Freescale Semiconductor *KE02 Series Manual de instrucciones

MKE02P64M20SF0

KE02 Sub-Family

Supports the following:

MKE02Z16VLC2(R),

MKE02Z32VLC2(R),

MKE02Z64VLC2(R),

MKE02Z16VLD2(R),

MKE02Z32VLD2(R),

MKE02Z64VLD2(R),

MKE02Z32VLH2(R),

MKE02Z64VLH2(R),

MKE02Z32VQH2(R), and

MKE02Z64VQH2(R)

Key features

•Operating characteristics

– Voltage range: 2.7 to 5.5 V

– Flash write voltage range: 2.7 to 5.5 V

– Temperature range (ambient): -40 to 105°C

• Performance

– Up to 20 MHz ARM® Cortex-M0+ core

– Single cycle 32-bit x 32-bit multiplier

– Single cycle I/O access port

• Memories and memory interfaces

– Up to 64 KB flash

– Up to 256 B EEPROM

– Up to 4 KB RAM

• Clocks

– Oscillator (OSC) - loop-controlled Pierce

oscillator, crystal or ceramic resonator range of

31.25 kHz to 39.0625 kHz or 4 MHz to 20 MHz

– Internal clock source (ICS) - internal FLL with

internal or external reference, precision

trimming of internal reference allowing 1%

deviation across temperature range of 0 °C to

70 °C and 1.5% deviation across temperature

range of -40 °C to 105 °C, up to 20 MHz

– Internal 1 kHz low-power oscillator (LPO)

• System peripherals

– Power management module (PMC) with three

power modes: Run, Wait, Stop

– Low-voltage detection (LVD) with reset or

interrupt, selectable trip points

– Watchdog with independent clock source

(WDOG)

– Programmable cyclic redundancy check module

(CRC)

– Serial wire debug interface (SWD)

– Bit manipulation engine (BME)

• Security and integrity modules

– 64-bit unique identification (ID) number per chip

• Human-machine interface

– Up to 57 general-purpose input/output (GPIO)

– Two 8-bit keyboard interrupt modules (KBI)

– Interrupt (IRQ)

• Analog modules

– One 16-channel 12-bit SAR ADC, operation in

Stop mode, optional hardware trigger (ADC)

– Two analog comparators containing a 6-bit

DAC and programmable reference input

(ACMP)

• Timers

– One 6-channel FlexTimer/PWM (FTM)

– Two 2-channel FlexTimer/PWM (FTM)

– One 2-channel periodic interrupt timer (PIT)

– One real-time clock (RTC)

Freescale Semiconductor Document Number MKE02P64M20SF0

Data Sheet: Technical Data Rev 3, 07/2013

Freescale reserves the right to change the detail specifications as may be

required to permit improvements in the design of its products.

• Communication interfaces

– Two SPI modules (SPI)

– Three UART modules (UART)

– One I2C module (I2C)

• Package options

– 64-pin QFP/LQFP

– 44-pin LQFP

– 32-pin LQFP

KE02 Sub-Family Data Sheet, Rev3, 07/2013.

2 Freescale Semiconductor, Inc.

Table of Contents

1 Ordering parts...........................................................................4

1.1 Determining valid orderable parts......................................4

2 Part identification......................................................................4

2.1 Description.........................................................................4

2.2 Format...............................................................................4

2.3 Fields.................................................................................4

2.4 Example............................................................................5

3Parameter classification............................................................5

4Ratings......................................................................................6

4.1 Thermal handling ratings...................................................6

4.2 Moisture handling ratings..................................................6

4.3 ESD handling ratings.........................................................6

4.4 Voltage and current operating ratings...............................6

5General.....................................................................................7

