Ebyte EO01C-MLO1S Manual de usuario

(eo)

EBYTE

EO01C-MLO1S

User

Manual

Si24R1

2.4GHz

SPI

SMD

Wireless

Module

Chengdu

Ebyte

Electronic

Technology

Co.,Ltd.

ene

Chengdu

Ebyte

Electronic

Technology

Co.,

Ltd

EO01C-MLOLS

User

Manual

CONTENTS

TLOVETVIEW

«oot

ttt

tite

ete

ee ee

eee

1.1

Brief

Introduction

. . . .

«coo

Features

«o.oo

T3APPLCAtION

. . .

«oo

Specification

and

Parameter

. . .

...

oo...

tte

2.1

Limit

parameter

. . .

o.oo.

eee

2.2

Operating

Parameter

. . . .

oo.

outta

3.Sizeand

definition

. .

.........L

4.BASIC

OPETALION

. «

«oo

oot

teeta

Hardware

desi@il

. .

...

oot

42 Software

editing

. . . .

o.oo

SCIrCWt

dIAGIAIM

. . .

o.oo

eee

FAQ

«a

6.1

Communication

range

Stoo

short...

LL...

Module

easy

damage

. .

....

o.oo

6.3

BER(BitError

Rate)ishigh

.......

7.50ldering

gUIdanCe

. . . .

«oot

7.1

Reflow

soldering

temperature

. . .

oo...

Reflow

Soldering

CUIVE

. . .

o.oo

Packing

method

for

bulk

order...

...

LL...

Revision

history

. .

«oo

ene

Chengdu

Ebyte

Electronic

Technology

Co.,

Ltd

EO01C-MLOLS

User

Manual

1.0verview

1.1

Brief

introduction

EO01C-MLOIS

small

size

SMD

module

based

Si24R1,

operates

2.4Ghz

with

PCB

antenna,

using

industrial-grade

high-precision

16MHz

crystal

oscillator.

The

performance

and

components

selection

during

R&D

are

all

accordance

with

industrial

grade

standards.

The

user

needs

use

the

MCU

driver

use

dedicated

SPI

debugging

tool

develop

EO1C-MLO1S.

1.2

Features

Small

size,

12x19mm;

Communication

distance

tested

300m;

The

maximum

transmit

power

SmW,

and

the

software

multi-level

adjustable;

Global

license-free

ISM

2.4GHz

frequency

band,

2Mbps,

1Mbps

and

250kbps

air

rate;

125

communication

channels

meet

application

requirements

such

multipoint

communication,

grouping,

and

frequency

hopping;

Connect

with

MCU

through

SPI

interface,

the rate

0~10Mbps;

2.0~3.6V

power

supply,

power

supply

greater

than

3.3V

can

guarantee

the

best

performance;

Industrial

standard

design

for

long-term

use

-40~+85°C;

Comes

with

PCB

onboard

antenna,

need

for

external

antenna;

Fully

compatible

with

EO1-MLOI1S

software,

hardware

and

packaging.

FE01C-MLO1S

has

obtained

ROHS

certification

1.3

Application

Wearable

device;

Smart

home

and

industrial

sensors;

Security

system,

positioning

system;

Wireless

remote

control,

drone;

Wireless

game

remote

control;

Healthcare

products;

Wireless

voice,

wireless

headset;

ene

Chengdu

Ebyte

Electronic

Technology

Co.,

Ltd

EO01C-MLOLS

User

Manual

Automotive

industry

applications.

ene

Chengdu

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Electronic

Technology

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EO01C-MLOLS

User

Manual

Specification

and

parameter

2.1

Limit

parameter

Performance

Main parameter

Remark

Min.

Max.

Power

supply

(V)

Voltage

over

3.6V

will

cause

permanent

damage

module

Chances

burn

slim

when

modules

Blocking

power

(dBm)

are

used

short

distance

Operating

temperature

(°C)

-40

2.2

Operating parameter

Main

parameter

Performance

Remark

Min.

Typ.

Max.

Operating

voltage

(V)

2.0

3.6

>3.3V

ensures

output

power

Communication

level

(V)

Fors

risk

Operating

temperature

(°C)

-40

+85

Industrial

design

Operating

frequency

(MHz)

2.525

Support

ISM

band

current

0dBm

Power

current

consumption

Sleep current

0.7

Software

shut

down

Max

power

(dBm)

Receiving

sensitivity

(dBm)

-83

Air

data

rate

250kbps

Air

data

rate

(bps)

