Ebyte E72-2G4M23S1A Manual de usuario

E72-2G4M23S1A

CC2630 ZigBee 6LoWPAN SMD Wireless Module

Chengdu Ebyte Electronic Technology Co.,Ltd. E72-2G4M23S1A User Manual 
Copyright ©2012–2018，成都亿佰特电子科技有限公司 1 
 
目录 
Introduction ............................................................................................................................................................................................2 
1 Brief Introduction......................................................................................................................................................................2 
2 Features .......................................................................................................................................................................................2 
3 Application .................................................................................................................................................................................2 
Specification and parameter ................................................................................................................................................................3 
1 Limit parameter .........................................................................................................................................................................3 
2 Operating parameter .................................................................................................................................................................3 
Size and pin definition ..........................................................................................................................................................................4 
Basic operation.......................................................................................................................................................................................6 
1 Hardware design........................................................................................................................................................................6 
2 Programming..............................................................................................................................................................................6 
3 Connection instructions to the emulator ................................................................................................................................7 
FA Q..........................................................................................................................................................................................................8 
1 Co mmunicat ion range is too short .........................................................................................................................................8 
2 Module is easy to damage........................................................................................................................................................8 
3 BER(Bit Error Rate) is high ....................................................................................................................................................8 
Production guidance..............................................................................................................................................................................9 
1 Reflow soldering temperature .................................................................................................................................................9 
2 Reflow soldering curve ............................................................................................................................................................9 
E72 series ............................................................................................................................................................................................. 10 
Antenna recommendation.................................................................................................................................................................. 10 
1 Reco mmendation.................................................................................................................................................................... 10 
1 Antenna switch ....................................................................................................................................................................... 11 
Revision history ..................................................................................................................................................................................... 11 
About us .................................................................................................................................................................................................. 11 
 
 

Chengdu Ebyte Electronic Technology Co.,Ltd. E72-2G4M23S1A User Manual

1 Introduction

1.1 Brief Introduction

E72-2G4M05S1A is a self-developed, small-size, SMD,

ZigBee 6LoWPAN 100mw wireless module based on CC2630

of Texas Instruments.

The CC2630 integrates 128KB of in-system programmable

flash memory, 8KB of buffered static RAM (SRAM) and

ZigBee, 6LoWPAN wireless communication protocol. Because

of its unique ultra-low power sensor controller, it is ideal for

connecting external sensors. The analog and digital data are

collected autonomously while the rest of the system is in sleep

mode. Thanks to its built-in dual-core low-power processor, users can build a complete system based on their own

modules. We used a 24MHz industrial grade high precision low temperature drift active crystal.

Since this module is a SoC module, it needs to be programmed by user before it can be used.

1.2 Features

The measured communication distance can reach 150m/500m;

Maximum transmission power of 3.2 mW, software multi-level adjustable;

Built-in ZigBee, 6LoWPAN protocol stack;

Built-in 32.768kHz clock crystal oscillator;

Support the global license-free ISM 2.4 GHz band;

Built-in high performance low power consumption Cortex-M3 and Cortex-M0 dual core processor;

Rich resources, 128KB FLASH, 28KB RAM;

Support 1.8V~3.6V power supply, power supply over 3.3 V can guarantee the best performance;

Industrial grade standard design, support -40 ~ 85 °C for working over a long time;

IPEX and stamp hole optional, good for secondary development and integ ration.

1.3 Application

Home security alarm and remote keyless entry;

Wireless alarm security system;

Building automation solutions;

Wireless industrial-grade remote control;

Health care products;

Advanced Meter Reading Architecture(AMI);

Automotive industry applications.

