Texas Instruments Tiva C Series Manual de usuario

Development Guide

SPMU288A–August 2012–Revised April 2013

Tiva™ C Series EK-TM4C123GXL LaunchPad:

BoosterPack Development Guide

The Texas Instruments’ Tiva™ C Series TM4C123G LaunchPad concept is an extremely low-cost,

expandable evaluation system for TI microcontrollers. This concept began with the tremendously

successful MSP430™ LaunchPad which introduced a large number of engineers to the TI MSP430 family

of microcontrollers (MCUs). The Tiva Series of 32-bit ARM®Cortex™-M4 MCU family expands that

success by introducing the Tiva C Series TM4C123G LaunchPad featuring the Tiva C Series

TM4C123GH6PM microcontroller.

Build your own BoosterPack and take advantage of Texas Instruments’ website to help promote it! From

sharing a new idea or project, to designing, manufacturing, and selling your own BoosterPack kit, TI offers

a variety of avenues for you to reach potential customers with your solutions.

This document briefly discusses the design and architecture of the LaunchPad platform and presents

practical guidelines for application developers to build their own BoosterPacks for use with any of the

available TI MCU LaunchPad kits. For more information about the LaunchPad, or about the BoosterPacks

currently available for each LaunchPad kit, visit the LaunchPad site at www.ti.com.

Contents

1 LaunchPad and BoosterPack Expansion Concept and Overview .................................................... 2

2 BoosterPack Functional Interface ......................................................................................... 4

3 BoosterPack XL Functional Interface .................................................................................... 5

4 LaunchPad Power Interface ............................................................................................... 6

5 Special Consideration for Shared Pins ................................................................................... 7

6 Tiva C Series LaunchPad Dimensions and Mating ..................................................................... 7

7 BoosterPack Design Guidelines .......................................................................................... 8

8 References and Schematics ............................................................................................... 9

List of Tables

1 LaunchPad BoosterPack Compatibility Summary ...................................................................... 2

2 J1 Connector ................................................................................................................ 4

3 J2 Connector ................................................................................................................ 4

4 J3 Connector ................................................................................................................ 5

5 J4 Connector ................................................................................................................ 5

6 Tiva C Series LaunchPad Jumper List................................................................................... 7

Tiva, MSP430 are trademarks of Texas Instruments.

Stellaris is a registered trademark of Texas Instruments.

Cortex is a trademark of ARM Limited.

ARM is a registered trademark of ARM Limited.

All other trademarks are the property of their respective owners.

SPMU288A–August 2012–Revised April 2013 Tiva™ C Series EK-TM4C123GXL LaunchPad: BoosterPack Development

Guide

LaunchPad and BoosterPack Expansion Concept and Overview

www.ti.com

1 LaunchPad and BoosterPack Expansion Concept and Overview

The Texas Instruments’ Tiva C Series TM4C123G LaunchPad concept is an extremely low-cost,

expandable evaluation system for TI's Tiva C Series of ARM microcontrollers. This concept began with the

tremendously successful MSP430™ LaunchPad which introduced a large number of engineers to the TI

MSP430 family of microcontrollers. The TI Stellaris®LM4F120 LaunchPad expanded on that success.

Now, the LaunchPad evaluation kit platform introduces the Tiva C Series EK-TM4C123GXL LaunchPad,

featuring the Tiva C Series TM4C123GH6PM MCU.

A Tiva C Series LaunchPad consists of a target microcontroller, an in-circuit debug interface (ICDI) such

as JTAG, a regulated power supply, a minimal microcontroller support circuit, a user interface, and a set of

expansion headers. These expansion headers are referred to as the BoosterPack Interface. A

BoosterPack is an expansion card designed for this interface. The BoosterPack interface provides a

mechanism for developers to easily extend the Tiva C Series LaunchPad with application- and user-

specific functions.

The EK-TM4C123GXL LaunchPad provides a BoosterPack interface that is compatible with the MSP430

LaunchPad. In addition, the TM4C123 LaunchPad provides access to additional Tiva C Series

functionality through an extended BoosterPack interface called the BoosterPack XL Interface.

BoosterPack interfaces with highly similar functionality for expansion will be available for the Tiva C Series

LaunchPad, in addition to microcontroller-family-specific functionality available on a BoosterPack XL

Interface for additional options. Table 1 provides a summary of current BoosterPack interface

compatibility.

