Ebyte E22-400M30S Manual de usuario

(n°

EBYTE

E22-400M30S

User

Manual

SX1268

433/470MHz

SPI

SMD

LoRa

Module

Chengdu

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Technology

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E22-400M30S

User

manual

Contents

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1.3

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Specification

and

parameter.

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E22-400M30S

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E22-400M30S

User

manual

Overview

1.1

Introduction

The

E22-400M30S

based

the

SX1268,

new

generation

LoRa™

chip

manufactured

Semtech,

USA.

It is

ultra-small

and

self-developed

433MHz,

470MHz

SMD

LoRa™

wireless

module.

Because

adopted

the

original

SX1268

main

core,

the

and

LNA

built-in

also

based

the

one,

which

makes

the

maximum

transmission

power

IW,

the

same

time,

the

receive

sensitivity

also

further

improved.

The

overall

communication

stability

greatly

improved

—

E22

400M30S

G0)

EBYTE

[lz

j[=]

TRAE

Manufacturer:

EBYTE

[=1Es52A

SN:

18062500001

compared

the

products

without

power

amplifiers

and

low

noise

amplifiers.

The

anti-interference

performance

and

communication

distance

have

been

further

improved

compared

the

generation

LoRa™

transceiver,

and

far

superior

the

current

FSK

and

GFSK

modulation

products.

This

products obtained

FCC, CE

and

RoHS

certification

already

users

not

need

worry

about

the

performance.

Adopted

industrial

grade

high

precision

32MHz

crystal,

the

product

can

cover

ultra-wide

frequency

range

410~493MHz

and

backward

compatible

with

SX1278

and

SX1276.

Since

the

module

transceiver

module

only,

users

need

use

the

MCU

driver

use

dedicated

SPI

debug

tool.

1.2

Features

Communication

distance

tested

12km

;

Support

the

global

license-free

ISM

433MHz/470MHz

band

;

Support

air

date

rate

0.018-62.5kbps

the

LoRa™

mode

;

Support

300kpbs

the

FSK

mode;

Compatible

with

the

transceiver

SX1278/SX1276;

With

large

capacity,

FIFO

supports

256Byte

data

cache;

New

SF5

spreading

factor

support

dense

networks;

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Maximum

transmission

power

1W,

software

multi-level

adjustable

;

Support

2.5V~5.5V

power

supply,

than

5.0V

power

supply

can

guarantee

the

best

performance;

Industrial

grade

standard

design,

support

-40

°C

for

working

over

long

time

;

IPEX

and

stamp

hole

are

optional,

which

convenient

for

secondary

development

and

integration.

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E22-400M30S

User

manual

1.3

Application

Home

security

alarm

and

remote

keyless

entry

;

Smart

home

and

industrial

sensors

Wireless

alarm

security

system

;

Building

automation

solutions

;

Wireless

industrial-grade

remote

control

;

Health

care

products

;

Advanced

Meter

Reading

Architecture(AMI)

;

Automotive

industry

applications.

Specification

and

parameter

2.1

Limit

parameter

Performance

Main

parameter

Remark

Min.

Max.

Voltage

over

5.5V

will

cause

permanent

Power

supply

(V)

5.5

damage

module

Chances

burn

slim

when

modules

Blocking

power

(dBm>

} }

are

used

short

distance

Operating

temperature

(°C)

-40

2.2

Operating parameter

Performance

Main

parameter

Remark

Min.

Typ.

Max.

Operating

voltage

(V)

2.5

5.0

5.5

It’s

recommended

use

5V.

For

TTL,

recommended

add

level

Communication

level

(V)

]

conversion.

Operating

temperature

(°C)

-40

Industrial

design

Operating

frequency

(GHz)

410

433/470/490

493

Support

ISM

band

current

(mA)

650

Instant

power

consumption

Power

}

current

(mA>

consumption

Sleep

current

(pA)

Software

shut

down

Max

power

(dBm)

214

215 223

Receiving

sensitivity

(dBm)

-149 -150

-151

Air

data

rate

0.3kbps

0.6k

300k

Controlled

via

user's

programming

Air

data

rate

(bps)

0.018k

62.5k

Controlled

via

user's

programming

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E22-400M30S

User

manual

Main parameter

Description

Remark

Test

condition

clear

and

open

area,

antenna

gain:

5dBi,

antenna

Distance

for

reference

12000m

) )

height:

2.5m,

air

data

rate:

0.3kbps

FIFO

256Byte

Maximum

length

single

transmission

Crystal

frequency

32MHz

Modulation

LoRa(recommended)

Package

SMD

Connector

2.54mm

Stamp

hole

Communication

interface

SPI

0-10Mbps

Size

38.5%

24*3.6

Antenna

IPEX/TPEX

ohm

impedance

Size

and

definition

240x0.1mm

3.87£0.1mm

2.61

n 1

]

2.54

13 10 10 13

ER)

4 4

C—

7.60

—

]

2.54

2 |

pil

—_—

IPX

5.46

Top

pad:

0.50

Bottom

pad

1.25

0.80I=)]

[1.50

0.80I—)

[1.50

Pad

quantity

Unit:

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E22-400M30S

User

manual

No.

