S3B J16 pin9 J14 TP25 Source terminal 3B

S4B J16 pin10 J15 TP26 Source terminal 4B

DA NA J7 TP17 Drain terminal A

DB NA J9 TP19 Drain terminal B

Evaluation Using the MUX36D04EVM-PDK

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MUX36D04EVM-PDK

3 Evaluation Using the MUX36D04EVM-PDK

All parameters listed in the specifications table of the MUX36D04 data sheet can be tested on the

MUX36D04EVM-PDK.

3.1 Channel Selection Logic

Table 4 provides the truth table for the selection logic for the MUX36D04. This behavior of the device can

be evaluated by driving the digital selection signal listed in Section 2.2 to the appropriate levels.

(1) X denotes don't care..

Table 4. Channel Selection Truth Table

EN A1 A0 On channel

0 X(1) X(1) All channels are off

1 0 0 Channel 1

1 0 1 Channel 2

1 1 0 Channel 3

1 1 1 Channel 4

3.2 Key Specifications

The MUX36D04 datasheet contains detailed information of the test setups for each of the mux

parameters. The MUX36D04EVM-PDK can be used to validate these parameters as per the test

procedures described in the data sheet.

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Bill of Materials, PCB Layout, and Schematics

SBAU255A–January 2016–Revised March 2016

MUX36D04EVM-PDK

4 Bill of Materials, PCB Layout, and Schematics

This section contains the MUX36D04EVM-PDK bill of materials (BOM),PCB layout, and EVM schematics.

4.1 Bill of Materials

Table 5 lists the MUX36D04EVM-PDK BOM.

Table 5. Bill of Materials

Manufacturer Part Number Qty Reference Designators Manufacturer Description

PA020 1 PCB1 Any Printed Circuit Board

C3216X5R1E476M160AC 2 C1, C4 TDK CAP, CERM, 47 µF, 25 V, +/- 20%, X5R, 1206

GMK316AB7106KL 2 C2, C5 Taiyo Yuden CAP, CERM, 10 µF, 35 V, +/- 10%, X7R, 1206

C3216X7R1H105K 2 C3, C6 TDK CAP, CERM, 1 µF, 50 V, +/- 10%, X7R, 1206

GRM188R72A104KA35D 2 C7, C10 MuRata CAP, CERM, 0.1 µF, 100 V, +/- 10%, X7R, 0603

C1608C0G2A101J 2 C8, C9 TDK CAP, CERM, 100 pF, 100 V, +/- 5%, C0G/NP0, 0603

N/A 3 FID1, FID2, FID3 N/A Fiducial mark. There is nothing to buy or mount.

SJ-5303 (CLEAR) 4 H1, H2, H3, H4 3M Bumpon, Hemisphere, 0.44 X 0.20, Clear

TSM-102-01-L-SV 2 J1, J13 Samtec Header, 100mil, 2x1, Gold with Tin Tail, SMT

5-1814832-1 10 J2, J6, J7, J8, J9, J10, J11,

J12, J14, J15 TE Connectivity SMA Straight PCB Socket Die Cast, 50 Ohm, TH

TSM-103-01-L-SV 3 J3, J4, J5 Samtec Header, 100mil, 3x1, Gold, SMT

OSTTE100161 1 J16 On-Shore Technology Terminal Block, 3.5mm, 10x1, Tin, Blue, TH

39357-0003 1 J18 Molex Terminal Block, 3.5 mm, 3x1, Tin, TH

THT-14-423-10 1 LBL1 Brady Thermal Transfer Printable Labels, 0.650" W x 0.200" H - 10,000 per roll

ERJ-6GEY0R00V 8 R1, R2, R3, R4, R5, R6, R7,

R8 Panasonic RES, 0, 5%, 0.125 W, 0805

969102-0000-DA 5 SH-J1, SH-J3, SH-J4, SH-J5,

SH-J13 3M Shunt, 100mil, Gold plated, Black

5005 3 TP1, TP10, TP11 Keystone Test Point, Compact, Red, TH

5006 7 TP2, TP3, TP4, TP5, TP6,

TP7, TP8 Keystone Test Point, Compact, Black, TH

5008 3 TP9, TP21, TP22 Keystone Test Point, Compact, Orange, TH

5122 8 TP12, TP14, TP18, TP20,

TP23, TP24, TP25, TP26 Keystone Test Point, Compact, Blue, TH

5009 3 TP13, TP15, TP16 Keystone Test Point, Compact, Yellow, TH

5007 2 TP17, TP19 Keystone Test Point, Compact, White, TH

MUX36D04IPWR 1 U1 Texas Instruments Fault-Protected, 8-Channel, Single-Ended and 4-Channel, Differential Multiplexer, PW0016A

Bill of Materials, PCB Layout, and Schematics

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4.2 PCB Layout

Figure 2 and Figure 3 illustrate the EVM PCB layout.

