Ebyte E01C-ML01DP5 Manual de usuario

E01C-ML01DP5 User Manual

SI24R1+ 2.4GHz 100mW SPI DPI Wireless Module

Chengdu Ebyte Electronic Technology Co.,Ltd. E01C-ML01DP5 User Manual

Contents

Disclaimer...............................................................................................................................................................................2

Chapter1. Overview................................................................................................................................................................ 3

1.1 Brief introduction......................................................................................................................................................3

1.2 Features.....................................................................................................................................................................3

1.3 Application................................................................................................................................................................3

Chapter2. Specifications......................................................................................................................................................... 4

2.1 Limit parameter.........................................................................................................................................................4

2.2 Operating parameter.............................................................................................................................................. 4

Chapter3. Size and pin definition.......................................................................................................................................... 5

Chapter4. Basic operation.......................................................................................................................................................6

4.1 Hardware design....................................................................................................................................................... 6

4.2 Software editing........................................................................................................................................................7

Chapter5. Circuit diagram.......................................................................................................................................................8

Chapter6. FAQ........................................................................................................................................................................ 8

6.1 Communication range is too short............................................................................................................................ 8

6.2 Module is easy to damage.........................................................................................................................................8

6.3 BER(Bit Error Rate) is high...................................................................................................................................9

Chapter7. Soldering guidance.................................................................................................................................................9

Chapter8. Related models....................................................................................................................................................... 9

Chapter9. Antenna Guide........................................................................................................................................................9

9.1 Antenna recommendation......................................................................................................................................... 9

Chapter10. Bulk packaging...................................................................................................................................................10

Revision history.................................................................................................................................................................... 11

About us................................................................................................................................................................................ 11

Chengdu Ebyte Electronic Technology Co.,Ltd. E01C-ML01DP5 User Manual

Disclaimer

EBYTE reserves all rights to this document and the information contained herein.

Products, names, logos and designs described herein may in whole or in part be

subject to intellectual property rights. Reproduction, use, modification or disclosure to

third parties of this document or any part thereof without the express permission of

EBYTE is strictly prohibited.

The information contained herein is provided “as is” and EBYTE assumes no liability

for the use of the information. No warranty, either express or implied, is given,

including but not limited, with respect to the accuracy, correctness, reliability and

fitness for a particular purpose of the information. This document may be revised by

EBYTE at any time. For most recent documents, visit www.ebyte.com.

Chengdu Ebyte Electronic Technology Co.,Ltd. E01C-ML01DP5 User Manual

Chapter1. Overview

1.1 Brief introduction

E01C-ML01DP5 is a 2.4GHz direct plug-in wireless module with a maximum transmit power of 100mW based on the

domestically-made SI24R1.

Built-in power amplifier (PA) and low noise amplifier (LNA) on the original basis, so that the maximum transmission

power reaches 100mW, while the receiving sensitivity is further improved, and the

overall communication stability is compared with no power amplifier and low

noise amplifier. The products have been greatly improved.

The product has obtained the use of industrial-grade high-precision 16MHz crystal

oscillator.

Since E01C-ML01DP5 is a pure radio frequency transceiver module, it needs to

use MCU driver or use a dedicated SPI debugging tool.

1.2 Features

The maximum transmission power is 100mW, and the software is multi-level adjustable;

Under ideal conditions, the communication distance can reach 2.5km;

Professional radio frequency shield, anti-interference and anti-static;

Support the global license-free ISM 2.4GHz frequency band;

Support 2Mbps, 1Mbps and 250kbps air rate;

125 communication channels to meet application requirements such as multipoint communication, grouping, and

frequency hopping;

Connect with MCU through SPI interface, rate 0～10Mbps;

Support 2.0～3.6V power supply, power supply greater than 3.3V can guarantee the best performance;

Reserve 4 fixing holes to facilitate the welding and fixing of the module;

SMA-K external threaded inner hole for easy connection of coaxial cable or external antenna;

1.3 Application

Smart home and industrial sensors, etc.;

Security system, positioning system;

Wireless remote control, UAV;

Wireless game remote control;

Healthcare products;

Wireless voice, wireless headset;

Automotive industry applications.

Chengdu Ebyte Electronic Technology Co.,Ltd. E01C-ML01DP5 User Manual

Chapter2. Specifications

2.1 Limit parameter

Main parameter

Performance

Remarks

Min.

Max.

Power supply（V）

3.6

Voltage over 3.6V will cause permanent damage to

module

Blocking power（dBm）

Chances of burn is slim when modules are used in

short distance

Operating temperature（℃）

-40

Industrial grade

2.2 Operating parameter

Main parameter

Performance

Remarks

Min.

Typ.