Chengdu Ebyte Electronic Technology Co.,Ltd. E72-2G4M23S1A User Manual

2 Specification and parameter

2.1 Limit parameter

Mainparameter

Performance

Remark

Min

Max

Power supply（V）

3.8

Voltage over 3.6V will cause permanent

damage to module

Blocking power（dBm）

Chances of burn is slim when modules

are used in short distance

Operatingtemperature（℃）

-40

2.2 Operating parameter

Mainparameter

Performance

Remark

Min

Type

Max

Operatingvoltage（V）

1.8

3.3

3.8

≥3.3 V ensures output power

Communication level（V）

3.0

For 5V TTL,it may be at risk of burning

down

Operatingtemperature（℃）

-40

Industrial grade

Operatingfrequency（MHz）

2.402

2.480

Support ISM band

Power

Consump-

tion

TX current（mA）

182.5

Instant powerconsumption

RX current（mA）

11.1

Sleep current （μA）

1.4

Shut down by software

MaxTX power（dBm）

22.6

23.0

23.2

Receiving sensitivity（dBm）

-100.5

-102.0

-103.5

Air data rate is 250 kbps

Air data rate（bps）

250k

Controlled via user’s programming

Mainparameter

Description

Remark

Reference distance

500m/1500m

Test condition：clear and openarea, antenna gain: 5dBi，

antenna height: 2.5m，air data rate: 250 kbps

CrystalOscillator

24MHz /32.768KHz

Protocol

ZigBee

Package

SMD

Interface

1.27mm

CC2630F128RGZR

FLASH

128 KB

Chengdu Ebyte Electronic Technology Co.,Ltd. E72-2G4M23S1A User Manual

RAM

28 KB

Core

Cortex-M3+ Cortex-M0

Size

17.5 * 33.5 mm

Antenna

PCB / IPEX

50 ohm impedance

3 Size and pin definition

Chengdu Ebyte Electronic Technology Co.,Ltd. E72-2G4M23S1A User Manual

Pin No.

Item

Direction

Description

1、2、3

GND

Ground

DIO_0

Input/Output

General IO port, sensor controller (see CC26xx manual for details)

DIO_1

Input/Output

General IO port, sensor controller (see CC26xx manual for details)

DIO_2

Input/Output

General IO port, sensor controller (see CC26xx manual for details)

DIO_3

Input/Output

General IO port, sensor controller (see CC26xx manual for details)

DIO_4

Input/Output

General IO port,sensorcontroller (see CC26xx manual for details)

DIO_5

Input/Output

High drive General IO port, sensor controller (see CC26xx manual for details)

DIO_6

Input/Output

High drive General IO port, sensor controller (see CC26xx manual for details)

DIO_7

Input/Output

High drive General IO port, sensorcontroller (see CC26xx manual for details)

DIO_8

Input/Output

General IO port (seeCC26xx manual for details)

DIO_9

Input/Output

General IO port (seeCC26xx manual for details)

DIO_10

Input/Output

General IO port (seeCC26xx manual for details)

DIO_11

Input/Output

General IO port (seeCC26xx manual for details)

DIO_12

Input/Output

General IO port (seeCC26xx manual for details)

DIO_13

Input/Output

General IO port (seeCC26xx manual for details)

DIO_14

Input/Output

General IO port (seeCC26xx manual for details)

DIO_15

Input/Output

General IO port (seeCC26xx manual for details)

JTAG_TMS

Input/Output

JTAG_TMSC, High drive (see CC26xx manual for details)

JTAG_TCK

Input/Output

JTAG_TCKC, Highdrive (see CC26xx manual for details)

DIO_16

Input/Output

High drive General IO port, JTAG_TDO (seeCC26xx manual for details)

DIO_17

Input/Output

High drive General IO port, JTAG_TDI (seeCC26xx manual for details)

DIO_18

Input/Output

General IO port (seeCC26xx manual for details)

DIO_19

Input/Output

General IO port (seeCC26xx manual for details)

DIO_20

Input/Output

General IO port (seeCC26xx manual for details)

GND

Ground

DIO_21

Input/Output

General IO port (seeCC26xx manual for details)

VDD

Power supply, 1.8V - 3.6V

DIO_22

Input/Output

General IO port (seeCC26xx manual for details)