Figure 2. PCB Layer 1: Top Layer

Figure 3. PCB Layer 2: GND Plane

FID2FID1 FID3

SJ-5303 (CLEAR)

SH-J1

969102-0000-DA

SH-J3

969102-0000-DA

SH-J4

969102-0000-DA

SH-J5

969102-0000-DA

SH-J13

969102-0000-DA

A0 1

A1 16

DA 8

DB 9

GND 15

S1A

S2A

S3A

S4A

S1B

S2B

S3B

S4B

VDD

VSS 3

MUX36D04IPWR

GND

0.1µF

C10

100pF

0.1µF

100pF

GND

VDD

VSS

TP10

TP11

TP22TP21

TP13

S1A

S2A

S3A

S4A

J10

S1B

J11

S2B

J12

S3B

J14

S4B

J15

TP15 TP16

VDD

VDD VDD

GND

TP17

TP12

TP14

TP18

TP23

TP24

TP25

TP26

TP19

GND GND GND

TP20

0R2

0R4

0R8

J18

39357-0003

GND

VDD

VSS

TSM-102-01-L-SV

J13

TSM-102-01-L-SV

J16

OSTTE100161

TP4 TP5 TP6 TP7 TP8TP3TP2

47µF

10µF

1µF

47µF

10µF

1µF

GND

VDD

VSS

TP1 TP9

GND GND GNDGND GND GND

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Bill of Materials, PCB Layout, and Schematics

SBAU255A–January 2016–Revised March 2016

MUX36D04EVM-PDK

4.3 Schematic

Figure 4 and Figure 5 show the EVM electrical and mechanical schematics, respectively.

Figure 4. Schematic: Electrical

Figure 5. Schematic: Mechanical

STANDARD TERMS AND CONDITIONS FOR EVALUATION MODULES

1. Delivery: TI delivers TI evaluation boards, kits, or modules, including any accompanying demonstration software, components, or

documentation (collectively, an “EVM” or “EVMs”) to the User (“User”) in accordance with the terms and conditions set forth herein.

Acceptance of the EVM is expressly subject to the following terms and conditions.

1.1 EVMs are intended solely for product or software developers for use in a research and development setting to facilitate feasibility

evaluation, experimentation, or scientific analysis of TI semiconductors products. EVMs have no direct function and are not

finished products. EVMs shall not be directly or indirectly assembled as a part or subassembly in any finished product. For

clarification, any software or software tools provided with the EVM (“Software”) shall not be subject to the terms and conditions

set forth herein but rather shall be subject to the applicable terms and conditions that accompany such Software

1.2 EVMs are not intended for consumer or household use. EVMs may not be sold, sublicensed, leased, rented, loaned, assigned,

or otherwise distributed for commercial purposes by Users, in whole or in part, or used in any finished product or production

system.

2Limited Warranty and Related Remedies/Disclaimers:

2.1 These terms and conditions do not apply to Software. The warranty, if any, for Software is covered in the applicable Software

License Agreement.

2.2 TI warrants that the TI EVM will conform to TI's published specifications for ninety (90) days after the date TI delivers such EVM

to User. Notwithstanding the foregoing, TI shall not be liable for any defects that are caused by neglect, misuse or mistreatment

by an entity other than TI, including improper installation or testing, or for any EVMs that have been altered or modified in any

way by an entity other than TI. Moreover, TI shall not be liable for any defects that result from User's design, specifications or

instructions for such EVMs. Testing and other quality control techniques are used to the extent TI deems necessary or as

mandated by government requirements. TI does not test all parameters of each EVM.

2.3 If any EVM fails to conform to the warranty set forth above, TI's sole liability shall be at its option to repair or replace such EVM,

or credit User's account for such EVM. TI's liability under this warranty shall be limited to EVMs that are returned during the

warranty period to the address designated by TI and that are determined by TI not to conform to such warranty. If TI elects to

repair or replace such EVM, TI shall have a reasonable time to repair such EVM or provide replacements. Repaired EVMs shall

be warranted for the remainder of the original warranty period. Replaced EVMs shall be warranted for a new full ninety (90) day

warranty period.

3Regulatory Notices:

3.1 United States

3.1.1 Notice applicable to EVMs not FCC-Approved:

This kit is designed to allow product developers to evaluate electronic components, circuitry, or software associated with the kit

to determine whether to incorporate such items in a finished product and software developers to write software applications for

use with the end product. This kit is not a finished product and when assembled may not be resold or otherwise marketed unless

all required FCC equipment authorizations are first obtained. Operation is subject to the condition that this product not cause

harmful interference to licensed radio stations and that this product accept harmful interference. Unless the assembled kit is

designed to operate under part 15, part 18 or part 95 of this chapter, the operator of the kit must operate under the authority of

an FCC license holder or must secure an experimental authorization under part 5 of this chapter.

3.1.2 For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant:

CAUTION

This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not

cause harmful interference, and (2) this device must accept any interference received, including interference that may cause

undesired operation.

Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to

operate the equipment.

FCC Interference Statement for Class A EVM devices

NOTE: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of

the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is

operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not

installed and used in accordance with the instruction manual, may cause harmful interference to radio communications.

Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to

correct the interference at his own expense.

SPACER

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