Max.

Operating voltage（V）

2.0

3.3

3.6

≥3.3V ensures output power

Communication level（V）

3.3

For 5V TTL, it may be at risk of burning

down

Operating temperature（℃）

-40

Industrial design

Operating frequency（GHz）

2.4

2.525

Support ISM band

Power

consumption

Tx current

125

Instantaneous power consumption

Rx current

27.5

Sleep

current(μA)

Software is shut down

Max Tx power（dBm）

20.5

Receiving sensitivity（dBm）

-96.5

-96

-97.5

Air data rate is 250kbps

Air data rate（bps）

250k

Controlled via user’s programming

Main parameter

Description

Remark

Reference distance

2500m

Test condition：clear and open area, antenna gain: 5dBi，antenna

height: 2.5m，air data rate: 250kbps

FIFO

32Byte

Max length transmitted each time

Crystal frequency

16MHz

Modulation

GFSK

Package

DPI

Connector

2.54mm Pin

Chengdu Ebyte Electronic Technology Co.,Ltd. E01C-ML01DP5 User Manual

Header

Communication interface

SPI

0-10Mbps

Size

18 * 33.4mm

With out SMA

Antenna

SMA-K

The equivalent impedance is about 50Ω

Chapter3. Size and pin definition

Pin No.

Pin item

Pin direction

Pin application

GND

Ground wire, connected to the power reference ground

VCC

The power supply must be between 2.0～3.6V

Chengdu Ebyte Electronic Technology Co.,Ltd. E01C-ML01DP5 User Manual

Input

Module control pin

CSN

Inout

Module chip select pin, used to start a SPI communication

SCK

Input

Module SPI bus clock

MOSI

Input

Module SPI data input pin

MISO

Output

Module SPI data output pin

IRQ

Output

Module interrupt signal output, active low

Chapter4. Basic operation

4.1 Hardware design

It is recommended to use a DC stabilized power supply. The power supply ripple factor is as small as possible, and

the module needs to be reliably grounded；

Please pay attention to the correct connection of the positive and negative poles of the power supply. Reverse

connection may cause permanent damage to the module；

Please check the power supply to ensure it is within the recommended voltage otherwise when it exceeds the

maximum value the module will be permanently damaged;

Please check the stability of the power supply, the voltage can not be fluctuated frequently；

When designing the power supply circuit for the module, it is often recommended to reserve more than 30% of the

margin, so the whole machine is beneficial for long-term stable operation;

The module should be as far away as possible from the power supply, transformers, high-frequency wiring and other

parts with large electromagnetic interference;

High-frequency digital routing, high-frequency analog routing, and power routing must be avoided under the

module. If it is necessary to pass through the module, assume that the module is soldered to the Top Layer, and the

copper is spread on the Top Layer of the module contact part(well grounded), it must be close to the digital part of

the module and routed in the Bottom Layer；

Assuming the module is soldered or placed over the Top Layer, it is wrong to randomly route over the Bottom Layer

or other layers, which will affect the module's spurs and receiving sensitivity to varying degrees；

It is assumed that there are devices with large electromagnetic interference around the module that will greatly

affect the performance. It is recommended to keep them away from the module according to the strength of the

interference. If necessary, appropriate isolation and shielding can be done；

Assume that there are traces with large electromagnetic interference (high-frequency digital, high-frequency analog,

power traces) around the module that will greatly affect the performance of the module. It is recommended to stay

away from the module according to the strength of the interference. If necessary, appropriate isolation and shielding

can be done.

If the communication line uses a 5V level, a 1k-5.1k resistor must be connected in series (not recommended, there is

still a risk of damage)；

Try to stay away from some physical layers such as TTL protocol at 2.4GHz , for example: USB3.0；

The mounting structure of antenna has a great influence on the performance of the module. It is necessary to ensure

that the antenna is exposed, preferably vertically upward. When the module is mounted inside the case, use a good

antenna extension cable to extend the antenna to the outside；

The antenna must not be installed inside the metal case, which will cause the transmission distance to be greatly

Chengdu Ebyte Electronic Technology Co.,Ltd. E01C-ML01DP5 User Manual

weakened.