5.1 Nonswitching electrical specifications...............................7

5.1.1 DC characteristics.................................................7

5.1.2 Supply current characteristics...............................14

5.1.3 EMC performance.................................................15

5.2 Switching specifications.....................................................16

5.2.1 Control timing........................................................16

5.2.2 FTM module timing...............................................17

5.3 Thermal specifications.......................................................18

5.3.1 Thermal characteristics.........................................18

6 Peripheral operating requirements and behaviors....................19

6.1 Core modules....................................................................19

6.1.1 SWD electricals ....................................................19

6.2 External oscillator (OSC) and ICS characteristics.............20

6.3 NVM specifications............................................................22

6.4 Analog...............................................................................23

6.4.1 ADC characteristics...............................................24

6.4.2 Analog comparator (ACMP) electricals.................26

6.5 Communication interfaces.................................................27

6.5.1 SPI switching specifications..................................27

7 Dimensions...............................................................................30

7.1 Obtaining package dimensions.........................................30

8 Pinout........................................................................................31

8.1 Signal multiplexing and pin assignments...........................31

8.2 Device pin assignment......................................................33

9 Revision history.........................................................................34

KE02 Sub-Family Data Sheet, Rev3, 07/2013.

Freescale Semiconductor, Inc. 3

Ordering parts

1.1 Determining valid orderable parts

Valid orderable part numbers are provided on the web. To determine the orderable part

numbers for this device, go to freescale.com and perform a part number search for the

following device numbers: KE02Z.

Part identification

2.1 Description

Part numbers for the chip have fields that identify the specific part. You can use the

values of these fields to determine the specific part you have received.

2.2 Format

Part numbers for this device have the following format:

Q KE## A FFF R T PP CC N

2.3 Fields

This table lists the possible values for each field in the part number (not all combinations

are valid):

Field Description Values

Q Qualification status • M = Fully qualified, general market flow

• P = Prequalification

KE## Kinetis family • KE02

A Key attribute • Z = M0+ core

FFF Program flash memory size • 16 = 16 KB

• 32 = 32 KB

• 64 = 64 KB

R Silicon revision • (Blank) = Main

• A = Revision after main

Table continues on the next page...

Ordering parts

KE02 Sub-Family Data Sheet, Rev3, 07/2013.

4 Freescale Semiconductor, Inc.

Field Description Values

T Temperature range (°C) • V = –40 to 105

PP Package identifier • LC = 32 LQFP (7 mm x 7 mm)

• LD = 44 LQFP (10 mm x 10 mm)

• QH = 64 QFP (14 mm x 14 mm)

• LH = 64 LQFP (10 mm x 10 mm)

CC Maximum CPU frequency (MHz) • 2 = 20 MHz

N Packaging type • R = Tape and reel

• (Blank) = Trays

2.4 Example

This is an example part number:

MKE02Z64VQH2

3 Parameter classification

The electrical parameters shown in this supplement are guaranteed by various methods.

To give the customer a better understanding, the following classification is used and the

parameters are tagged accordingly in the tables where appropriate:

Table 1. Parameter classifications

P Those parameters are guaranteed during production testing on each individual device.

C Those parameters are achieved by the design characterization by measuring a statistically relevant sample size

across process variations.

T Those parameters are achieved by design characterization on a small sample size from typical devices under

typical conditions unless otherwise noted. All values shown in the typical column are within this category.

D Those parameters are derived mainly from simulations.

NOTE

The classification is shown in the column labeled “C” in the

parameter tables where appropriate.

Parameter classification

KE02 Sub-Family Data Sheet, Rev3, 07/2013.

Freescale Semiconductor, Inc. 5

Ratings

4.1 Thermal handling ratings

Symbol Description Min. Max. Unit Notes

TSTG Storage temperature –55 150 °C 1

TSDR Solder temperature, lead-free — 260 °C 2

1. Determined according to JEDEC Standard JESD22-A103, High Temperature Storage Life.

2. Determined according to IPC/JEDEC Standard J-STD-020, Moisture/Reflow Sensitivity Classification for Nonhermetic

Solid State Surface Mount Devices.

4.2 Moisture handling ratings

Symbol Description Min. Max. Unit Notes

MSL Moisture sensitivity level — 3 — 1

1. Determined according to IPC/JEDEC Standard J-STD-020, Moisture/Reflow Sensitivity Classification for Nonhermetic

Solid State Surface Mount Devices.

