Texas Instruments LP-MSPM0L1306 Manual de usuario

User’s Guide

MSPM0L1306 LaunchPad Development Kit

(LP

‑

MSPM0L1306)

ABSTRACT

The MSPM0L1306 LaunchPad™ Development Kit is an easy-to-use evaluation module for the MSPM0L1306

microcontroller (MCU). The kit contains everything needed to start developing on the MSPM0L1xx

microcontroller platform, including onboard debug probe for programming, debugging, and energy

measurements. The board also features onboard buttons and LEDs for quick integration of a simple user

interface, an onboard thermistor, light sensor, and RGB LED.

The following figure shows the LP-MSPM0L1306 LaunchPad development kit.

LP-MSPM0L1306 LaunchPad Development Kit

Table of Contents

1 Getting Started........................................................................................................................................................................3

1.1 Introduction........................................................................................................................................................................ 3

1.2 Key Features......................................................................................................................................................................3

1.3 What's Included..................................................................................................................................................................3

1.4 First Step Out-of-Box Experience...................................................................................................................................... 3

1.5 Next Steps: Looking Into the Provided Code..................................................................................................................... 4

2 Hardware................................................................................................................................................................................. 4

2.1 Jumper Map....................................................................................................................................................................... 6

2.2 Block Diagram....................................................................................................................................................................7

2.3 Hardware Features............................................................................................................................................................ 7

2.4 Power............................................................................................................................................................................... 12

2.5 External Power Supply and BoosterPack Plug-in Module............................................................................................... 12

2.6 Measure Current Draw of the MSPM0 MCU....................................................................................................................12

2.7 Clocking........................................................................................................................................................................... 13

2.8 BoosterPack Plug-in Module Pinout.................................................................................................................................13

2.9 Design Files..................................................................................................................................................................... 13

3 Software Examples...............................................................................................................................................................13

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4 Resources............................................................................................................................................................................. 13

4.1 Integrated Development Environments............................................................................................................................13

4.2 MSPM0 SDK and TI Resource Explorer.......................................................................................................................... 14

4.3 MSPM0L1306 MCU......................................................................................................................................................... 14

4.4 Community Resources.....................................................................................................................................................15

5 Schematics............................................................................................................................................................................16

6 Revision History................................................................................................................................................................... 22

Trademarks

LaunchPad™, BoosterPack™, Code Composer Studio™, EnergyTrace™, and TI E2E™ are trademarks of Texas

Instruments.

Embedded Workbench™ is a trademark of IAR Systems.

Arm®, Cortex®, Keil®, and µVision® are registered trademarks of Arm Limited.

All trademarks are the property of their respective owners.

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1 Getting Started

1.1 Introduction

The MSPM0L1306 is an Arm® 32-bit Cortex®-M0+ CPU with frequency up to 32 MHz. The device features

64KB of embedded flash memory combined with 4KB of on-chip RAM. The integrated high-performance analog

peripherals like 12-bit 1-Msps SAR ADC, zero-drift and zero-crossover chopper op-amps (OPA), and a general-

purpose amplifier (GPAMP) help users design their system.

Rapid prototyping is simplified by the 40-pin BoosterPack™ plug-in module headers, which support a wide range

of available BoosterPack plug-in modules. You can quickly add features like wireless connectivity, graphical

displays, environmental sensing, and much more. Design your own BoosterPack plug-in module or choose

among many already available from TI and third-party developers.

Free software development tools are also available such as TI's Code Composer Studio™ IDE, IAR Embedded

Workbench™ IDE, and Keil® µVision® IDE. Code Composer Studio IDE supports EnergyTrace™ technology

when paired with the MSPM0L1306 LaunchPad development kit. More information about the LaunchPad

development kit, the supported BoosterPack plug-in modules, and the available resources can be found at the TI

LaunchPad™ development kit portal. To get started quickly and find available resources in the MSPM0 software

development kit (SDK), visit the TI Cloud Developer Zone. MSPM0 MCUs are also supported by extensive

online collateral, training with MSP Academy, and online support through the TI E2E™ support forums.

1.2 Key Features

• Onboard XDS110 debug probe with external programming option

• EnergyTrace technology available for ultra-low-power debugging

• 2 buttons, 1 LED and 1 RGB LED for user interaction

• Thermistor circuit

• Light sensor circuit

• RC filter for ADC input (unpopulated by default)

• Supports BSL invoke with GPIO and XDS110

• Backchannel UART through USB to PC

1.3 What's Included

1.3.1 Kit Contents

1. MSPM0L1306 LaunchPad Development Kit

2. 1 Micro USB cable

3. 1 Quick Start Guide

1.3.2 Software Examples

•Out-of-Box Software Example

•Sysconfig Compatibility

•SDK Examples

1.4 First Step Out-of-Box Experience

An easy way to get started with the EVM is by using its preprogrammed out-of-box code. This code

demonstrates some key features of the EVM and is meant to be used with the LP-MSPM0L1306 out-of-box

demo GUI.