Table 1. LaunchPad BoosterPack Compatibility Summary

Compatible with:

LaunchPad Kit BoosterPack Interface BoosterPack XL Interface

Stellaris LaunchPad Yes Yes

MSP430 LaunchPads Yes No

Tiva C Series LaunchPad Yes Yes

Other TI LaunchPads Yes No

2Tiva™ C Series EK-TM4C123GXL LaunchPad: BoosterPack Development SPMU288A–August 2012–Revised April 2013

Guide Submit Documentation Feedback

Power Select

Switch Green Power LED

USB Connector

(Power/ICDI)

Reset Switch

RGB User LED

User Switch 2User Switch 1

USB Micro-A/-B

Connector

(Device)

Tiva C Series

LaunchPad

BoosterPack XL

Interface (J1, J2, J3,

and J4 Connectors)

Tiva C Series

LaunchPad

BoosterPack XL

Interface (J1, J2, J3,

and J4 Connectors)

MSP430

LaunchPad-Compatible

BoosterPack Interface

MSP430

LaunchPad-Compatible

BoosterPack Interface

Tiva

TM4C123GH6PMI

Microcontroller

Tiva

TM4C123GH6PMI

Microcontroller

www.ti.com

LaunchPad and BoosterPack Expansion Concept and Overview

This development guide provides necessary design information for developers who want to create

BoosterPacks that extend the functionality of the Tiva C Series or Stellaris LaunchPads using either the

original BoosterPack Interface or the BoosterPack XL Interface. Figure 1 shows a photo of the Tiva C

Series LaunchPad.

Figure 1. Tiva C Series TM4C123G LaunchPad Evaluation Board

SPMU288A–August 2012–Revised April 2013 Tiva™ C Series EK-TM4C123GXL LaunchPad: BoosterPack Development

Guide

BoosterPack Functional Interface

www.ti.com

2 BoosterPack Functional Interface

The Tiva C Series LaunchPad BoosterPack Interface provides compatibility with the original MSP430

LaunchPad BoosterPack interface. This interface consists of the outer 10-pin headers. The pins are

spaced 0.10 in (2,54 mm) apart with the two headers located 1.8 in (4,572 cm) apart.

Table 2 and Table 3 both provide information about which Tiva C Series MCU peripherals are routed to

each of the interface pins. The J1 connector is located on the far left side of the Tiva C Series LaunchPad.

The J2 connector is located on the far right side of the TM4C123G LaunchPad. Software is used to

configure the TM4C123GH6PM pin for one of the functions found in the tables. Highlighted functions

indicate configuration for compatibility with the MSP430 LaunchPad.

Table 2. J1 Connector(1)

Analog Tiva C GPIOPCTL Register Setting

On-

Function Series

J1 Pin GPIO board MCU

GPIO Function 1 2 3 4 5 6 7 8 9 14 15

AMSEL

1.01 3.3 V

1.02 PB5 AIN11 – 57 – SSI2Fss – M0PWM3 – – T1CCP1 CAN0Tx – – –

1.03 PB0 USB0ID – 45 U1Rx – – – – – T2CCP0 – – – –

1.04 PB1 USB0VBUS – 46 U1Tx – – – – – T2CCP1 – – – –

1.05 PE4 AIN9 – 59 U5Rx – I2C2SCL M0PWM4 M1PWM2 – – CAN0Rx – – –

1.06 PE5 AIN8 – 60 U5Tx – I2C2SDA M0PWM5 M1PWM3 – – CAN0Tx – – –

1.07 PB4 AIN10 – 58 – SSI2Clk – M0PWM2 – – T1CCP0 CAN0Rx – – –

1.08 PA5 – – 22 – SSI0Tx – – – – – – – – –

1.09 PA6 – – 23 – – I2C1SCL – M1PWM2 – – – – – –

1.10 PA7 – – 24 – – I2C1SDA – M1PWM3 – – – – – –

(1) Shaded cells indicate configuration for compatibility with the MSP430 LaunchPad.