250k

Controlled

via

user’s

programming

Main

parameter

Description

Remark

dwn

[on

dead

wns

S01

FIFO

32Byte

Max

length

transmitted

each

time

Crystal

frequency

16MHz

Modulation

GFSK

Package

SMD

Connector

1.27mm

Communication

interface

SPI

0-10Mbps

Size

19mm

Without

SMA

Antenna

PCB

antenna

500hm

impedance

ene

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Ebyte

Electronic

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EO01C-MLOLS

User

Manual

Size

and

definition

12.0+0.1mm 1.63+0.1mm

1.27 1.56

BEE

allo

lolldlldlldllo

olldlldlldlldllolollo

3 2

1 1

2 3

19.0+0.1mm

0.7200

—

|—

ANT

0.60

Top

pad:

Bottom

pad

0.60

190

0.601]

1:80

0.90

Pad

quantity

Unit:

Pin No.

item

direction

[Pin

application

VCC

Power

supply

must

2.0

~3.6V

Input

Chip

Enable

CSN

Input

SPI

Chip

select

SCK

Input

SPI

clock

MISO

Output

SPI

master

input

slave

output

IRQ

Output

Interrupt

request.

GND

Ground

MOSI

Input

SPI

master

output

slave

input

ene

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Ebyte

Electronic

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EO01C-MLOLS

User

Manual

4.Basic

operation

4.1

Hardware

design

tis

recommended

use

stabilized

power

supply.

The

power

supply

ripple

factor

small

possible,

and

the

module

needs

reliably

grounded;

Please

pay

attention

the

correct

connection

the

positive

and

negative

poles

the

power

supply.

Reverse

connection

may

cause

permanent

damage

the

module;

Please

check

the

power

supply

ensure

within

the

recommended

voltage

otherwise

when

exceeds

the

maximum

value

the

module

will

permanently

damaged,

Please

check

the

stability

the

power

supply,

the

voltage

can

not

fluctuated

frequently;

When

designing

the

power

supply

circuit

for

the

module,

often

recommended

reserve

than

30%

the

margin,

the

whole

machine

beneficial

for

long-term

stable

operation;

The

module

should

far

away

possible

from

the

power

supply,

transformers,

high-frequency

wiring

and

other

parts

with

large

electromagnetic

interference;

High-frequency

digital

routing,

high-frequency

analog

routing,

and

power

routing

must

avoided

under

the

module.

necessary

pass

through

the

module,

assume

that

the

module

soldered

the

Top

Layer,

and

the

copper

spread

the

Top

Layer

the

module

contact

part(well

grounded),

must

the

digital

part

the

module

and

routed

the

Bottom

Layer;

Assuming

the

module

soldered

placed

over

the

Top

Layer,

wrong

randomly

route

over

the

Bottom

Layer

other

layers,

which

will

affect

the

module's

spurs

and

receiving

sensitivity

varying

degrees;

assumed

that

there

are

devices

with

large

electromagnetic

interference

around

the

module

that

will

greatly

affect

the

performance.

recommended

keep

them

away

from

the

module

according

the

strength

the

interference.

necessary,

appropriate

isolation

and

shielding

can

done;

Assume

that

there

are

traces

with

large

electromagnetic

interference

(high-frequency

digital,

high-frequency

analog,

power

traces)

around

the

module

that

will

greatly

affect

the

performance

the

module.

recommended

stay

away

from

the

module

according

the

strength

the

interference.

necessary,

appropriate

isolation

and

shielding

can

done.

the

communication

line

uses

level,

1k-5.1k

resistor

must

connected

series

(not

recommended,

there

still

risk

damage);

Try

stay

away

from

some

physical

layers

such

TTL

protocol

2.4GHz

for

example:

USB3.0;

The

mounting

structure

antenna

has

great

influence

the

performance

the

module.

necessary

ensure

that

the

antenna

exposed,

preferably

vertically

upward.

When

the

module

mounted

inside

the

case,

use

good

antenna

extension

cable

extend

the

antenna

the

outside;

The

antenna

must

not

installed

inside

the

metal

case,

which

will

cause

the

transmission

distance

greatly

weakened.

Conductors

other

sources

interference

should

avoided

around

the

onboard

PCB

antenna.

Software

editing

Insert

the

module

into

the

user

circuit

board,

use

the

microcontroller

communicate

with

the

module

SPI

serial

port,

and

operate

the

control

and

the

transceiver

buffer

through

the

SPI

command

complete

the

wireless

data

transmit

and

receive

function.

interrupt

for

IRQ,

can

used

wake-up

MCU

and

achieve

fast

response;

But

the

user

can

get

the

interrupt

status

through

SPI

(not

recommended,

not

conducive

the

overall

power

consumption,

and with

low efficiency)

can

high

level

for

long-term,

but

needs

set

POWER

DOWN

mode

when

the

module

writes

registers,

and

itis

recommended

that

controlled

MCU

pin;

Chengdu

Ebyte

Electronic

Technology

Co.,

Ltd

EO01C-MLOLS

User

Manual

Circuit

diagram

STMSL

VCC

PC3

PER

——

pCa PCI

—

Lid

vee

—9

PAD PCO

O75

—

PAI

SPI_SCK/PBS

[03

CSN

—=(

pA2

SPI_MISO/PB7

(O=

SCK

—=

PA3

SPI_MOSI/PB6

MOS!

