RF-Star SimpleLink RF-BM-2652P1 CC2652P Manual de usuario

RF-BM-2652P1

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RF-BM-2652P1 CC2652P SimpleLink™

Multiprotocol 2.4GHz Wireless Module

with Integrated Power Amplifier

Version 1.0

Shenzhen RF-star Technology Co., Ltd.

May 25th, 2023

RF-BM-2652P1

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1 Device Overview

1.1 Description

RF-BM-2652P1 is an RF module based on TI lower-power CC2652P SoC, which is a multiprotocol 2.4 GHz wireless

module supporting Thread, Zigbee®, Bluetooth®5.3 Low Energy, IEEE 802.15.4, IPv6-enabled smart objects

(6LoWPAN), proprietary systems, including the TI 15.4-Stack (2.4 GHz), and concurrent multiprotocol through a

Dynamic Multiprotocol Manager (DMM) driver. It integrates a 48 MHz crystal and a 32.768 kHz crystal, 352 KB of

in-system Programmable Flash, 256 KB ROM, 8 KB of Cache SRAM, 80 KB of ultra-low leakage SRAM. Its ARM®

Cortex®-M4F core application processor can operate at an extremely low current at flexible power modes. And the

module enables long-range and low-power applications using integrated +20 dBm high-power amplifier with

best-in-class transmit current consumption at 85 mA. It features small size, robust connection distance, and rigid

reliability.

1.2 Key Features

•RF Section

- Bluetooth 5.3 Low Energy

- ZigBee, Thread

- IEEE 802.15.4

- IPv6-nabld smart objects (6LoWPAN)

- Proprietary systems

- SimpleLinkTM TI 15.4-Stack (2.4 GHz)

- Dynamic Multiprotocol Manager (DDM) driver

•TX power: up to +20 dBm with temperature

compensation

•Excellent receiver sensitivity

- -105 dBm for Bluetooth 125 kbps (LE coded PHY)

- -100 dBm for 802.15.4 (2.4 GHz)

•Wide Operation Range

- 1.8 V to 3.8 V single power supply

- Operating temperature: -40 °C to +85 °C

- Storage temperature: -40 °C to +125 °C

•Microcontroller

- Powerful 48 MHz ARM®Cortex®-M4F processor

- EEBMC CoreMark®score: 148

- 2-pin cJTAG and JTAG debugging

- Support OTA upgrade

•Memory

- 352 KB of in-system programmable flash

- 256 KB of ROM for protocols and library

functions

- 8 KB of cache SRAM (Alternatively available as

general-purpose RAM)

- 80 KB of ultra-low leakage SRAM. The SRAM is

protected by parity to ensure high reliability of

operation.

•Ultra-low power sensor controller with 4 KB of

SRAM

- Sample, store, and process sensor data

- Operation independent from system CPU

- Fast wake-up for low-power operation

•Rich Peripherals

- 23 GPIOs, digital peripheral pins can be routed

to any GPIOs

- 4 × 32-bit or 8 × 16-bit general-purpose timers

- 12-bit ADC, 200 kSamples/s, 8 channels

- 2 × comparators with internal reference DAC (1

× continuous time, 1 × ultra-low power)

- Programmable current source

- 2 × UART

- 2 × SSI (SPI, Microwave, TI)

RF-BM-2652P1

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- I2C

- I2S

- Real-time clock (RTC)

- Capacitive sensing, up to 8 channels

- Integrated temperature and battery monitor

•Security Enablers

- AES 128-bit and 256-bit Crypto accelerator

- ECC and RSA public key hardware accelerator

- SHA2 accelerator (full suite up to SHA-512)

- True random number generator (TRNG)

•External system

- On-chip buck DC/DC converter

•Dimension: 25.0 mm × 16.4 mm × 2.2 mm

1.3 Applications

•2400 to 2480 MH ISM and SRD systems with

down to 4 kHz of receive bandwidth

•Home and building automation

•Building security system

•HVAC system

•Gateway

•IP network camera

•Fire safety system

•Smart grid

•Automatic meter reading

•Industrial transport

•Wireless sensor networks

•Factory automation and control

•Wireless healthcare applications

•Energy harvesting applications

•Asset tracking and management

•Electronic Shelf Label (ESL)