Name

Direction

Function

GND

Ground

wire,

connected

the

power

reference

ground

GND

Ground

wire,

connected

the

power

reference

ground

GND

Ground

wire,

connected

the

power

reference

ground

GND

Ground

wire,

connected

the

power

reference

ground

GND

Ground

wire,

connected

the

power

reference

ground

RXEN

Input

switch

receiving

control

pin,

connected

external

microcontroller

10,

valid

high

level

;

TXEN

Input

switch

transmitting

control

pin,

connected

external

microcontroller

DIO2,

valid

high

level

DIO2

Input/Output

Configurable

universal

port

(see

SX1262

manual

for

details)

vee

Power

supply,

2.5~5.5V(t

recommended

add

external

ceramic

filter

capacitor)

vee

Power

supply,

2.5~5.5V(t

recommended

add

external

ceramic

filter

capacitor)

GND

Ground

wire,

connected

the

power

reference

ground

GND

Ground

wire,

connected

the

power

reference

ground

DIOL

Input/Output

Configurable

universal

port

(see

SX1262

manual

for

details)

BUSY

Output

For

status

indication

(see

SX1262

manual

for

details)

NRST

Input

Chip

reset

trigger

input

pin,

valid

low

level

MISO

Output

SPI

data

output

MOSI

Input

SPI

data

output

SCK

Input

SPI

data

output

NSS

Input

Module

chip

select

for

starting

SPI

communication

GND

Ground

wire,

connected

the

power

reference

ground

ANT

Antenna

interface,

stamp

hole

(50

ohm

characteristic

impedance)

GND

Ground

wire,

connected

the

power

reference

ground

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E22-400M30S

User

manual

Basic

Operation

4.1

Hardware

Design

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MCU

[HD

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GND

VCC

Brief

Connection

between

Module

and

Single

Chip

Microcomputer

The

I00. 101. 102,

103

MCU

means

the

port

MCU.

DIOI1.

DIO2

the

normal

port,

which

can

configured

multiple

function.

The

DIO2

can

connect

with

TXEN,

but

not

with

the

port

MCU.

It’s

used

control

switch,

see

details

SX1262

datasheet.

Also

can

floated

when

not

use.

The

DIO3

powered

32MHz

TCXO

crystal.

Ensure

the

good

grounding,

large

area

paving,

small

the

power

supply

ripple,

the

filter

capacitor

should

increased

and

possible

the

VCC

and

GND

pins

module.

It is

recommended

add

200R

protection

resistor

RXD/TXD

external

MCU.

Note:

recommended

use

stabilized

power

supply

power

the

module.

The

power

supply

ripple

coefficient

small

possible,

and

the

module

needs

reliably

grounded.

Please

pay

attention

the

correct

connection

the

positive

and

negative

poles

the

power

supply.

the

reverse

connection

connected,

the

module

may

permanently damaged.

Please

check

the

power

supply

ensure

that

between

the

recommended

supply

voltage,

exceeding

the

maximum,

the

module

will

permanently

damaged.

Please

check

the

stability

the

power

supply,

the

voltage

can

not

significantly

frequent.

When

designing

the

power

supply

circuit

for

the

module,

often

recommended

reserve

than

30%

the

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E22-400M30S

User

manual

margin,

and

the

whole

machine

beneficial

for

long-term

stable

operation.

The

module

should

far

away

possible

from

the

power

supply,

transformers,

high-frequency

wiring

and

other

parts

with

large

electromagnetic

interference.

High-frequency

digital

traces,

high-frequency

analog

traces,

and

power

traces

must

avoided

under

the

module.

necessary

pass

through

the

module,

assume

that

the

module

soldered

the

Top

Layer,

and

the

copper

spread

the

Top

Layer

the

module

contact

part(All

copper-covered

and

well

grounded),

and

must

the

digital

part

the

module

and

routed

the

Bottom

Layer.

Assuming

the

module

soldered

placed

the

Top

Layer,

also

wrong

randomly

route

the

Bottom

Layer

other

layers,

which

will

affect

the

module's

spurs

and

receiving

sensitivity

varying

degrees.

Assume

that

there

are

traces

with

large

electromagnetic

interference

around

the

module

(high-frequency

digital,

high-frequency

analog,

power

trace),

which

will

greatly

affect

the

performance

the

module.

recommended

stay

away

from

the

module

according

the

strength

the

interference.

necessary,

appropriate

isolation

and

shielding

can

done;

the

communication

line

uses

level,

1k-5.1k

resistor

must

connected

series

(not

recommended,

there

still

risk

damage).

