Panasonic TDA-600 Manual de usuario

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distribution is a violation of law.

KX-TDA600CE

(for Europe)

Hybrid IP-PBX

IMPORTANT INFORMATION ABOUT LEAD FREE, (PbF), SOLDERING

If lead free solder was used in the manufacture of this product the printed circuit boards will be marked PbF.

Standard leaded, (Pb), solder can be used as usual on boards without the PbF mark.

When this mark does appear please read and follow the special instructions described in this manual on the use of PbF and how

it might be permissible to use Pb solder during service and repair work.

ORDER NO. KMS0510151CE

1 ABOUT LEAD FREE SOLDER (PbF: Pb free) 3

1.1. SUGGESTED PbF SOLDER 3

1.2. HOW TO RECOGNIZE THAT Pb FREE SOLDER IS

USED 4

2 FOR SERVICE TECHNICIANS 5

3 CAUTION 5

3.1. NOTE 5

3.2. SAFETY PRECAUTIONS 5

3.3. INSULATION RESISTANCE TEST 5

3.4. BATTERY CAUTION 5

3.5. CAUTION 5

4 SPECIFICATIONS 6

4.1. GENERAL DESCRIPTION 6

4.2. CHARACTERISTICS 6

4.3. SYSTEM CONSTRUCTION 7

4.4. SYSTEM CAPACITY 11

5 SYSTEM OVERVIEW 14

5.1. SYSTEM CONFIGURATIONS 14

5.2. SYSTEM COMPONENTS 15

5.3. SYSTEM CONNECTION DIAGRAM 17

6 DISASSEMBLY INSTRUCTIONS 19

6.1. DISASSEMBLY INSTRUCTION (EMPR CARD) 19

6.2. DISASSEMBLY INSTRUCTION (BACK BOARD) 20

7 OUTLINE 22

7.1. GENERAL DESCRIPTION 22

7.2. SYSTEM CONTROL 23

7.3. BACK BOARD SIGNAL CONNECTION DIAGRAM 26

8 EMPR CARD CIRCUIT OPERATION 29

8.1. EMPR CARD 29

9 BACK BOARD CIRCUIT OPERATION 37

10 TROUBLESHOOTING GUIDE 38

10.1. EMPR 38

11 DIAGNOSIS 62

11.1. DIAGNOSIS FEATURES 62

11.2. DIAGNOSIS TEST 67

12 IC DATA 72

12.1. CPU (IC200) 72

12.2. ASIC (IC102) 76

13 TERMINAL GUIDE OF ICS, TRANSISTORS AND DIODES 81

14 HOW TO REPLACE A FLAT PACKAGE IC 82

14.1. PREPARATION 82

14.2. REMOVAL PROCEDURE 82

14.3. INSTALLATION PROCEDURE 82

14.4. REMOVING SOLDER FROM BETWEEN PINS 82

15 CABINET AND ELECTRICAL PARTS LOCATION 83

15.1. EXTENSION BOARDS FOR SERVICING 84

16 ACCESSORIES AND PACKING MATERIALS 85

17 REPLACEMENT PARTS LIST 86

17.1. CABINET AND ELECTRICAL PARTS 86

17.2. ACCESSORIES AND PACKING MATERIALS 86

17.3. EMPR BOARD PARTS 87

17.4. BB-B1 BOARD PARTS 92

17.5. BB-B2 BOARD PARTS 93

17.6. FIXTURES AND TOOLS 93

18 FOR THE SCHEMATIC DIAGRAM 94

18.1. WAVEFORM 95

18.2. EMPR BLOCK DIAGRAM 97

19 SCHEMATIC DIAGRAM 98

19.1. EMPR CARD No.1 98

19.2. EMPR CARD No.2 102

19.3. EMPR CARD No.3 106

19.4. EMPR CARD No.4 110

19.5. EMPR CARD No.5 114

19.6. EMPR CARD No.6 118

19.7. BB-B1 BOARD No.1 122

19.8. BB-B1 BOARD No.2 124

19.9. BB-B1 BOARD No.3 126

19.10. BB-B2 BOARD 128

19.11. MEMO 129

20 PRINTED CIRCUIT BOARD 130

20.1. EMPR BOARD 130

20.2. BB-B1 BOARD 132

20.3. BB-B2 BOARD 133

CONTENTS

Page Page

KX-TDA600CE

1 ABOUT LEAD FREE SOLDER (PbF: Pb free)

Note:

In the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard solder or solder that

contains lead.

We will use PbF when discussing the lead free solder used in our manufacturing process which is made from Tin, (Sn), Silver,

(Ag), and Copper, (Cu).