DIO_23

Input/Output

General IO port, sensor controller, Digital and analog (see CC26xx manual for details)

nRESET

Input

Reset, low level (see CC26xx manual for details)

DIO_24

Input/Output

General IO port, sensor controller, Digital and analog (see CC26xx manual for details)

DIO_25

Input/Output

General IO port, sensor controller, Digital and analog (see CC26xx manual for details)

DIO_26

Input/Output

General IO port, sensor controller, Digital and analog (see CC26xx manual for details)

DIO_27

Input/Output

General IO port, sensor controller, Digital and analog (see CC26xx manual for details)

DIO_28

Input/Output

General IO port, sensor controller, Digital and analog (see CC26xx manual for details)

DIO_29

Input/Output

General IO port, sensor controller, Digital and analog (see CC26xx manual for details)

DIO_30

Input/Output

General IO port, sensor controller, Digital and analog (see CC26xx manual for details)

40、

41、42

GND

Ground

Chengdu Ebyte Electronic Technology Co.,Ltd. E72-2G4M23S1A User Manual

4 Basic operation

4.1 Hardware design

It is recommended to use a DC stabilized power supply. The power supply ripple factor is as small as possible a nd

the module needs to be reliably grounded;

Please pay attention to the correct connection of the positive and negative poles of the power supply,

reverse connection may cause permanent damage to the module;

Please check the power supply to ensure that between the recommend ed supply voltage, if exceeding the maximum,

the module will be permanently damaged;

Please check the stability of the power supply. Voltage can not fluctuate greatly and frequently;

When designing the power supply circuit for the module, it is often recommended to reserve more than 30% of the

margin, so the whole machine is beneficial for long-term stable operation;

The module should be as far away as possible from the power supply, transformers, high -frequency wiring and other

parts with large electromagnetic interference;

Bottom LayerHigh-frequency digital routing, high-frequency analog routing, and power routing must be avoided

under the module. If it is necessary to pass through the module, assume that the module is soldered to the Top

Layer, and the copper is spread on the Top Layer of the module contact part(well grounded), it must be close to the

digital part of the module and routed in the Bottom Layer;

Assuming the module is soldered or placed over the Top Layer, it is wrong to randomly route over t he Bottom Layer

or other layers, which will affect the module's spurs and receiving sensitivity to varying degrees;

It is assumed that there are devices with large electromagnetic interference around the module that will greatly

affect the performance. It is recommended to keep them away from the module according to the strength of the

interference. If necessary, appropriate isolation and shielding can be done;

Assume that there are traces with large electromagnetic interference (high -frequency digital, high-frequency analog,

power traces) around the module that will greatly affect the performance of the module. It is recommended to st ay

away from the module according to the strength of the interference.If necessary, appropriate isolation and shie lding

can be done;

If the communication line uses a 5V level, a 1k-5.1k resistor must be connected in series (not recommended, there is

still a risk of damage);

Try to stay away from some physical layers such as TTL protocol at 2.4GHz , for example: USB3.0;

The mounting structure of antenna has a great influence on the performance of the module. It is necessary to en sure

that the antenna is exposed, preferably vertically upward. When the module is mounted inside the case, use a go od

antenna extension cable to extend the antenna to the outside;

The antenna must not be installed inside the metal case, which will cause the transmission distance to be great ly

weakened.

4.2 Programming

The core of this module is CC2630, its driving method is completely equivalent to CC2630, the user can operate

according to the CC2630 chip manual (see CC2630 manual for details);

Chengdu Ebyte Electronic Technology Co.,Ltd. E72-2G4M23S1A User Manual

It is recommended to use the Code Composer Studio (CCS) Integrated Development Environment (IDE).