•Wired networking

•Small business router

•Portable electronics

•Set-top box

•Connected peripherals

•Keyboard and keypads

•Home theater & entertainment

•Electronic and robotic toys

•Wearables

RF-BM-2652P1

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1.4 Functional Block Diagram

Figure 1. Functional Block Diagram of RF-BM-2652P1

1.5 Part Number Conventions

The part numbers are of the form of RF-BM-2652P1 where the fields are defined as follows:

Figure 2. Part Number Conventions of RF-BM-2652P1

2652

RF-STAR

Company Name

Bluetooth Module

Wireless Type

Chipset

TI CC2652P

Module Version

The First PA Version

CC2652P

GPIOs

Jtag

EMI Filter

48.0 MHz

32.768 kHz

Reset

2.4 GHz

Balun

Half-hole

Antenna

Matching

2.4 GHz PA

Balun

Switch

Power Supply

1.8 V ~ 3.8 V

Control (GPIO)

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Table of Contents 
Device Overview............................................................................................................................................................. 2 
1 Description............................................................................................................................................................ 2 
2 Key Features ....................................................................................................................................................... 2 
3 Applications.......................................................................................................................................................... 3 
4 Functional Block Diagram .............................................................................................................................. 4 
5 Part Number Conventions.............................................................................................................................. 4 
Table of Contents................................................................................................................................................................ 5 
Module Configuration and Functions ...................................................................................................................... 7 
1 Module Parameters........................................................................................................................................... 7 
2 Module Pin Diagram ......................................................................................................................................... 8 
3 Pin Functions....................................................................................................................................................... 8 
Specifications .................................................................................................................................................................10 
1 Recommended Operating Conditions .....................................................................................................10 
2 Handling Ratings..............................................................................................................................................10 
3 PA Output Control............................................................................................................................................10 
Application, Implementation, and Layout.............................................................................................................11 
1 Module Photos..................................................................................................................................................11 
2 Recommended PCB Footprint....................................................................................................................11 
3 Schematic Diagram.........................................................................................................................................12 
4 Reference Design............................................................................................................................................13 
5 Antenna................................................................................................................................................................13 
5.1 Antenna Design Recommendation ..............................................................................................13 
5.2 External Antenna Design Recommendation of the Half-Hole ANT Pin..........................14 
6 Basic Operation of Hardware Design ......................................................................................................15 
7 Trouble Shooting..............................................................................................................................................16 
7.1 Unsatisfactory Transmission Distance........................................................................................16 
7.2 Vulnerable Module..............................................................................................................................16 
7.3 High Bit Error Rate .............................................................................................................................17 
8 Electrostatics Discharge Warnings ...........................................................................................................17 
9 Soldering and Reflow Condition.................................................................................................................17 
Optional Package Specification ..............................................................................................................................19 

RF-BM-2652P1

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6 Revision History ............................................................................................................................................................21

7 Contact Us.......................................................................................................................................................................22

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2 Module Configuration and Functions

2.1 Module Parameters

Table 1. Parameters of RF-BM-2652P1

Chipset

CC2652P

Supply Power Voltage

1.8 V ~ 3.8 V, 3.3 V is recommended

Frequency

2402 MHz ～2480 MHz

Maximum Transmit Power

+20.0 dBm

Receiving Sensitivity

-100 dBm @ 802.15.4 (2.4 GHz)

-105 dBm @ Bluetooth 125 kbps (LE Coded PHY)

GPIO

Flash

352 KB

ROM

256 KB

SRAM

88 KB

Power Consumption

RX current: 6.9 mA

TX current: 7.3 mA @ 0 dBm

9.6 mA @ 5 dBm

22 mA @ 10 dBm

85 mA @ 20 dBm

MCU 48 MHz (CoreMark): 3.4 mA (71 μA/MHz)