Table 3. J2 Connector(1)

Analog Tiva C GPIOPCTL Register Setting

Function

J2 On-board Series

GPIO

Pin Function MCU

GPIO 1 2 3 4 5 6 7 8 9 14 15

AMSEL

2.01 GND

2.02 PB2 – – 47 – – I2C0SCL – – – T3CCP0 – – – –

2.03 PE0 AIN3 – 9 U7Rx – – – – – – – – – –

2.04(2) PF0 – USR_SW2/ 28 U1RTS SSI1Rx CAN0Rx – M1PWM4 PhA0 T0CCP0 NMI C0o – –

WAKE (R1)

2.05 RESET

PB7 – Connected 4 – SSI2Tx – M0PWM1 – – T0CCP1 – – – –

for MSP430

2.06 PD1 AIN6 62 SSI3Fss SSI1Fss I2C3SDA M0PWM7 M1PWM1 – WT2CCP1 – – – –

Compatibility

(R10)

PB6 – Connected 1 – SSI2Rx – M0PWM0 – – T0CCP0 – – – –

for MSP430

2.07 PD0 AIN7 61 SSI3Clk SSI1Clk I2C3SCL M0PWM6 M1PWM0 – WT2CCP0 – – – –

Compatibility

(R9)

2.08 PA4 – – 21 – SSI0Rx – – – – – – – – –

2.09 PA3 – – 20 – SSI0Fss – – – – – – – – –

2.10 PA2 – – 19 – SSI0Clk – – – – – – – – –

(1) Shaded cells indicate configuration for compatibility with the MSP430 LaunchPad.

(2) Not recommended for BoosterPack use. J2.04 is a TEST pin on the MSP430 LaunchPad. This signal tied to on-board function

via 0-Ωresistor.

4Tiva™ C Series EK-TM4C123GXL LaunchPad: BoosterPack Development SPMU288A–August 2012–Revised April 2013

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BoosterPack XL Functional Interface

3 BoosterPack XL Functional Interface

The BoosterPack XL Interface consists of the J1 and J2 connectors as well as the inner 10-pin headers

spaced 1.6 in (4,064 cm) apart directly inside of the MSP430 LaunchPad-compatible BoosterPack

interface headers. The pins are spaced on 0.10-inch (2,54-mm) centers. These inner 10-pin headers

(connectors J3 and J4) are not intended to be compatible with other TI LaunchPads or LaunchPad XL kits.

This feature is a Tiva C Series-only interface. TI recommends that LaunchPads provide analog functions

on the left side of the BoosterPack XL interface and timer or PWM functions on the right side of the

BoosterPack XL interface. The Tiva C Series board conforms to these recommendations. No effort has

been made to make this interface compatible with any other LaunchPad.

Table 4 and Table 5 show the Tiva C Series peripherals that are routed to each pin of the Tiva C Series-

only BoosterPack XL Interface pins. J3 is the inner left BoosterPack XL Interface header. J4 is the inner

right BoosterPack XL Interface header. Software is used to configure the TM4C123GH6PM pin for one of

the functions found in the tables.

Table 4. J3 Connector(1)

Analog Tiva C GPIOPCTL Register Setting

Function

J3 On-board Series

GPIO

Pin Function MCU

GPIO 1 2 3 4 5 6 7 8 9 14 15

AMSEL

3.01 5.0 V

3.02 GND

PD0 AIN7 Connected 61 SSI3Clk SSI1Clk I2C3SCL M0PWM6 M1PWM0 – WT2CCP0 – – – –

for MSP430

3.03 PB6 – 1 – SSI2Rx – M0PWM0 – T0CCP0 – – – –

Compatibilit

y (R9)

PD1 AIN6 Connected 92 SSI3Fss SSI1Fss I2C3SDA M0PWM7 M1PWM1 – WT2CCP1 – – – –

for MSP430

3.04 PB7 – 4 – SSI2Tx – M0PWM1 – – T0CCP1 – – – –

Compatibilit

y (R10)

3.05 PD2 AIN5 63 SSI3Rx SSI1Rx – M0FAULT0 – – WT3CCP0 USB0EPE

3.06 PD3 AIN4 – 64 SSI3Tx SSI1Tx – – – – WT3CCP1 USB0PFLT – – –

3.07 PE1 AIN2 – 8 U7Tx – – – – – – – – –

3.08 PE2 AIN1 – 7 – – – – – – – – – – –

3.09 PE3 AIN0 – 6 – – – – – – – – – – –

3.10 PF1 – – 29 U1CTS SSI1Tx – – M1PWM5 – T0CCP1 – C1o TRD1 –

(2)

(1) Shaded cells indicate configuration for compatibility with the MSP430 LaunchPad.

(2) Not recommended for BoosterPack use. This signal tied to on-board function via 0-Ωresistor.