This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repair

work we suggest using the same type of solder although, with some precautions, standard Pb solder can also be used.

Caution

•

• •

• PbF solder has a melting point that is 50° ~ 70° F, (30° ~ 40°C) higher than Pb solder. Please use a soldering iron with

temperature control and adjust it to 700° ± 20° F, (370° ± 10°C). In case of using high temperature soldering iron, please

be careful not to heat too long.

•

• •

• PbF solder will tend to splash if it is heated much higher than its melting point, approximately 1100°F, (600°C).

•

• •

• If you must use Pb solder on a PCB manufactured using PbF solder, remove as much of the original PbF solder as possible

and be sure that any remaining is melted prior to applying the Pb solder.

•

• •

• When applying PbF solder to double layered boards, please check the component side for excess which may flow onto the

opposite side (See figure, below).

1.1. SUGGESTED PbF SOLDER

There are several types of PbF solder available commercially. While this product is manufactured using Tin, Silver, and Copper,

(Sn+Ag+Cu), you can also use Tin and Copper, (Sn+Cu), or Tin, Zinc, and Bismuth, (Sn+Zn+Bi). Please check the manufac

turer’s specific instructions for the melting points of their products and any precautions for using their product with other

materials.

The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3mm, 0.6mm and 1.0mm.

KX-TDA600CE

1.2. HOW TO RECOGNIZE THAT Pb FREE SOLDER IS USED

KX-TDA600CE

2 FOR SERVICE TECHNICIANS

ICs and LSIs are vulnerable to static electricity.

When repairing, the following precautions will help prevent recurring malfunctions.

1. Cover the plastic parts boxes with aluminum foil.

2. Ground the soldering irons.

3. Use a conductive mat on the worktable.

4. Do not touch IC or LSI pins with bare fingers.

3 CAUTION

3.1. NOTE

When you note the serial number, write down all of the 11 digits.

The serial number may be found on the label affixed to the bottom of the unit.

3.2. SAFETY PRECAUTIONS

1. Before servicing, unplug the power cord to prevent an electric shock.

2. When replacing parts, use only the manufacturer´s recommended components for safety.

3. Check the condition of the power cord. Replace if wear or damage is evident.

4. After servicing, be sure to restore the lead dress, insulation barriers, insulation papers, shields, etc.

5. Before returning the serviced equipment to the customer, be sure to perform the following insulation resistance test to prevent

the customer from being exposed to shock hazards.

3.3. INSULATION RESISTANCE TEST

1. Unplug the power cord and short the two prongs of the plug with a jumper wire.

2. Turn on the power switch.

3. Measure the resistance value with ohmmeter between the jumpered AC plug and each exposed metal cabinet part, such as

screw threads, control shafts, handle brackets, etc.

Note:

Some exposed parts may be isolated from the chassis by design. These will read infinity.

4. If the measurement is outside the specified limits, there is a possibility of shock hazard. The equipment should be repaired and

rechecked before it is returned to the customer.

3.4. BATTERY CAUTION

1. Danger of explosion if battery is incorrectly replaced. Replace only with the same or equivalent type recommended by the

manufacturer. Dispose of used batteries according to the manufacturer’s Instructions.

2. The lithium battery is a critical component (type No.CR23541). Please observe for the proper polarity and the exact location

when replacing it and soldering the replacement lithium battery in.

3.5. CAUTION

The power socket wall outlet should be located near this equipment and be easily accessible.

KX-TDA600CE

4 SPECIFICATIONS

4.1. GENERAL DESCRIPTION

Control Bus Original bus (16 bit, 8 MHz,10 megabytes per second)

Communication Bus H.100 bus conformity (1024 time slot)

Switching Distributed Switching

Power Input PSU-M 100 V AC to 130 V AC, 2.5 A/200 V AC to 240 V AC, 1.4 A, 50 Hz/60 Hz

PSU-L 100 V AC to 130 V AC, 5.1 A/200 V AC to 240 V AC, 2.55 A, 50 Hz/60 Hz

External Battery +36 V DC (+12 V DC x 3, recommended maximum current per shelf is 28 Ah or lower)

Maximum Power Failure Tolerance 300 ms (without using backup battery)

Memory Backup Duration 7 years

Dialling Trunk Dial Pulse (DP) 10 pps, 20 pps

Tone (DTMF) Dialling

Extension Dial Pulse (DP) 10 pps, 20 pps

Tone (DTMF) Dialling

Mode Conversion DP-DTMF, DTMF-DP

Ring Frequency 20 Hz/25 Hz (selectable)

Trunk Loop Limit 1600 Ωmaximum

Operating

Environment

Temperature 0°Cto40°C

Humidity 10%to 90% (non-condensing)