4.3 ESD handling ratings

Symbol Description Min. Max. Unit Notes

VHBM Electrostatic discharge voltage, human body model –6000 +6000 V 1

VCDM Electrostatic discharge voltage, charged-device model –500 +500 V

ILAT Latch-up current at ambient temperature of 105°C –100 +100 mA

1. Determined according to JEDEC Standard JESD22-A114, Electrostatic Discharge (ESD) Sensitivity Testing Human Body

Model (HBM).

4.4 Voltage and current operating ratings

Absolute maximum ratings are stress ratings only, and functional operation at the

maxima is not guaranteed. Stress beyond the limits specified in the following table may

affect device reliability or cause permanent damage to the device. For functional

operating conditions, refer to the remaining tables in this document.

Ratings

KE02 Sub-Family Data Sheet, Rev3, 07/2013.

6 Freescale Semiconductor, Inc.

This device contains circuitry protecting against damage due to high static voltage or

electrical fields; however, it is advised that normal precautions be taken to avoid

application of any voltages higher than maximum-rated voltages to this high-impedance

circuit. Reliability of operation is enhanced if unused inputs are tied to an appropriate

logic voltage level (for instance, either VSS or VDD) or the programmable pullup resistor

associated with the pin is enabled.

Table 2. Voltage and current operating ratings

Symbol Description Min. Max. Unit

VDD Supply voltage –0.3 6.0 V

IDD Maximum current into VDD — 120 mA

VDIO Digital input voltage (except RESET, EXTAL, and XTAL) –0.3 VDD + 0.3 V

VAIO Analog1, RESET, EXTAL, and XTAL input voltage –0.3 VDD + 0.3 V

IDInstantaneous maximum current single pin limit (applies to all

port pins)

–25 25 mA

VDDA Analog supply voltage VDD – 0.3 VDD + 0.3 V

1. Analog pins are defined as pins that do not have an associated general-purpose I/O port function.

General

Nonswitching electrical specifications

5.1.1 DC characteristics

This section includes information about power supply requirements and I/O pin

characteristics.

Table 3. DC characteristics

Symbol C Descriptions Min Typical1Max Unit

— — Operating voltage — 2.7 — 5.5 V

VOH P Output high

voltage

All I/O pins, standard-

drive strength

5 V, Iload = –

5 mA

VDD – 0.8 — — V

C 3 V, Iload = –

2.5 mA

VDD – 0.8 — — V

P High current drive

pins, high-drive

strength

5 V, Iload = –

20 mA

VDD – 0.8 — — V

C 3 V, Iload = –

10 mA

VDD – 0.8 — — V

Table continues on the next page...

5.1

General

KE02 Sub-Family Data Sheet, Rev3, 07/2013.

Freescale Semiconductor, Inc. 7

Table 3. DC characteristics (continued)

Symbol C Descriptions Min Typical1Max Unit

IOHT D Output high

current

Max total IOH for all

ports

5 V — — –100 mA

3 V — — –60

VOL P Output low

voltage

All I/O pins, standard-

drive strength

5 V, Iload = 5

— — 0.8 V

C 3 V, Iload =

2.5 mA

— — 0.8 V

P High current drive

pins, high-drive

strength2

5 V, Iload

=20 mA

— — 0.8 V

C 3 V, Iload =

10 mA

— — 0.8 V

IOLT D Output low

current

Max total IOL for all

ports

5 V — — 100 mA

3 V — — 60

VIH P Input high

voltage

All digital inputs VDD>4.5 V 0.70 × VDD — — V

VDD>2.7 V 0.75 × VDD — —

VIL P Input low

voltage

All digital inputs VDD>4.5 V — — 0.30 × VDD V

VDD>2.7 V — — 0.35 × VDD

Vhys C Input

hysteresis

All digital inputs — 0.06 × VDD — — mV

|IIn| P Input leakage

current

All input only pins

(per pin)

VIN = VDD or

VSS

— 0.1 1 µA

|IOZ| C Hi-Z (off-

state) leakage

current

All input/output (per

pin)