Sensor Controller: 30.1 μA @ Low Power-Mode, 2 MHz, running infinite loop

808 μA @ Active-Mode, 24 MHz, running infinite loop

Standby: 0.94 µA

Shutdown: 150 nA

Support Protocol

Thread, ZigBee, BLE5.3, IEEE 802.15.4, 6LoWPAN, proprietary systems,

SimpleLink™ TI 15.4 stack (2.4 GHz)

Crystal

48 MHz, 32.768 kHz

Package

SMT packaging (1.27-mm half-hole pitch stamp stick)

Dimension

25.0 mm × 16.4 mm ×2.2 mm

Type of Antenna

Half-hole antenna interface

Operating Temperature

-40 ℃～+85 ℃

Storage Temperature

-40 ℃～+125 ℃

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2.2 Module Pin Diagram

Figure 3. Pin Diagram of RF-BM-2652P1

2.3 Pin Functions

Table 2. Pin Diagram of RF-BM-2652P1

Name

Chip Pin

Function

Description

DIO5

DIO_5

Digital

GPIO, high-drive capability

DIO6

DIO_6

Digital

GPIO, high-drive capability

DIO7

DIO_7

Digital

GPIO, high-drive capability

DIO8

DIO_8

Digital

GPIO

DIO9

DIO_9

Digital

GPIO

DIO10

DIO_10

Digital

GPIO

DIO11

DIO_11

Digital

GPIO

DIO12

DIO_12

Digital

GPIO

DIO13

DIO_13

Digital

GPIO

RES

RESET_N

Digital

Reset, active low. Internal pullup.

JTAG_TMSC

Digital

JTAG TMSC, high-drive capability

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JTAG_TCKC

Digital

JTAG TCKC

VCC

Power supply: 1.8 V ~ 3.8 V, recommended to 3.3 V

GND

Ground

DIO14

DIO_14

Digital

GPIO

DIO15

DIO_15

Digital

GPIO

DIO16

DIO_16

Digital

GPIO, JTAG_TDO, high-drive capability

DIO17

DIO_17

Digital

GPIO, JTAG_TDI, high-drive capability

DIO18

DIO_18

Digital

GPIO

DIO19

DIO_19

Digital

GPIO

DIO20

DIO_20

Digital

GPIO

DIO21

DIO_21

Digital

GPIO

DIO22

DIO_22

Digital

GPIO

DIO23

DIO_23

Digital or Analog

GPIO, analog capability

DIO24

DIO_24

Digital or Analog

GPIO, analog capability

DIO25

DIO_25

Digital or Analog

GPIO, analog capability

DIO26

DIO_26

Digital or Analog

GPIO, analog capability

DIO27

DIO_27

Digital or Analog

GPIO, analog capability

GND

Ground

ANT

External antenna interface

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3 Specifications

3.1 Recommended Operating Conditions

Functional operation does not guarantee performance beyond the limits of the conditional parameter values in the table

below. Long-term work beyond this limit will affect the reliability of the module more or less.

Table 3. Recommended Operating Conditions of RF-BM-2652P1

Items

Condition

Min.

Typ.

Max.

Unit

Operating Supply Voltage

1.8

3.3

3.8

Operating Temperature

-40

+25

+85

℃

3.2 Handling Ratings

Table 4. Handling Ratings of RF-BM-2652P1

Items

Condition

Min.

Typ.

Max.

Unit

Storage Temperature

Tstg

-40

+25

+125

℃

Human Body Model

HBM

±2000

Moisture Sensitivity Level

Charged Device Model

±500

3.3 PA Output Control

The PA of the CC2652P switches the RF switch by controlling the output of DIO28 and DIO29, and then switches the PA

and non-PA RF output to realize the control of the transmission power range.

Table 3. RF Control Truth Table

Power

DIO28 (Output)

DIO29 (Output)

+5 dBm ~ + 20 dBm (PA)

< 5 dBm

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