Table 5. J4 Connector

Analog Tiva C GPIOPCTL Register Setting

On-

Function

J4 Series

GPIO board

Pin MCU

GPIO Function 1 2 3 4 5 6 7 8 9 14 15

AMSEL

4.01 PF2 – Blue LED 30 – SSI1Clk – M0FAULT0 M1PWM6 – T1CCP0 – – – TRD0

(R11)

4.02 PF3 – Green 31 – SSI1Fss CAN0Tx – M1PWM7 – T1CCP1 – – – TRCLK

LED

(R12)

4.03 PB3 – – 48 – – I2C0SDA – – – T3CCP1 – – – –

4.04 PC4 C1– – 16 U4Rx U1Rx – M0PWM6 – IDX1 WT0CCP0 U1RTS – – –

4.05 PC5 C1+ – 15 U4Tx U1Tx – M0PWM7 – PhA1 WT0CCP1 U1CTS – – –

4.06 PC6 C0+ – 14 U3Rx – – – – PhB1 WT1CCP0 USB0EPE – – –

4.07 PC7 C0– – 13 U3Tx – – – – – WT1CCP1 USB0PFLT – – –

4.08 PD6 – – 53 U2Rx – – – – PhA0 WT5CCP0 – – – –

4.09 PD7 – – 10 U2Tx – – – – PhB0 WT5CCP1 NMI – – –

4.10(1) PF4 – USR_SW 5 – – – – M1FAULT0 IDX0 T2CCP0 USB0EPE – – –

1 (R13) N

(1) Not recommended for BoosterPack use. This signal tied to on-board function via 0-Ωresistor.

SPMU288A–August 2012–Revised April 2013 Tiva™ C Series EK-TM4C123GXL LaunchPad: BoosterPack Development

Guide

LaunchPad Power Interface

www.ti.com

4 LaunchPad Power Interface

The Tiva C Series LaunchPad has provisions to provide power to a BoosterPack through either the

BoosterPack Interface or the BoosterPack XL Interface. The configuration of power and ground pins on

both of these interfaces must be consistent across LaunchPads from all TI microcontroller families.

The TM4C123G LaunchPad draws power from either of the on-board USB interfaces as selected by the

power switch in the top left corner of the board. Typically, the USB connection provides 500 mA at 5 V to

the Tiva C Series LaunchPad. The selected USB power source is made directly available to the

BoosterPack XL Interface on the J3.01 pin. This pin is a direct connection with only small decoupling

capacitors provided on the Tiva C Series LaunchPad.

All LaunchPads, including the TM4C123G LaunchPad, also provide a 3.3-V supply on pin J1.01 of the

BoosterPack Interface. On the Tiva C Series LaunchPad, this supply is sourced by a TPS73633 LDO

voltage regulator which converts the selected 5-V USB power to 3.3 V. The regulator is capable of

sourcing 400 mA at 3.3 V. This 3.3-V supply is shared between the BoosterPack Interface, the in-circuit

debug interface (ICDI), and the target microcontroller. Therefore, under normal circumstances,

approximately 300 mA to 350 mA are available to the BoosterPack Interface. Detailed power management

is the responsibility of the BoosterPack developer who must also manage the application to be run on the

target microcontroller.

The TM4C123G LaunchPad can be powered through an external supply on a BoosterPack. If providing

power to the Tiva C Series LaunchPad from a BoosterPack, move the power select switch to select an

unused USB connection to prevent power bus contention between the BoosterPack and the USB

connection. Power may be supplied to either the 3.3-V or the 5.0-V system, but not both. Providing

external power to both 5 V and 3.3 V would result in a contention between the external power supplies

and the TM4C123G LaunchPad voltage regulator. Providing only 3.3 V results in some lost functionality

(for example, the on-board LEDs may not illuminate). It may also result in reverse current leakage through

the on-board voltage regulator. Therefore, if providing power externally, it is recommended to use either

the existing USB connections or an external 5-V supply from a BoosterPack.

Ground connections are available on pins J2.01 and J3.02. These pins provide a ground connection for

both the BoosterPack Interface and the BoosterPack XL Interface, respectively.

Additional power and ground pins are available through labeled pins located in the extreme lower corners

of the Tiva C Series LaunchPad. These pins are connected to the same 3.3 V, 5 V, and ground

connections as the pins on the BoosterPack Interface and the BoosterPack XL Interface.