Conference Call Trunk (per shelf) From 10 x 3-party conference call to 4 x 8-party conference call

Music on Hold (MOH) 2 ports (Level Control: -11 dB to +11 dB in 1 dB steps)

MOH1: External Music Source port

MOH2: Selectable Internal/External Music Source port

Paging Internal Level Control: -15 dB to +6 dB in 3 dB steps

External 2 ports (Volume Control: -15 dB to +15 dB in 1 dB steps)

Serial Interface Port RS-232C 1 (max 115.2 kbps)

USB 1

Extension Connection Cable SLT 1 pair wire (T, R)

DPT 1-pair wire (D1, D2) or

2-pair wire (T, R, D1, D2)

APT 2-pair wire (T, R, D1, D2)

PT-interface CS 1-pair wire (D1, D2)

DSS Consoles and Add-on Key Module 1-pair wire (D1, D2)

Dimension Basic Shelf 430 mm (W) x 415 mm (H) x 270 mm (D)

(17 1/5 in x 16 3/5 in x 10 4/5 in)

Weight (when fully mounted) Basic Shelf Under 16 kg (35.2 lb)

4.2. CHARACTERISTICS

Terminal Equipment Loop Limit

•

• •

• PT: KX-T7600 series DPT: 90 Ω; all other DPTs/APTs: 40 Ω

•

• •

• SLT: 600 Ωincluding set

•

• •

• Doorphone: 20 Ω

•

• •

• CS: 130 Ω; PT-interface CS: 65 Ω

Minimum Leakage Resistance 15000 Ωmaximum

Maximum Number of Extension

Instruments per Line

1 for PT or SLT

2 by Parallel or eXtra Device Port connection of an APT/DPT and an SLT

3 by Digital eXtra Device Port connection of 2 DPTs and an SLT

Ring Voltage 75 Vrms at 20 Hz/25 Hz depending on the Ringing Load

Trunk Loop Limit 1600 Ωmaximum

Hookswitch Flash/Recall Timing Range 24 ms to 2032 ms

BRI Cards Internal ISDN Mode Supply Voltage: 40 V

Power Supply (BRI4): 4.5 W per 1 line, 10 W per 4 lines

Power Supply (BRI8): 4.5 W per 1 line, 20 W per 8 lines

Power Supply Method: Phantom Power Supply

Door Opener Current Limit 24 V DC/30 V AC, 1 A maximum

External Relay Current Limit 24 V DC/30 V AC, 1 A maximum

External Sensor Current Limit Power to the external sensor is provided from the EIO4 card and must be grounded through

the EIO4 card. The Hybrid IP-PBX detects input from the sensor when the signal is under

100 Ω

Paging Terminal Impedance 600 Ω

MOH (Music on Hold) Terminal Impedance 10000 Ω

KX-TDA600CE

4.3. SYSTEM CONSTRUCTION

4.3.1. Basic System

Basic Shelf

The Basic Shelf contains an EMPR card for controlling the Hybrid IP-PBX. To use the basic system, install a power supply unit

(PSU) in the PSU Slot and optional service cards in Free Slots. To expand to a multiple-shelf system, you also need to install

a BUS-M card in the BUS-M Card Slot.

Construction of the Basic Shelf

KX-TDA600CE

2-shelf System

Expanded system (Basic Shelf + 1 Expansion Shelf). Expansion Shelf 1 is mounted on the Basic Shelf.

Note

If you are installing a 2-shelf system in an area prone to earthquakes, make sure to fix the system to the wall using the wall

brackets (supplied with an optional Mounting Kit).

3-shelf System (Tower Type)

Expanded system (Basic Shelf + 2 Expansion Shelves). Expansion Shelves 1 and 2 are mounted on the Basic Shelf. A

Mounting Kit is required for the 3-shelf system.

KX-TDA600CE

4-shelf System (Tower Type)

Fully expanded system (Basic Shelf + 3 Expansion Shelves). Expansion Shelves 1 to 3 are mounted on the Basic Shelf. A

Mounting Kit is required for the 4-shelf system.

KX-TDA600CE

4-shelf System (Side-by-side Type)

When vertical space is limited, it is possible to install a fully expanded system (Basic Shelf + Expansion Shelf 1, and Expansion

Shelf 2 + Expansion Shelf 3) in a side-by-side configuration. Expansion Shelf 1 is mounted on the Basic Shelf, and Expansion

Shelf 3 is mounted on Expansion Shelf 2. Installing the system using base stands (supplied with an optional Mounting Kit)

makes it easy to reinstall shelves in a different place.

KX-TDA600CE

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