Texas Instruments LaunchPad MSP430FR2311 Manual de usuario

SLAU664B–February 2016–Revised August 2017

MSP430FR2311 LaunchPad™ Development Kit (MSP

‑

EXP430FR2311)

User's Guide

SLAU664B–February 2016–Revised August 2017

MSP430FR2311 LaunchPad™ Development Kit

(MSP

‑‑

EXP430FR2311)

Figure 1 shows the MSP430FR2311 LaunchPad™ development kit.

Figure 1. MSP430FR2311 LaunchPad Development Kit

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MSP430FR2311 LaunchPad™ Development Kit (MSP

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EXP430FR2311)

Contents

1 Getting Started............................................................................................................... 3

2 Hardware...................................................................................................................... 5

3 Software Examples ........................................................................................................ 14

4 Resources................................................................................................................... 17

5 FAQ .......................................................................................................................... 22

6 Schematics.................................................................................................................. 23

List of Figures

1 MSP430FR2311 LaunchPad Development Kit .......................................................................... 1

2 MSP-EXP430FR2311 Overview........................................................................................... 5

3 MSP-EXP430FR2311 Block Diagram..................................................................................... 5

4 MSP430FR2311 MCU PW20 Pinout...................................................................................... 6

5 eZ-FET Emulator ............................................................................................................ 7

6 eZ-FET Isolation Jumper Block Diagram................................................................................. 9

7 Application Backchannel UART in Device Manager .................................................................... 9

8 MSP-EXP430FR2311 Power Block Diagram........................................................................... 10

9 LaunchPad Development Kit To Boosterpack Plug-in Module Connector Pinout................................. 13

10 TI Resource Explorer Cloud .............................................................................................. 17

11 CCS Cloud .................................................................................................................. 18

12 Directing the Project>Import Function to the Demo Project.......................................................... 19

13 When CCS Has Found the Project ...................................................................................... 19

14 Using TI Resource Explorer to Browse MSPWare .................................................................... 21

15 Schematics (1 of 6) ........................................................................................................ 23

16 Schematics (2 of 6) ........................................................................................................ 24

17 Schematics (3 of 6) ........................................................................................................ 25

18 Schematics (4 of 6) ........................................................................................................ 26

19 Schematics (5 of 6) ........................................................................................................ 27

20 Schematics (6 of 6) ........................................................................................................ 28

List of Tables

1 EnergyTrace Software ...................................................................................................... 7

2 Isolation Block Connections................................................................................................ 8

3 Hardware Change Log .................................................................................................... 13

4 Software Examples ........................................................................................................ 14

5 IDE Minimum Requirements for MSP-EXP430FR2311............................................................... 14

6 Source File and Folders................................................................................................... 14

7 Source File and Folders................................................................................................... 15

8 Source File and Folders................................................................................................... 16

9 How MSP Device Documentation is Organized........................................................................ 21

Trademarks

LaunchPad, BoosterPack, Code Composer Studio, EnergyTrace, MSP430, MSPWare, ControlSUITE,

TivaWare, E2E are trademarks of Texas Instruments.

IAR Embedded Workbench, C-SPY are registered trademarks of IAR Systems.

All other trademarks are the property of their respective owners.

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Getting Started

SLAU664B–February 2016–Revised August 2017

MSP430FR2311 LaunchPad™ Development Kit (MSP

‑

EXP430FR2311)

1 Getting Started

1.1 Introduction

The MSP430FR2311 LaunchPad™ Development Kit (MSP-EXP430FR2311) is an easy-to-use evaluation

module (EVM) for the MSP430FR2311 MCU. It contains everything needed to start developing on the

ultra-low-power MSP430FRx FRAM microcontroller platform, including onboard emulation for

programming, debugging, and energy measurements. The board features onboard buttons and LEDs for

quick integration of a simple user interface as well as an analog photodiode to showcase the integrated

analog peripherals. The MSP430FR2311 MCU device is the world's first MCU with a configurable low-

leakage current sense amplifier, with 50-pA current leakage and 4KB of embedded FRAM (ferroelectric

random access memory), a nonvolatile memory known for its ultra-low power, high endurance, and high-

speed write access.

Rapid prototyping is simplified by the 20-pin BoosterPack™ plug-in module headers, which support a wide

range of available BoosterPack plug-in modules. You can quickly add features like wireless connectivity,

graphical displays, environmental sensing, and much more. Design your own BoosterPack plug-in module

or choose among many already available from TI and third-party developers.