4.2 Software editing

The drive mode of this module SI24R1+PA+LNA is completely equivalent to SI24R1, and users can operate

according to the SI24R1 chip manual (see SI24R1 manual for details);

Power bin:

SI24R1 register setting table:

Address(Hex)

Mnemonic

Bit

Reset Value

Description

RF_SETUP

RF configuration

RF_PWR

2:0

110

Set TX Power

111:7dBm 110:4dBm

101:3dBm 100:1dBm

011:0dBm 010:-4dBm

001:-6dBm 000:-12dBm

011：Pre-stage 0dBm，Output 21dBm；

010：Pre-stage -4dBm，Output 20.5dBm；

011：Pre-stage -6dBm，Output 19.5dBm;

000：Pre-stage -12dBm，Output 15dBm;

IRQ is an interrupt pin, which can be used to wake up the microcontroller and achieve fast response; it can be

disconnected, and the interrupt status can be obtained by SPI query (not recommended, not conducive to overall

power consumption, and low efficiency);

CE can be connected to the high level for a long time, but the module must be set to POWER DOWN power-down

mode when writing the register. It is recommended that CE be controlled by the MCU pin;

The CE pin is connected to the LNA enable pin. When CE=1, the LNA is turned on, and when CE=0, the LNA is

turned off. This operation is completely consistent with the transceiver mode of nRF24L01; that is, the user does not

need to care about LNA operation at all;

If the user needs to answer automatically, the CE pin must be kept high during the transmission process, and the

high level time cannot be longer than 10us as mentioned in the SI24R1 manual. The correct operation is: CE=1 to

trigger the transmission. After knowing that the transmission is completed, CE=0, instead of CE=0 after 10us. The

reason is: After SI24R1 is sent, it will immediately switch to receiving mode. At this time, if CE= 0, the LNA has

been turned off, which is not conducive to receiving sensitivity.

Chengdu Ebyte Electronic Technology Co.,Ltd. E01C-ML01DP5 User Manual

Chapter5. Circuit diagram

Chapter6. FAQ

6.1 Communication range is too short

When there is a straight line communication obstacle, the communication distance will be attenuated accordingly;

Temperature, humidity, and co-frequency interference will increase the communication packet loss rate;

The ground absorbs and reflects radio waves, and the test results near the ground are poor;

Sea water has a strong ability to absorb radio waves, so the seaside test results are poor;

If there is a metal object near the antenna or placed in a metal shell, the signal attenuation will be very serious;

The power register setting is wrong, the air speed setting is too high (the higher the air speed, the closer the

distance);

The low voltage of the power supply at room temperature is lower than the recommended value, the lower the

voltage, the lower the power output;

The poor matching degree of the antenna and the module or the quality of the antenna itself.

6.2 Module is easy to damage

Please check the power supply to ensure that it is within the recommended power supply voltage. If it exceeds the

maximum value, it will cause permanent damage to the module;

Please check the stability of the power supply, the voltage should not fluctuate greatly and frequently;

Please ensure anti-static operation during installation and use, and high-frequency components are electrostatically

sensitive;

Please ensure that the humidity during installation and use should not be too high, and some components are

humidity sensitive devices;

If there is no special requirement, it is not recommended to use at too high or too low temperature.

Chengdu Ebyte Electronic Technology Co.,Ltd. E01C-ML01DP5 User Manual

6.3 BER(Bit Error Rate) is high

There is co-frequency signal interference nearby, stay away from the interference source or modify the frequency

and channel to avoid interference;

The clock waveform on SPI is not standard, check whether there is interference on the SPI line, and the SPI bus line

should not be too long;

Unsatisfactory power supply may also cause garbled codes. Ensure the reliability of the power supply;

Poor or too long extension cords and feeders will also cause high bit error rates.

Chapter7. Soldering guidance

This product is a direct plug-in module. When welding the module, the welder must work in accordance with the norms

for discharging static electricity. This product is an electrostatic sensitive product. If the module is not welded according

to the rules, the module may be permanently damaged.

Chapter8. Related models

Model

Frequency

Power

Distance

Pakage

Antenna

dBm

E01-ML01S

nRF24L01+

2.4G

100

SMD

PCB

E01-ML01D

nRF24L01+

2.4G

100

DPI

PCB

E01-ML01IPX

nRF24L01+

2.4G

200

SMD

IPEX

E01-2G4M13S

nRF24L01+

2.4G

1200

SMD

PCB

E01-ML01SP2

nRF24L01+

2.4G

1800

SMD

PCB/IPEX

E01-ML01SP4

nRF24L01+

2.4G

2000

SMD

IPEX

E01-ML01DP4

nRF24L01+

2.4G

1800

DPI

PCB

E01-ML01DP5

nRF24L01+

2.4G

2500

DPI

SMA-K

E01-2G4M27D

nRF24L01+

2.4G

5000

DPI

SMA-K

All wireless modules of the E01 series can communicate with each other

Chapter9. Antenna Guide

9.1 Antenna recommendation

Antennas are an important role in the communication process, and often inferior antennas will have a great impact on the

communication system. Therefore, our company recommends some antennas as supporting our company's wireless

modules with excellent performance and reasonable prices.

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