VIA Technologies EPIA-MII Manual de usuario

User’s Manual

EPIA-MII

Mini-ITX Mainboard

Version 1.61

September 25, 2008

document may be reproduced, transmitted, transcribed, stored in a retrieval system, or

translated into any language, in any form or by any means, electronic, mechanical, magnetic,

optical, chemical, manual or otherwise without the prior written permission of VIA

Technologies Incorporated.

Trademarks

Windows CE™, Windows XP™, Windows 2000™, Windows ME™, Windows 98™ and plug

and play™ are registered trademarks of Microsoft Corporation.

PS/2 is a registered trademark of IBM Corporation.

AwardBIOS is a registered trademark of Phoenix Technologies Ltd.

All trademarks are the property of their respective holders.

Macrovision

Apparatus Claims of U.S. Patent Nos. 6,836,549; 6,381,747; 7,050,698; 6,516,132; 5,583,936

licensed for limited viewing uses only. This product incorporates copyright protection

technology that is protected by certain U.S. patents and other intellectual property rights owned

by Macrovision and other rights owners. Use of this copyright protection technology must be

authorized by Macrovision, and is intended for home and other limited viewing uses only

unless otherwise authorized by Macrovision. Reverse engineering or disassembly is

prohibited.

Disclaimer

No license is granted, implied or otherwise, under any patent or patent rights of VIA

Technologies. VIA Technologies makes no warranties, implied or otherwise, in regard to this

document and to the products described in this document. The information provided in this

document is believed to be accurate and reliable as of the publication date of this document.

However, VIA Technologies assumes no responsibility for the use or misuse of the information

in this document and for any patent infringements that may arise from the use of this

document. The information and product specifications within this document are subject to

change at any time, without notice and without obligation to notify any person of such change.

FCC-B Radio Frequency Interference Statement

This equipment has been tested and found to comply with the limits for a class B digital

device, pursuant to part 15 of the FCC rules. These limits are designed to provide reasonable

protection against harmful interference when the equipment is operated in a commercial

environment. This equipment generates, uses and can radiate radio frequency energy and, if not

installed and used in accordance with the instruction manual, may cause harmful interference

to radio communications. Operation of this equipment in a residential area is likely to cause

harmful interference, in which case the user will be required to correct the interference at his

personal expense.

Notice 1

The changes or modifications not expressly approved by the party responsible for compliance

could void the user's authority to operate the equipment.

Notice 2

Shielded interface cables and A.C. power cord, if any, must be used in order to comply with

the emission limits.

Tested To Comply

With FCC Standards

FOR HOME OR OFFICE USE

Safety Instructions

1. Always read the safety instructions carefully.

2. Keep this User's Manual for future reference.

3. Keep this equipment away from humidity.

4. Lay this equipment on a reliable flat surface before setting it up.

5. The openings on the enclosure are for air convection hence protects the equipment from

overheating. DO NOT COVER THE OPENINGS.

6. Make sure the voltage of the power source and adjust properly 110/220V before

connecting the equipment to the power inlet.

7. Place the power cord in such a way that people cannot step on it. Do not place anything

over the power cord.

8. Always unplug the power cord before inserting any add-on card or module.

9. All cautions and warnings on the equipment should be noted.

10. Never pour any liquid into the opening. Liquid can cause damage or electrical shock.

11. If any of the following situations arises, get the equipment checked by a service personnel:

•The power cord or plug is damaged

•Liquid has penetrated into the equipment

•The equipment has been exposed to moisture

•The equipment has not work well or you cannot get it work according to User's

Manual.

•The equipment has dropped and damaged

•If the equipment has obvious sign of breakage

12. DO NOT LEAVE THIS EQUIPMENT IN AN ENVIRONMENT UNCONDITIONED,

STORAGE TEMPERATURE ABOVE 60 C (140F), IT MAY DAMAGE THE

EQUIPMENT.

Caution:

Only use the appropriate battery specified for this product.

Do not reuse, recharge, or reheat an old battery.

Do not attempt to force open the battery.

Do not discard used batteries with regular trash.

Discard used batteries according to local regulations.

ONTENTS

•1 x VIA Mainboard

•1 x Quick Insta ation Guide

•1 x F oppy Ribbon Cab e

•1 x ATA-66/100/133 IDE Ribbon Cab e

•1 x I/O Bracket

•1 x Driver Uti ities CD

ABLE OF

ONTENTS

Box Contents............................................................................ i

Tab e of Contents .................................................................... ii

Chapter 1 ............................................................................... 1

Specifications ....................................................................... 1

Mainboard Specifications ....................................................... 2

Mainboard Layout ................................................................. 4

Back Pane Ports ................................................................... 6

S ots.................................................................................... 6

Onboard Connectors and Jumpers........................................... 7

Chapter 2 ............................................................................... 9

Insta ation........................................................................... 9

CPU ................................................................................... 10

Memory Modu e Insta ation ................................................. 12

Connecting the Power Supp y ............................................... 14

Back Pane Ports ................................................................. 15

Connectors ......................................................................... 19

Jumpers............................................................................. 27

S ots.................................................................................. 28

Chapter 3 ............................................................................. 29

BIOS Setup ........................................................................ 29

Entering Setup ................................................................... 30

Contro Keys....................................................................... 30

Getting He p ....................................................................... 31

Main Menu ......................................................................... 32

Standard CMOS Features ..................................................... 34

Advanced BIOS Features...................................................... 36

Advanced Chipset Features .................................................. 39

Integrated Periphera s ......................................................... 41

Power Management Setup .................................................... 45

PNP/PCI Configurations ....................................................... 50

PC Hea th Status ................................................................. 53

Frequency / Vo tage Contro ................................................. 54

Load Fai -Safe Defau ts........................................................ 57

Load Optimized Defau ts ...................................................... 58

iii

Set Supervisor / User Password ............................................ 59

Save & Exit Setup ............................................................... 61

Exit Without Saving ............................................................. 62

Chapter 4 ............................................................................. 63

Driver Insta ation ............................................................... 63

Driver Uti ities .................................................................... 64

CD Content ........................................................................ 65

This page is intentiona y eft b ank.

HAPTER

Specifications

The u tra-compact and high y integrated VIA EPIA-MII Mini-ITX

Mainboard is the sma est form factor mainboard specification

avai ab e today, deve oped by VIA Techno ogies, Inc. as part of

the company’s open industry-wide tota connectivity initiative.

The mainboard enab es the creation of an exciting new

generation of sma , ergonomic, innovative and affordab e

embedded systems. Through high eve of integration, mini-ITX

on y occupy 66% of the size of F exATX mainboard form factor.

The mainboard comes with an embedded VIA Processor, boasting

u tra ow power consumption and coo , quiet operation.

Chapter 1

AINBOARD

PECIFICATIONS

CPU

•VIA C3 / EDEN EBGA Processor (onboard)

•Enhanced Ba Grid Array Package (EBGA)

•Interna L1 128KB and L2 64KB cache memory

Chipset

•VIA CLE266 North Bridge

•VT8235 South Bridge

Memory

•1 x DDR266 DIMM socket (up to 1 GB)

E pansion Slots

•1 x PCI

Graphics

•Integrated VIA Cast erock AGP graphics

Audio

•VT1616, six channe AC’97 Codec

Onboard IEEE 1394 (optional)

•VIA VT6307S IEEE 1394

LAN

•VIA VT6103 10/100 Base-T Ethernet PHY

IDE

•2 x U traDMA 66/100/133 connectors

OnModule CardBus/CF

•RICOH 476II

LVDS (optional)

•VIA VT1631 LVDS Transmitter

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