The out-of-box experience provided with the MSP-EXP430FR2311 MCU LaunchPad development kit

features the onboard analog photodiode. The current from the photodiode is converted by an integrated

operational amplifier to a voltage. That voltage is then sensed by an analog-to-digital converter and fed to

a timer module to pulse width modulate LED2. As more light hits the photodiode, LED2 brightens, and as

less light hits the photodiode, LED2 dims.

Free software development tools are also available, such as TI's Eclipse-based Code Composer Studio™

integrated development environment (IDE) and IAR Embedded Workbench®IDE. Both of these IDEs

support EnergyTrace™ technology for real-time power profiling and debugging when paired with the

MSP430FR2311 MCU LaunchPad development kit. More information about the LaunchPad development

kit, the supported BoosterPack plug-in modules, and available resources can be found on TI's LaunchPad

ecosystem portal.

The MSP-EXP430FR2311 is based on Experimental Silicon. The MSP430FR2311IPW20 device used in

this version of the MSP-EXP430FR2311 is a prototype device and has not met or completed Texas

Instruments internal reliability qualification requirements. The device used in this development kit is for

prototyping purposes only and is not intended to be used in production systems. Therefore, the device is

used on an "as is" basis and Texas Instruments makes no warranty of fitness for a specific purpose.

1.2 Key Features

• MSP430™ ultra-low-power FRAM technology based the MSP430FR2311 16-bit MCU

• EnergyTrace software available for ultra-low-power debugging

• 20 pin LaunchPad development kit standard leveraging the BoosterPack ecosystem

• Onboard eZ-FET emulation

• Two buttons and two LEDs for user interaction

1.3 What's Included

1.3.1 Kit Contents

• 1x MSP-EXP430FR2311 MCU LaunchPad development kit

• 1x micro USB cable

• 1x quick start guide

1.3.2 Software Examples

• Out-of-box software

• Blink LED

• Software I2C

Getting Started

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1.4 First Steps: Out-of-Box Experience

An easy way to get familiar with the EVM is by using its preprogrammed out-of-box code. This code

demonstrates some key features from a user level.

1.4.1 Connecting to the Computer

Connect the LaunchPad development kit using the included USB cable to a computer. A green power LED

should illuminate. For proper operation, drivers are needed. TI recommends installing the TI Code

Composer Studio IDE or IAR Embedded Workbench for MSP430 IDE. Drivers are also available at

ti.com/MSPdrivers.

1.4.2 Running the Out-of-Box Demo

When connected to your computer, the LaunchPad development kit powers up and LED2 dims based on

the amount of ambient light hitting the photo diode, D1. Use a light source such as a flashlight or desk

lamp to illuminate D1 and the brightness of LED2 should increase depending on the intensity of the light

source.

1.5 Next Steps: Looking Into the Provided Code

After the EVM features have been explored, the fun can begin. It's time to open an integrated

development environment and start editing the code examples. Refer to Section 4 for available IDEs and

where to download them.

The quickest way to get started using the LaunchPad development kit is to use TI's Cloud Development

Tools,dev.ti.com. The cloud-based Resource Explorer provides access to all of the examples and

resources in MSPWare™ software. Code Composer Studio IDE Cloud is a simple Cloud-based IDE that

enables developing and running applications on the LaunchPad development kit.

The out-of-box source code and more code examples are provided for download from

www.ti.com/tool/msp-exp430fr2311. Code is licensed under BSD, and TI encourages reuse and

modifications to fit specific needs.

Section 3 describes all functions in detail and provides a project structure to help familiarize you with the

code.

Using the onboard eZ-FET emulator, debugging and downloading new code is simple. A USB connection

between the EVM and a PC through the provided USB cable is all that is needed.

T arge t D e vic e

M S P 4 3 0 F R 23 11

C rysta l

3 2.7 68 kH z

M ic ro -B

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3 .3 - V L D O

ES D

P ro t ec tio n

D e bu g

M C U

LED

R ed , G re e n

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4 M H z

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U se r In te rfa ce

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20 -p in Lau n chP ad

stan dard h ead e rs

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bu tto n

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www.ti.com

Hardware

SLAU664B–February 2016–Revised August 2017

MSP430FR2311 LaunchPad™ Development Kit (MSP

‑

EXP430FR2311)

2 Hardware

Figure 2 shows an overview of the MSP-EXP430FR2311 hardware.