Code Composer Studio is an integrated development environment (IDE) that supports TI's microcontroller and

embedded processor products. Code Composer Studio includes a complete set of tools for developing and

debugging embedded applications. It includes the C/C++ compiler, source editor, project build environment,

debugger, descriptor, and many other features. The IDE provides a single user interface to help you through eve ry

step of the application development process. Familiar tools and interfaces allow users to get started faster th an ever

before. Code Composer Studio combines the benefits of the Eclipse software framework with TI's advanced

embedded debugging capabilities to provide embedded developers with a compelling, feature -rich development

environment.

★When transmitting, set DIO_7 pin to high level and DIO_13, DIO_14 pins to low level;

★When receiving, set DIO_7 pin to low level and DIO_13, DIO_14 pins to high level;

★Before turning off, set DIO_7, DIO_13, DIO_14 pins to low;

The register configuration can be reinitialized when the chip is idle for greater stability.

4.3 Connection instructions to the emulator

TMS, TCK, reset, and ground need to be connected between the emulator and the module, and an additional 3.3V

power supply is required for the emulator;

Use USB to UART module to connect with module, module serial port and IO port are multiplexed, users can set

according to their own needs;

Please note that good grounding is required. When there is a large area of grounding, the power supply ripple is

small. Increase the filter capacitor and try to be close to the VCC and GND pins of the module.

Chengdu Ebyte Electronic Technology Co.,Ltd. E72-2G4M23S1A User Manual

5 FAQ

5.1 Communication range is too short

The communication distance will be affected when obstacle exists;

Data lose rate will be affected by temperature, humidity and co -channel interference;

The ground will absorb and reflect wireless radio wave, so the performance will be poor when testing near ground ;

Sea water has great ability in absorbing wireless radio wave, so performance will be poor when testing near the sea;

The signal will be affected when the antenna is near metal object or put in a metal case;

Power register was set incorrectly, air data rate is set as too high (the higher the air data rate, the shorter the

distance);

The power supply low voltage under room temperature is lower than 2.5V, the lower the v oltage, the lower the

transmitting power;

Due to antenna quality or poor matching between antenna and module.

5.2 Module is easy to damage

Please check the power supply source, ensure it is 2.0V~3.6V, voltage higher than 3.6V will damage the module;

Please check the stability of power source, the voltage cannot fluctuate too much;

Please make sure antistatic measure are taken when installing and using, high frequency devices have electrosta tic

susceptibility;

Please ensure the humidity is within limited range, some parts are sensitive to humidity;

Please avoid using modules under too high or too low temperature.

5.3 BER(Bit Error Rate) is high

There are co-channel signal interference nearby, please be away from interference sources or modify

frequency and channel to avoid interference;

Poor power supply may cause messy code. Make sure that the power supply is reliable;

The extension line and feeder quality are poor or too long, so the bit error rate is high.

Chengdu Ebyte Electronic Technology Co.,Ltd. E72-2G4M23S1A User Manual

6 Production guidance

6.1 Reflow soldering temperature

Profile Feature

Curve characteristics

Sn-PbAssembly

Pb-Free Assembly

Solder Paste

Solder paste

Sn63/Pb37

Sn96.5/Ag3/Cu0.5

Preheat Temperaturemin （Tsmin）

Minpreheating temp.

100℃

150℃

Preheat temperaturemax (Tsmax)

Mx preheatingtemp.

150℃

200℃

Preheat Time (Tsmin to Tsmax)(ts)

Preheating time

60-120 sec

Average ramp-up rate(Tsmaxto Tp)

Average ramp-up rate

3℃/second max

Liquidous Temperature(TL)

Liquid phasetemp.

183℃

217℃

Time（tL）Maintained Above（TL）

Time below liquid phaseline

60-90 sec

30-90 sec

Peak temperature（Tp）

Peak temp.

220-235℃

230-250℃

Aveage ramp-down rate（Tp to Tsmax）

Aveage ramp-downrate

6℃/second max

Time 25℃topeak temperature

Time to peaktemperature for 25℃

6 minutes max

8 minutes max

6.2 Reflow soldering curve

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