VIN = VDD or

VSS

— 0.1 1 µA

|IOZTOT| C Total leakage

combined for

all inputs and

Hi-Z pins

All input only and I/O VIN = VDD or

VSS

— — 2 µA

RPU P Pullup

resistors

All digital inputs,

when enabled

— 30.0 — 50.0 kΩ

IIC D DC injection

current3, 4, 5Single pin limit VIN < VSS,

VIN > VDD

-0.2 — 2 mA

Total MCU limit,

includes sum of all

stressed pins

-5 — 25

CIn C Input capacitance, all pins — — — 7 pF

VRAM C RAM retention voltage — 2.0 — — V

1. Typical values are measured at 25 °C. Characterized, not tested.

2. Only PTB4, PTB5, PTD0, PTD1, PTE0, PTE1, PTH0, and PTH1 support ultra high current output.

3. All functional non-supply pins, except for PTA2 and PTA3, are internally clamped to VSS and VDD.

4. Input must be current limited to the value specified. To determine the value of the required current-limiting resistor,

calculate resistance values for positive and negative clamp voltages, then use the large value.

5. Power supply must maintain regulation within operating VDD range during instantaneous and operating maximum current

conditions. If the positive injection current (VIn > VDD) is higher than IDD, the injection current may flow out of VDD and could

result in external power supply going out of regulation. Ensure that external VDD load will shunt current higher than

maximum injection current when the MCU is not consuming power, such as no system clock is present, or clock rate is

very low (which would reduce overall power consumption).

Nonswitching electrical specifications

KE02 Sub-Family Data Sheet, Rev3, 07/2013.

8 Freescale Semiconductor, Inc.

Table 4. LVD and POR specification

Symbol C Description Min Typ Max Unit

VPOR D POR re-arm voltage11.5 1.75 2.0 V

VLVDH C Falling low-voltage detect

threshold—high range (LVDV

= 1)2

4.2 4.3 4.4 V

VLVW1H C Falling low-

voltage

warning

threshold—

high range

Level 1 falling

(LVWV = 00)

4.3 4.4 4.5 V

VLVW2H C Level 2 falling

(LVWV = 01)

4.5 4.5 4.6 V

VLVW3H C Level 3 falling

(LVWV = 10)

4.6 4.6 4.7 V

VLVW4H C Level 4 falling

(LVWV = 11)

4.7 4.7 4.8 V

VHYSH C High range low-voltage

detect/warning hysteresis

— 100 — mV

VLVDL C Falling low-voltage detect

threshold—low range (LVDV

= 0)

2.56 2.61 2.66 V

VLVW1L C Falling low-

voltage

warning

threshold—

low range

Level 1 falling

(LVWV = 00)

2.62 2.7 2.78 V

VLVW2L C Level 2 falling

(LVWV = 01)

2.72 2.8 2.88 V

VLVW3L C Level 3 falling

(LVWV = 10)

2.82 2.9 2.98 V

VLVW4L C Level 4 falling

(LVWV = 11)

2.92 3.0 3.08 V

VHYSDL C Low range low-voltage detect

hysteresis

— 40 — mV

VHYSWL C Low range low-voltage

warning hysteresis

— 80 — mV

VBG P Buffered bandgap output 31.14 1.16 1.18 V

1. Maximum is highest voltage that POR is guaranteed.

2. Rising thresholds are falling threshold + hysteresis.

3. voltage Factory trimmed at VDD = 5.0 V, Temp = 25 °C

Nonswitching electrical specifications

KE02 Sub-Family Data Sheet, Rev3, 07/2013.

Freescale Semiconductor, Inc. 9

Typical IOH Vs. VDD-VOH (standard drive strength) (VDD = 5 V)

IOH(mA)

VDD-VOH(V)

Figure 1. Typical IOH Vs. VDD-VOH (standard drive strength) (VDD = 5 V)

Typical IOH Vs. VDD-VOH (standard drive strength) (VDD = 3 V)

IOH(mA)

VDD-VOH(V)

Figure 2. Typical IOH Vs. VDD-VOH (standard drive strength) (VDD = 3 V)

Nonswitching electrical specifications

KE02 Sub-Family Data Sheet, Rev3, 07/2013.

10 Freescale Semiconductor, Inc.

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