1.4.1 Connecting to the Computer

Connect the LaunchPad development kit using the included USB cable to a computer. A green power LED

illuminates. For proper operation, drivers are needed. TI recommends that you get the drivers by installing an

IDE such as the TI Code Composer Studio IDE or IAR Embedded Workbench IDE.

1.4.2 Running the Out-of-Box Experience

Access the GUI Composer powered GUI for the Out-of-Box Experience (OoBE) through the TI Cloud Gallery.

Alternatively, the GUI is provided with the MSPM0 SDK as well for offline operation. Figure X below shows the

welcome screen for the GUI. The GUI runs through three main examples:

• Blink LED – Change rate of LED blink

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• Light Sensor – Read light sensor and plot results, while also modulate RGB brightness

• Thermistor – Read thermistor voltage and plot converted temperature over time. RGB LED changes colors to

signify differences of temperature measured.

Figure 1-1. LP-MSPM0L1306 OoBE GUI

1.5 Next Steps: Looking Into the Provided Code

After the EVM features have been explored, the fun can begin. It’s time to open an integrated development

environment and start editing the code examples. See Section 4 for available IDEs and where to download them.

Code examples are provided in the MSPM0 SDK. Code is licensed under BSD, and TI encourages reuse

and modifications to fit specific needs. See MSPM0 SDK User Guide for more details about code examples

available.

The quickest way to get started using the LaunchPad development kit is to use TI’s cloud development tools.

The cloud-based Resource Explorer provides access to all of the examples and resources in MSPM0 SDK .

Code Composer Studio Cloud is a simple Cloud-based IDE that enables developing and running applications

on the LaunchPad development kit. SysConfig for MSPM0 is another graphical tool that can be utilized to easily

and quickly setup your MSPM0L1306 device, pins, and peripherals to fit your development needs. SysConfig is

strongly encouraged to be used when starting any new project.

With the XDS110 debug probe, debugging and downloading new code is simple. A connection between the EVM

and a PC through the provided USB cable is all that is needed.

2 Hardware

Figure 2-1 shows an overview of the LP-MSPM01306 hardware.

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UART to BP/XDS

selection

XDS110 onboard debug probe

Enables debugging and

programming as well as

communication to the PC.

The XDS110 can also provide

power to the target MCU.

EnergyTrace Technology

Real-time power consumption

readings and state updates from

the MCU viewable through the

EnergyTrace GUI

Reset

MSPM0L1306

reset

USB

To PC

Button/Switch

40-pin BoosterPack plug-in

module connector (J1-J4)

Button/Switch

Light Sensor

Thermistor

Jumper Isolation Block

J101

-Power

- GND, 5V, and 3V3

-Back-channel UART to the PC

- RXD, TXD

-SWD

- SWDIO, SWCLK

-BSL

MSPM0L1306

RGB LED

LED

Alternate PA11 Selection

Pullup voltage selection

Figure 2-1. LP-MSPM0L1306 Overview

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2.1 Jumper Map

Table 2-1. LaunchPad Kit Jumpers Shunt Installation

Jumper Description Default setting Connected Pin or

Signal

Low Power

Measurement

Recommendation

J101 XDS110-ET isolation block Installed

GND, 5V, 3V3, RXD,

TXD, NRST, SWDIO,

SWCLK, BSL

OFF to disconnect from

XDS-110 circuitry

J102 XDS110-ET Program Out NA GND, 3V3, SWDIO,

SWCLK, NRST No external connection

J103 XDS110-ET Program In NA GND, 3V3, SWDIO,

SWCLK No external connection.

J1 Thermistor signal selection 1) short to (2) PA15 (ADC0_9) OFF to disconnect from

thermistor circuit

J2 Red LED D2 Installed PA0 OFF to disconnect pin

from LED

J3 RGB LED D1 – Green Channel Installed PA13 (TIMG0_C1) OFF to disconnect pin

from RGB LED

J4 Light Sensor Installed PA25 (OPA0_IN+) OFF to disconnect from

photodiode circuit

J5 Light Sensor Installed PA24 (OPA0_IN-) OFF to disconnect from

photodiode circuit

J6 Light Sensor Installed PA22 (OPA0_OUT) OFF to disconnect from

photodiode circuit

J7 External 3.3V NA 3V3, GND No connect to external

circuits

J8 External 5V NA 5V, GND No connect to external

circuits

J9 Open-drain IO PA0 voltage pull up selection (2) open NA

OFF if pin initialized as

output low or input with

pullup/pulldown

J10 Open-drain IO PA1 voltage pull up selection (2) open NA

OFF if pin initialized as

output low or input with

pullup/pulldown

J11 Button S1 connection Installed PA18

OFF to avoid current

from external pulldown

depending on pin

configuration

J12 RGB LED D1 – Red Channel Installed PA26 (TIMG1_C0) OFF to disconnect pin

from RGB LED

J13 RGB LED D1 – Blue Channel Installed PA27 (TIMG1_C1) OFF to disconnect pin

from RGB LED

J14 Alternate PA11 BoosterPack Connection (1) short to (2) PA11 – SW1 Don't care if not used in