Figure 2. MSP-EXP430FR2311 Overview

2.1 Block Diagram

Figure 3 shows the block diagram.

Figure 3. MSP-EXP430FR2311 Block Diagram

P1.1/UCB0CLK/ACLK/C1/A1

P1.0/UCB0STE/SMCLK/C0/A0/Veref+

TEST/SBWTCK

RST/NMI/SBWTDIO

DVCC

DVSS

P2.7/TB0CLK/XIN

P2.6/MCLK/XOUT P2.1/TB1.2

P2.0/TB1.1/COUT

P1.7/ /TB0.2/TDO/TRI0+/A7UCA0TXD/UCA0SIMO /VREF+

P1.5/ /TMS/TRI0O/A5UCA0CLK

P1.4/ /TCK/OA0+/A4UCA0STE

P1.3/UCB0SOMI/UCB0SCL/OA0O/A3

P1.2/UCB0SIMO/UCB0SDA/ OA0-/A2/Veref-TB0TRG/

P1.6/ /TB0.1/TDI/TCLK/TRI0-/A6UCA0RXD/UCA0SOMI

MSP430FR2311IPW20

MSP430FR2310IPW20

10 11

P2.5/UCB0SOMI/UCB0SCL

P2.4/UCB0SIMO/UCB0SDA P2.3/UCB0CLK/TB1TRG

P2.2/UCB0STE/TB1CLK

Hardware

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2.2 Hardware Features

2.2.1 MSP430FR2311 MCU

The MSP430FR2311 MCU is the next device in TI's new ultra-low-power FRAM technology platform.

FRAM is a cutting edge memory technology, combining the best features of flash and RAM into one

nonvolatile memory.

Device features include:

• 1.8-V to 3.6-V operation

• 16-bit RISC architecture with up to 16-MHz system clock and 8-MHz FRAM access

• Up to 3.75KB of nonvolatile FRAM

• 126-µA/MHz active mode and 1-µA standby with RTC

• 8-channel 10-bit ADC

• Operational amplifier that supports multiple modes

• Enhanced comparator with integrated 6-bit DAC as reference voltage

• Transimpedance amplifier

• Three timers

• Direct memory access

• 16 GPIOs

Figure 4. MSP430FR2311 MCU PW20 Pinout

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Hardware

SLAU664B–February 2016–Revised August 2017

MSP430FR2311 LaunchPad™ Development Kit (MSP

‑

EXP430FR2311)

2.2.2 eZ-FET Onboard Emulator With EnergyTrace™ Software

To keep development easy and cost effective, TI's LaunchPad development kits integrate an onboard

emulator, which eliminates the need for expensive programmers. The MSP-EXP430FR2311 has the eZ-

FET emulator (see Figure 5), which is a simple and low-cost debugger that supports all MSP430 MCU

derivatives.

Figure 5. eZ-FET Emulator

The MSP-EXP430FR2311 MCU LaunchPad development kit features EnergyTrace software. The

EnergyTrace software functionality varies across the MSP portfolio.

Table 1. EnergyTrace Software

Features EnergyTrace Software EnergyTrace++ Software

Current monitoring ✔ ✔

CPU State ✔

Peripheral and system state ✔

Devices supported All MSP430 MCUs MSP430FR59xx and FR69xx

MCUs

Development tool required MSP-FET or eZ-FET MSP-FET or eZ-FET

The eZ-FET also provides a "backchannel" UART-over-USB connection with the host, which can be very

useful during debugging and for easy communication with a PC. The provided UART supports hardware

flow control (RTS and CTS), although by default these signals are not connected to the target.

The dotted line through J101 shown in Figure 5 divides the eZ-FET emulator from the target area. The

signals that cross this line can be disconnected by jumpers on J101, the isolation jumper block. More

details on the isolation jumper block are in Section 2.2.3.

The eZ-FET hardware can be found in the schematics in Section 6 and in the accompanying hardware

design files. The software and more information about the debugger can be found on the eZ-FET wiki.

Hardware

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2.2.3 Emulator Connection: Isolation Jumper Block

The isolation jumper block at jumper J101 allows the user to connect or disconnect signals that cross from

the eZ-FET domain into the MSP430FR2311 MCU target domain. This includes eZ-FET Spy-Bi-Wire

signals, application UART signals, and 3.3-V and 5-V power.