Try

stay

away

from

some

physical

layers

and

also

have

2.4GHz

TTL

protocol,

for

example:

USB3.0

The

antenna

mounting

structure

has

great

influence

the

performance

the

module.

necessary

ensure

that

the

antenna

exposed,

preferably

vertically

upward.

When

the

module

mounted

inside

the

case,

use

good

antenna

extension

cable

extend

the

antenna

the

outside

the

case.

The

antenna

must

not

installed

inside

the

metal

case,

which

will

greatly

reduce

the

transmission

distance.

Itis

recommended

add

200R

protection

resistor

the

RXD/TXD

the

external

MCU.

4.2

Software

Programming

This

module

SX1268/SX1262+PA+LNA.

Its

driving

mode

exactly

the

same

SX1268/SX1262.

Users

can

operate

according

SX1268/SX1262

chip

datasheet.

DIO1

and

DIO2

are

general-purpose

ports,

which

can

configured

into

multiple

functions.

DIO2

can

connected

TXEN

and

not

connected

the

MCU's

port.

can

used

control

the

switch

transmission.

not

used,

you

can

hang

it.

For

details,

see the

SX1262

manual.

DIO

3 is

used

supply

MHz

TCXO

crystal

oscillator.

FAQ

5.1

Communication

range

too

short

The

communication

distance

will

affected

when

obstacle

exists.

Data

lose

rate

will

affected

temperature,

humidity

and

co-channel

interference.

The

ground

will

absorb

and

reflect

wireless

radio

wave,

the

performance

will

poor

when

testing

near

ground.

Sea

water

has

great

ability

absorbing

wireless

radio

wave,

performance

will

poor

when

testing

near

the

sea.

The

signal

will

affected

when

the

antenna

near

metal

object

put

metal

case.

Power

was

set

incorrectly,

air

data

rate

set

too

high

(the

higher

the

air

data

rate,

the

shorter

the

distance).

When

the

power

supply

room

temperature

lower

than

the

recommended

low

voltage,

the

lower

the

voltage

is,

the

lower

the

transmitting

power

is.

Due

antenna

quality

poor

matching

between

antenna

and

module.

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User

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5.2

Module

easy

damage

Please

check

the

power

supply

and

ensure

within

the

recommended

range.

Voltage

higher

than

the

peak

will

lead

permanent

damage

the

module.

Please

check

the

stability

power

supply

and

ensure

the

voltage

not

fluctuate

too

much.

Please

make

sure

anti-static

measures

are

taken

when

installing

and

using,

high

frequency

devices

have

electrostatic

susceptibility.

Please

ensure

the

humidity

within

limited

range

for

some

parts

are

sensitive

humidity.

Please

avoid

using

modules

under

too

high

too

low

temperature.

5.3

High

bit

error

rate

There

are

co-channel

signal

interference

nearby,

keep

away

from

interference

sources

modify

frequency,

channel

avoid

interference.

The

clock

waveform

the

SPI

not

standard.

Check

whether

there

interference

the

SPI

line.

The

SPI bus

line

should

not

too

long.

Unsatisfactory

power

supply

may

also

cause

garbled

characters,

and

ensure

the

reliability

the

power

supply.

Ifthe

extension

cable

feeder

poor

quality

too

long,

the

bit

error

rate

will

high.

Welding

operation

guidance

6.1

Reflow

Soldering

Temperature

Profile

Feature

Curve

feature

Sn-Pb

Assembly

Pb-Free

Assembly

Solder

Paste

Solder

paste

Sn63/Pb37

S1n96.5/Ag3/Cu0.5

) )

Minimum

preheating

Preheat

Temperature

min

(Tsmin)

100°C 150°C

temperature

Maximum

preheating

Preheat

temperature

max

(Tsmax)

150°C

200°C

temperature

Preheat

Time

(Tsmin

Tsmax)(ts)

Preheating

time

60-120

sec

60-120

sec

Average

ramp-up

rate(Tsmax

Tp)

Average

rising

rate

3°C/second

max

3°C/second

max

Liquidous

Temperature

(TL)

Liquid

phase

temperature

183°C

217°C

Time

(tL)

Maintained

Above

(TL)

Time

above

liquidus

60-90

sec

30-90

sec

Peak

temperature

(Tp)

Peak

temperature

220-235°C

230-250°C

Aveage

ramp-down

rate

(Tp

Tsmax)

Average

descent

rate

6°C/second

max

6°C/second

max

Time

25°C

peak

temperature

Time

peak

temperature

minutes

max

minutes

max

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