BoosterPack connector

J15 Thermistor Power Installed 3V3 OFF to remove power

to thermistor circuitry

J16 UART Path Selection – BP – UART TX- XDS (1) short to (2) PA8 – XDS OFF to disconnect pin

J17 UART Path Selection – BP – UART RX- XDS (1) short to (2) PA9 – XDS OFF to disconnect pin

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2.2 Block Diagram

LED

Red,Green

Debug

MCU

Reset

Button

Micro-B

USB

ESD

Protection

Target device

MSPM0L1306

40-Pin

LaunchPad

Standard

headers

Light sensor

Power, UART, SWD to

Target

Energy

Trace

Technology

Thermistor RGB LED

User Interface:

Buttons and Red

LED

External

Debug,

Out

External

Debug, In

Figure 2-2. Block Diagram

2.3 Hardware Features

2.3.1 MSPM0L1306 MCU

The MSPM0L1306 device provides up to 64KB embedded flash program memory with up to 4KB SRAM.

They incorporate a high speed on-chip oscillator with an accuracy of ±1%, eliminating the need for an

external crystal. Additional features include a 3-channel DMA, 16 and 32-bit CRC accelerator, and a variety

of high-performance analog peripherals such as one 12-bit 1MSPS ADC with configurable internal voltage

reference, one high-speed comparator with built-in reference DAC, two zero-drift zero-crossover op-amps with

programmable gain, one general-purpose amplifier, and an on-chip temperature sensor. These devices also

offer intelligent digital peripherals such as four 16-bit general purpose timers, one windowed watchdog timer,

and a variety of communication peripherals including two UARTs, one SPI, and two I2C. These communication

peripherals offer protocol support for LIN, IrDA, DALI, Manchester, Smart Card, SMBus, and PMBus. Device

feature include:

• 1.62 V to 3.6 V operation

• Arm 32-bit Cortex-M0+, up to 32 MHz

• 64KB of flash and 4KB SRAM

• 12-bit 1-Msps ADC

• Two zero-drift, zero-crossover chopper op-amps

• Four 16-bit general purpose timers

• Internal 4- to 32-MHz oscillator with ±1% accuracy (SYSOSC)

• 28 GPIOs

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VQFN32

Thermal pad

PA20 / SWCLK / A6

PA19 / SWDIO

PA18 / A7

PA17

PA16 / A8

PA15 / A9

PA14

PA13

PA0

PA1

NRST

VDD

VSS

PA2 / ROSC

PA3

PA4

PA5

PA6

PA7

PA8

PA9

PA10

PA11

PA12

VCORE

PA27 / A0

PA26 / A1

PA25 / A2

PA24 / A3

PA23 / VREF+

PA22 / A4

PA21 / A5 / VREF-

Figure 2-3. 32-Pin RHB (VQFN) (Top View)

2.3.2 XDS110-ET Onboard Debug Probe With EnergyTrace Technology

To keep development easy and cost effective, the TI LaunchPad development kits integrate an onboard debug

probe, which eliminates the need for expensive programmers. The MSPM0L1306 has the XDS110 debug probe

(see Figure 2-4), which is a simple and low-cost debugger that supports all MSPM0 device derivatives.

Figure 2-4. LP-MSPM0L1306 Debugger

The XDS110-ET provides a "backchannel" UART-over-USB connection with the host, which can be very useful

during debugging and for easy communication with a PC. More details can be found in Section 2.3.4.

The XDS110-ET also includes EnergyTrace Technology that allows a user to quickly estimate the power

consumption of their application. Accurate EnergyTrace measurements can only be taken if the XDS110-ET

is the sole provider of power to the target device. Measurements include all power drawn from the portion of the

board below the isolation block. See Section 2.6 for more information around current measurements.

2.3.3 Debug Probe Connection: Isolation Jumper Block

The isolation jumper block at jumper J101 allows the user to connect or disconnect signals that cross from the

XDS110-ET domain into the MSPM0L1306 target domain. This includes XDS110-ET SWD signals, application

UART signals, and 3.3-V and 5-V power.