Reasons to open these connections:

• To remove any and all influence from the eZ-FET emulator for high-accuracy target power

measurements

• To control 3-V and 5-V power flow between the eZ-FET and target domains

• To expose the target microcontroller pins for other use than onboard debugging and application UART

communication

• To expose the programming and UART interface of the eZ-FET so that it can be used for devices other

than the onboard microcontroller

(1) Also see Figure 6.

Table 2. Isolation Block Connections(1)

Jumper Description

GND Ground

5V 5-V VBUS from USB

3V3 3.3-V rail, derived from VBUS in the eZ-FET domain

RXD << Backchannel UART: The target FR2311 receives data through this signal. The arrows indicate the direction of the

signal.

TXD >> Backchannel UART: The target FR2311 sends data through this signal. The arrows indicate the direction of the

signal.

SBW RST Spy-Bi-Wire emulation: SBWTDIO data signal. This pin also functions as the RST signal (active low).

SBW TST Spy-Bi-Wire emulation: SBWTCK clock signal. This pin also functions as the TST signal.

eZ-FET

Debug

Probe

Isolation

Jumper Block

Spy-Bi-Wire (SBW)

Emulation

Application UART

3.3V Power

5V Power

Target MSP430

MCU

eZ-FETMSP430 Target

USB Connector

in out

LDO

BoosterPack Header

USB

EnergyTrace

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Hardware

SLAU664B–February 2016–Revised August 2017

MSP430FR2311 LaunchPad™ Development Kit (MSP

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Figure 6. eZ-FET Isolation Jumper Block Diagram

2.2.4 Application (or "Backchannel") UART

The backchannel UART allows communication with the USB host that is not part of the target application's

main functionality. This is very useful during development, and also provides a communication channel to

the PC host side. This can be used to create graphical user interfaces (GUIs) and other programs on the

PC that communicate with the LaunchPad development kit.

Figure 6 shows the pathway of the backchannel UART. The backchannel UART is the UART on

eUSCI_A0.

On the host side, a virtual COM port for the application backchannel UART is generated when the

LaunchPad development kit enumerates on the host. You can use any PC application that interfaces with

COM ports, including terminal applications like Hyperterminal or Docklight, to open this port and

communicate with the target application. You need to identify the COM port for the backchannel. On

Windows PCs, Device Manager can assist.

Figure 7. Application Backchannel UART in Device Manager

Hardware

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The backchannel UART is the "MSP Application UART1" port. In this case, Figure 7 shows COM13, but

this port can vary from one host PC to the next. After you identify the correct COM port, configure it in

your host application according to its documentation. You can then open the port and begin

communication to it from the host.

On the target MSP430FR2311 MCU side, the backchannel is connected to the eUSCI_A0 module. The

eZ-FET has a configurable baud rate; therefore, it is important that the PC application configures the baud

rate to be the same as what is configured on the eUSCI_A0.

2.2.5 Special Features

2.2.5.1 Smart Analog Combo (SAC)

The MSP430FR2311 MCU LaunchPad development kit features pins to access the smart analog combo

on the device. These pins are accessed on jumpers J7, J8 and J9 where the smart analog combo

operational amplifier is connected to the onboard photodiode circuit. These pins are also connected to the

BoosterPack plug-in module header pins. For applications that use the SAC and a connected BoosterPack

plug-in module, be sure to check for any pin conflicts. The photodiode circuit can be disconnected from

the SAC using jumpers J7, J8 and J9. The user can connect an external analog sensor circuit to the SAC

by removing jumpers J7, J8 and J9 and connecting their circuit to the appropriate header pins through the

BoosterPack plug-in module headers or the jumpers near the light sensor circuit.

To adjust the light sensor circuits' sensitivity the user can adjust either the software or the hardware. By

changing the value of R3 and C6 the user can change the operational amplifiers low-pass filter and

sensitivity to the photodiodes current. The user can also adjust the calculations performed in the software

to adjust the sensitivity of the circuit to their desired level.

2.3 Power

The board was designed to accommodate various powering methods, including through the onboard eZ-

FET as well as external or BoosterPack power (see Figure 8).

Figure 8. MSP-EXP430FR2311 Power Block Diagram

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