6Tiva™ C Series EK-TM4C123GXL LaunchPad: BoosterPack Development SPMU288A–August 2012–Revised April 2013

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Special Consideration for Shared Pins

5 Special Consideration for Shared Pins

To provide compatibility with the MSP430 LaunchPad's BoosterPack interface as well as to provide a

maximum number of signals to the BoosterPack Interface and BoosterPack XL Interface, it was necessary

to route some signals to more than one pin. In addition, certain on-board functions such as the button and

LED signals are available on the BoosterPack Interface and BoosterPack XL Interface. A 0-Ωjumper

resistor was installed for signals that are used for more than one purpose or routed to more than one

GPIO. Removal of this jumper disconnects the functions. All jumpers are installed by default. A listing of

these jumpers and the respective use of each is provided in Table 6.

Table 6. Tiva C Series LaunchPad Jumper List

Resistor Primary Function Alternate Function Comments

R1 Right User Switch J2.04 Test pin on MSP430 LaunchPad. This connection

along with R13 provides Hibernate wake to

BoosterPack Interface

R2 Red LED To PF1 and J3.10 If removed: allows extra GPIO to the BoosterPack

XL Interface.

If installed (default): allows BoosterPack to drive

LED or sense LED state. Also provides Embedded

Trace signal TRD1.

R8 Hibernate Wake To PF0 and J2.04 via Allows user switch 2 to wake device from

R1 hibernate. Also ties wake to J2.04 to allow

BoosterPack to wake Stellaris LaunchPad from

Hibernate.

R9 PB6 SSI2 TX on J2.07 PD0 I2C SCL on J2.07 Routes I2C from PD0 to J2.07 for MSP430-Tiva C

Series LaunchPad compatibility. If using PD0 or

PB6, the unused GPIO must be configured as an

input or R9 removed.

R10 PB7 SSI2 RX on J2.06 PD1 I2C SDA on J2.06 Routes I2C from PD1 to J2.06 for MSP430-Tiva C

Series LaunchPad compatibility. If using PD1 or

PB7, the unused GPIO must be configured as an

input or R9 removed.

R11 Blue LED To PF2 and J4.01 If removed: allows extra GPIO to the BoosterPack

XL Interface.

If installed (default): allows BoosterPack to drive

LED or sense LED state Also provides Embedded

Trace signal TRD0.

R12 Green LED To PF3 and J4.02 If removed: allows extra GPIO to the BoosterPack

XL Interface.

If installed (default): allows BoosterPack to drive

LED or sense LED state. Also provides Embedded

Trace signal TRDCLK.

R13 Left User Switch To PF4 and J4.10 If removed: allows extra GPIO to the BoosterPack

XL Interface.

If installed (default): allows BoosterPack to

simulate switch press or sense switch state.

6 Tiva C Series LaunchPad Dimensions and Mating

See Figure 2 for a dimensional drawing of the Stellaris LaunchPad. J1 and J2 are 1.8 in (4,572 cm) apart

and constitute the BoosterPack interface. J3 and J4 are 1.6 in (4,064 cm) apart and constitute the

BoosterPack XL Interface. Other major board signals are available on unpopulated headers on a 0.1-in

(2,54-mm) grid. Dimensions to these signals are provided for convenience. These signals are subject to

change or move across revisions of the Tiva C Series LaunchPad or future LaunchPads. It is

recommended that BoosterPacks use only the BoosterPack Interface and BoosterPack XL Interface. Use

of other pins and signals is acceptable, but these pins and signals can change at any time.

SPMU288A–August 2012–Revised April 2013 Tiva™ C Series EK-TM4C123GXL LaunchPad: BoosterPack Development

Guide

BoosterPack Design Guidelines

www.ti.com

Figure 2. Tiva C Series LaunchPad Dimensions

NOTE: Units are in mils (one thousandth of an inch): 1 mil = 0.001 inch (0.0254 mm).

7 BoosterPack Design Guidelines

Follow these guidelines when designing your BoosterPack:

• BoosterPacks should not extend more than 0.350 in (8,89 mm) above the center of the top

BoosterPack Interface pin.

• BoosterPacks should not extend more than 0.150 in (3,81 mm) below the center of the bottom pin of

the BoosterPack Interface.

NOTE: BoosterPacks that extend more than 0.150 in (3,81 mm) below the center of the bottom pin

will partially cover the Tiva C Series LaunchPad user switches, which can result in lost user

access to those user inputs.

• BoosterPacks are not restricted in width and may extend as much as desired left and right of the Tiva

C Series LaunchPad.

• For BoosterPacks with RF antennas, place the antenna to the left or right of the Tiva C Series

LaunchPad for minimal interference and signal attenuation.

• The BoosterPack interface does not provide any means of keying or alignment guidance. It is

recommended that visual cues be provided on the BoosterPack to assist user in proper orientation of

the BoosterPack.