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LDO

MSPM0L1306

Target MCU

BoosterPack Header

USB

IN OUT

USB Connector

XDS110-ETMSPM0L1306 Target

XDS110-ET

Debug Probe

MCU

XDS110

Debug Out

External

Debug In

SWD + BSL

Application UART

UART0

3.3-V

Power

5-V Power

J101

Isolation

EnergyTrace

Figure 2-5. Debug Probe Connection

Table 2-2. Isolation Block Jumpers

Jumper Description

GND Ground

5V 5-V VBUS from USB

3V3 3.3-V rail, derived from VBUS in the XDS110-ET domain

RXD<< Backchannel UART: The target MSPM0L1306 receives data through this signal. The arrows indicate the direction of the

signal.

TXD>> Backchannel UART: The target MSPM0L1306 sends data through this signal. The arrows indicate the direction of the

signal.

NRST RST signal

SWDIO Serial wire debug: SWDIO data signal.

SWCLK Serial wire debug: SWDCLK clock signal

BSL Bootstrap Loader signal

Reasons to open these connections:

• To remove any and all influence from the XDS110-ET debug probe for high accuracy target power

measurements

• To control 3-V and 5-V power flow between the XDS110-ET and target domains

• To expose the target MCU pins for other use than onboard debugging and application UART communication

• To expose the programming and UART interface of the XDS110-ET so that it can be used for devices other

than the onboard MCU.

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2.3.4 Application (or "Backchannel") UART

The backchannel UART allows communication with the USB host that is not part of the target application’s

main functionality. This is very useful during development, and also provides a communication channel to the

PC host side. This can be used to create graphical user interfaces (GUIs) and other programs on the PC that

communicate with the LaunchPad development kit.

Figure 2-6 shows the pathway of the backchannel UART. The backchannel UART is connected to UART0 (PA8,

PA9) deepening on the jumper settings on headers J16 and J17.

On the host side, a virtual COM port for the application backchannel UART is generated when the LaunchPad

development kit enumerates on the host. You can use any PC application that interfaces with COM ports,

including terminal applications like Hyperterminal or Docklight, to open this port and communicate with the target

application. You need to identify the COM port for the backchannel. On Windows PCs, Device Manager can

assist.

Figure 2-6. Application Backchannel UART in Device Manager

The backchannel UART is the "XDS110 Class Application/User UART" port. In this case, Figure 2-6 shows

COM14, but this port can vary from one host PC to the next. After you identify the correct COM port, configure it

in your host application according to its documentation. You can then open the port and begin communication to

it from the host.

On the target MSPM0L1306 side, the backchannel is connected to the UART0 module. The XDS110-ET has a

configurable baud rate; therefore, it is important that the PC application configures the baud rate to be the same

as what is configured on the UART0.

2.3.5 Using an External Debug Probe Instead of the Onboard XDS110-ET

Many users have a specific external debug probe that they prefer to use, and may wish to bypass the XDS110-

ET debug probe to program the MSPM0 target MCU. This is enabled by jumpers on isolation block J101, and

the connector J103. Using an external debug probe is simple, and full JTAG access is provided through J103.

1. Remove jumpers on the JTAG signals on the J101 isolation block, including NRST, SWDIO and SWCLK.

2. Plug any Arm debug probe into J103

3. J103 follows the Arm Cortex Debug Connector standard outlined in Cortex-M Debug Connectors.

4. Plug USB power into the LaunchPad development kit, or power it externally.

5. Ensure that the jumpers across 3V3 and GND are connected if using USB power.

6. External debug probes do not provide power, the VCC pin is a power sense pin.

7. For more details on powering the LaunchPad development kit, see Section 2.4.

2.3.6 Using the XDS110-ET Debug Probe With a Different Target

The XDS110-ET debug probe on the LaunchPad development kit can interface to most Arm Cortex-M devices,

not just the onboard target MSPM0L1306 device. This functionality is enabled by the J102 10-pin Cortex-M

JTAG connector and a 10-pin cable. Header J102 follows the Cortex-M Arm standard, however, pin 1 is not

a voltage sense pin. The XDS110-ET outputs only 3.3-V JTAG signals. If another voltage level is needed, the

user must provide level shifters to translate the JTAG signal voltages. Additionally, 3.3 V of output power can be

sourced from the XDS110-ET when jumper J102 is connected. This allows the XDS110-ET to power the external

target at 3.3 V through pin 1. EnergyTrace technology is not supported on this interface.

1. Remove jumpers on the JTAG signals on the J101 isolation block, including RST, TMS, TCK, TDO, and TDI.

2. Plug the 10-pin cable into J102, and connect to an external target. a. J102 follows the Arm Cortex Debug

Connector standard outlined in Cortex-M Debug Connectors.

3. Plug USB power into the LaunchPad development kit, or power it externally. JTAG levels are 3.3 V ONLY.

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