VSS

SP1_NSS/PB4

MISO

—

VDD

PB3

rae

IRQ

—5C

PDO

PB2

GND

—3

PBO

PBl

C———

[oe

EO1C-MLO1S

FAQ

6.1

Communication

range

too

short

The

communication

distance

will

affected

when

obstacle

exists.

Data

lose

rate

will

affected

temperature,

humidity

and

co-channel

interference.

The

ground

will

absorb

and

reflect

wireless

radio

wave,

the

performance

will

poor

when

testing

near

ground.

Sea

water

has

great

ability

absorbing

wireless

radio

wave,

performance

will

poor

when

testing

near

the

sea.

The

signal

will

affected

when

the

antenna

near

metal

object

put

metal

case.

Power

was

set

incorrectly,

air

data

rate

set as

too

high

(the

higher

the

air

data

rate,

the

shorter

the

distance).

The

power

supply

low

voltage

under

room

temperature

lower

than

2.5V,

the

lower

the

voltage,

the

lower

the

transmitting

power.

Due

antenna

quality

poor

matching

between

antenna

and

module.

6.2

Module

easy

damage

Please

check

the

power

supply

source,

ensure

2.0V~3.6V,

voltage

higher

than

3.6V

will

damage

the

module.

Please

check

the

stability

power

source,

the

voltage

cannot

fluctuate

too

much.

Please

make

sure

antistatic

measure

are

taken

when

installing

and

using,

high

frequency

devices

have

electrostatic

susceptibility.

Please

ensure

the

humidity

within

limited

range,

some

parts

are

sensitive

humidity.

Please

avoid

using

modules

under

too

high

too

low

temperature.

6.3

BER(Bit

Error Rate)

high

There

are

co-channel

signal

interference

nearby,

please

away

from

interference

sources

modify

frequency

and

channel

avoid

interference;

Poor

power

supply

may

cause

messy

code.

Make

sure

that

the

power

supply

reliable.

The

extension

line

and

feeder

quality

are

poor

too long,

the

bit

error

rate

high;

7.Soldering

guidance

Chengdu

Ebyte

Electronic

Technology

Co.,

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EO01C-MLOLS

User

Manual

7.1

Reflow

soldering

temperature

Lo.

Sn-Pb

Profile

Feature

Curve

characteristics

Pb-Free

Assembly

Solder

Paste

Solder

paste

Sn63/Pb37

S1n96.5/Ag3/Cu0.5

Preheat

Temperature

min

(Tsmin)

Min

preheating

temp.

100°C 150°C

Preheat

temperature

max

(Tsmax)

preheating

temp.

150°C

200°C

Preheat

Time

(Tsmin

Tsmax)(ts)

Preheating

time

60-120

sec

60-120

sec

Average

ramp-up

rate(Tsmax

Tp)

Average

ramp-up

rate

3°C/second

max

3°C/second

max

Liquidous

Temperature

(TL)

Liquid

phase

temp.

183°C

217°C

Time

(tL)

Maintained

Above

(TL) Time

below

liquid

phase

line

60-90

sec

30-90

sec

Peak

temperature

(Tp)

Peak

temp.

220-235°C 230-250°C

Aveage

ramp-down

rate

(Tp

Tsmax)

Average

ramp-down

rate

6°C/second

max

6°C/second

max

Time

25°C

peak

temperature

Time

peak

temperature

for

25°C

minutes

max

minutes

max

7.2

Reflow

soldering

curve

hhh

5s;

Critical

Zone

TLto

TSmax

xeapuii

tans

Preheat

257C

Peak

Time

Packing

method

for

bulk

order

Chengdu

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Electronic

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EO01C-MLOLS

User

Manual

{

3300.2

35801

36501

23401

19.4320

20.0

i i

13.7

Each

Tray

1000

pcs

Revision

history

Version

Date

Description

Issued

1.0

2020-06-19

Original

version

Ren

1.1

2020-06-29

Format

updated

Ren

2020-07-24

Ren

1.3

2022-5-23

Bug

fixes

Yan

About

Technical

support:

[email protected]

Documents

and

Setting

download

link::

www.ebyte.com

Thank

you

for

using

Ebyte

products!

Please

contact

with

any

questions

suggestions:

info(@cdebyte.com

Official

hotline:028-61399028

Web:

www.ebyte.com

Address:

Mould

Park,

199#

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Ave,

High-tech

District,

Sichuan,

China

(on)

eEBY

Chengdu

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