• If possible, design the BoosterPack so that incorrect mating to a Tiva C Series LaunchPad does not

damage the BoosterPack.

8Tiva™ C Series EK-TM4C123GXL LaunchPad: BoosterPack Development SPMU288A–August 2012–Revised April 2013

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References and Schematics

8 References and Schematics

8.1 References

In addition to this document, the following references are available for download at www.ti.com:

• Tiva C Series TM4C123GH6PM Microcontroller Data Sheet (literature number SPMS376).

• Tiva C Series LaunchPad (EK-TM4C123GXL) User Guide. Available for download at

www.ti.com/tool/ek-tm4c123gxl

• TivaWare for C Series Driver Library. Available for download at www.ti.com/tool/sw-tm4c-drl.

• TivaWare for C Series Driver Library User’s Manual (literature number SPMU298).

• TPS73633 Low-Dropout Regulator with Reverse Current Protection Data Sheet (literature number

SBVS038)

8.2 Schematics

This section contains the complete schematics for the Tiva C Series LaunchPad board.

• Microcontroller, USB, Expansion, Buttons, and LED

• Power Management

• In-Circuit Debug Interface

SPMU288A–August 2012–Revised April 2013 Tiva™ C Series EK-TM4C123GXL LaunchPad: BoosterPack Development

Guide

www.ti.com



108 WILD BASIN ROAD, SUITE 350



AUSTIN TX, 78746



TIVA MICROCONTROLLERS



TEXAS INSTRUMENTS



0.3



EK-TM4C123GXL



Tiva TM4C123G LaunchPad



Microcontroller, USB, Expansion, Buttons and LED



DGT



2/20/2013



EK-TM4C123GXL Rev A.sch



SHEET



PART NO.



DATE



REVISION



DESIGNER



FILENAME



DESCRIPTION



PROJECT



J1 and J2 provide compatability with



Booster Packs designed for MSP430 Launchpad



J3 and J4 sit 100 mils inside J1 and J2 to provide



extended functions specific to this board.



See the board user manual for complete table of pin mux functions



D-

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D+



CON-USB-MICROAB



CON_110_100



CON_110_100



SW1

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SW2



330



CON_110_100

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CON_110_100

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PB6

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PB7

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PF4

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PE3

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PE2

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PE1

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PE0

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PD7

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PC7

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PC6

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PC5

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PC4



PA0



PA1



PA2

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PA3

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PA4

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PA5

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PA6

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PA7

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PF0

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PF1

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PF2

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PF3

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PD4

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PD5

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PB0

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PB1

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PB2

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PB3

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PC3

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PC2

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PC1

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PC0

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PD6

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PB4



PB5

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PE4

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PE5

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PD0

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PD1

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PD2



PD3

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U1-A



TM4C123G



RGB_LED_0404_COMA



R10



R11



R12



R13



R14



330



DTC114EET1G



330



DTC114EET1G



330



DTC114EET1G



R25



R29



USB_DM



USB_DP



DEBUG/VCOM



GPIO



GPIO



PA2



PA3

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PA4

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PA5

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PA6

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PA7

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PB0

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PB1

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PB2

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PB3

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PB4

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PB5

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PB6

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PB7

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PC4

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PC5

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PC6

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PC7

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PD0

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PD1

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PD2

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PD3

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PD6

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PD7

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PE0

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PE1

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PE2

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PE3

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PE4

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PE5

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PA0/U0RX_VCP_TXD

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PA1/U0TX_VCP_RXD



DEBUG_PC0/TCK/SWCLK



DEBUG_PC1/TMS/SWDIO



DEBUG_PC2/TDI



DEBUG_PC3/TDO/SWO



USB_DM



USB_DP



USR_SW2



USR_SW1



GPIO



PB0

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PB1

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PB4

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PB7

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PB6

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+3.3V



USR_SW2



USR_SW1



+USB_VBUS



WAKE



PB6

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PB7

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TARGETRST

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PF4

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PF3

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PF2

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PF1

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PF0

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PF4

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PD7

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+VBUS

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PF2

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PF3



PB2



+VBUS



LED_B



PB5



PE4



PE5



PA6



PA2



PA3



PA4



PF0



PE0



PF1



PB3



PC4



PC5



PC6



PC7



PD6



PA5



PA7



PD0



PD1



PD2



PD3



PE1



PE2



PE3



PD0



PD1



LED_G



LED_R



LED_R



LED_B



LED_G



PB1



PB0



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