Texas Instruments ISOTMP35 Manual de usuario

EVM User's Guide: ISOTMP35BEVM

ISOTMP35 Evaluation Module

Description

ISOTMP35 is the industry's first isolated temperature

sensor IC, and provides an analog output voltage

proportional to Centigrade temperature with a 10

mV/°C positive slope gain. This user's guide details

through the steps to operate the ISOTMP35BEVM

evaluation module, designed to evaluate the isolated

temperature sensor. ISOTMP35BEVM also features a

detachable breakable ISOTMP35 temperature sensor

board portion and a screw hole for easy attachment to

a high-voltage bus bar or power MOSFET.

Get Started

1. Order ISOTMP35BEVM evaluation module

2. Connect EVM to computer

3. Go to the ISOTMP35 Gallery page on dev.ti.com

to either download the GUI or run on the web

4. Detach breakable sensor PCB section (optional)

5. Refer to ISOTMP35 data sheet for IC details

6. Visit our E2E forums for support or questions

Features

• Easy to use cloud-based GUI is available on the

web or can downloaded for offline use

• ISOTMP35 isolated temp sensor IC with

electrically isolated thermal connection

• Breakable ISOTMP35 sensor board

• Back side copper plane with screw hole allows HV

bus bar connection and good thermal conductivity

• Data logging using MCU integrated ADC

Applications

•EV charging infrastructure

–AC charging (pile) station

–DC fast charging station

–DC wallbox charger

–DC fast charging power module

•Solar Energy

–String inverter

•Hybrid, electric & powertrain systems

–HEV/EV on-board charger (OBC)

–HEV/EV DC/DC converter

–HEV/EV inverter & motor control

•Energy storage systems

–Power conversion system (PCS)

•Rack & server power

ISOTMP35BEVM

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ISOTMP35 Evaluation Module 1

1 Evaluation Module Overview

1.1 Introduction

The EVM uses a MSP430F5528 microcontroller along with a USB interface to enable the user to datalog results

and interface with the ISOTMP35 analog output. The EVM is separated into two sections, the microcontroller

section, and the sensor section. The sensor section can be separated from the microcontroller section. Then,

the sensor side of the EVM must be reconnected to the microcontroller side to operate the ISOTMP35 in a high

temperature or high voltage environment. The EVM has a bottom-side copper plate that can be glued or screwed

onto a high voltage heat source for easy user evaluation.

This user's guide describes the characteristics, operation, and use of the ISOTMP35 Evaluation Module (EVM).

A complete schematic diagram, printed-circuit board layouts, and bill of materials are included in this document.

1.2 Kit Contents

Table 1-1 details the contents of the EVM kit. Contact the nearest Texas Instruments Product Information Center

for missing components. TI highly recommends checking the TI website at https://www.ti.com for the latest

revision.

Table 1-1. EVM Kit Contents

Item Quantity

ISOTMP35BEVM 1

1.3 Specification

The controller side and the sensor breakout side of the EVM have different temperature limits, as shown in Table

1-2. The MSP430 limits the controller side temperature limits. The sensor breakout side temperature is limited by

the ISOTMP35.

Table 1-2. ISOTMP35BEVM Temperature Limits

BOARD SECTION CONDITIONS TEMPERATURE RANGE

Controller board Recommended operating free-air temperature, TA-40°C to 85°C

Absolute maximum junction temperature, TJ (MAX) 95°C

ISOTMP35 breakout board Recommended operating free-air temperature, TA-40°C to 150°C

Absolute maximum junction temperature, TJ (MAX) -60°C to 155°C

1.4 Device Information

ISOTMP35 is an isolated, linear analog output, temperature sensor designed to be connected directly to a high

voltage heat source. The analog output is proportional to the ambient temperature, with a slope of +10mV/°C

over the full sensor temperature range. A quick snapshot of key device specifications is shown in Table 1-3.

Table 1-3. ISOTMP35 Specifications

DEVICE SPECIFICATION VALUE

Operating temperature range -40°C to 150°C

Temperature accuracy (0°C to 70°C) ±1.0°C

Temperature accuracy (-40°C to 150°C) ±2.0°C

Maximum output current 500uA

Maximum capacitive load 1000 pF

Supply voltage range 2.3 V to 5.5 V

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1.5 General Texas Instruments High Voltage Evaluation (TI HV EVM) User Safety Guidelines

WARNING

Always follow TI’s setup and application instructions, including use of all interface components within their

recommended electrical rated voltage and power limits. Always use electrical safety precautions to help make

sure your personal safety and those working around you. Contact TI's Product Information Center http://ti.com/

support for further information.

Save all warnings and instructions for future reference.

WARNING

Failure to follow warnings and instructions can result in personal injury, property damage or death

due to electrical shock and burn hazards.

The term TI HV EVM refers to an electronic device typically provided as an open framed, unenclosed printed

circuit board assembly. It is intended strictly for use in development laboratory environments, solely for qualified

professional users having training, expertise and knowledge of electrical safety risks in development and

application of high voltage electrical circuits. Any other use and/or application are strictly prohibited by Texas

Instruments. If you are not suitably qualified, you should immediately stop from further use of the HV EVM.

1. Work Area Safety

a. Keep work area clean and orderly.

b. Qualified observers must be present anytime circuits are energized.

c. Effective barriers and signage must be present in the area where the TI HV EVM and the interface

electronics are energized, indicating operation of accessible high voltages can be present, for the

purpose of protecting inadvertent access.

d. All interface circuits, power supplies, evaluation modules, instruments, meters, scopes and other related

apparatus used in a development environment exceeding 50Vrms/75VDC must be electrically located

within a protected Emergency Power Off EPO protected power strip.

e. Use stable and nonconductive work surface.

f. Use adequately insulated clamps and wires to attach measurement probes and instruments. No

freehand testing whenever possible.

2. Electrical Safety

As a precautionary measure, it is always a good engineering practice to assume that the entire EVM can

have fully accessible and active high voltages.

a. De-energize the TI HV EVM and all the inputs, outputs and electrical loads before performing any

electrical or other diagnostic measurements. Revalidate that TI HV EVM power has been safely de-

energized.

b. With the EVM confirmed de-energized, proceed with required electrical circuit configurations, wiring,

measurement equipment connection, and other application needs, while still assuming the EVM circuit

and measuring instruments are electrically live.

c. After EVM readiness is complete, energize the EVM as intended.

WARNING

While the EVM is energized, never touch the EVM or the electrical circuits, as the electrical

circuits can be at high voltages capable of causing electrical shock hazard.

3. Personal Safety

a. Wear personal protective equipment (for example, latex gloves or safety glasses with side shields) or

protect EVM in an adequate lucent plastic box with interlocks to protect from accidental touch.

Limitation for safe use:

EVMs are not to be used as all or part of a production unit.

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ISOTMP35 Evaluation Module 3

2 Hardware

2.1 Overview

Figure 2-1 and Figure 2-2 show the top side and bottom side of the ISOTMP35BEVM. Figure 2-3 shows a block

diagram representation of the EVM for simplicity.

BSL Bu on Subregulator Switch

MSP430F5528

Programming

Header

Perfora on ISOTMP35

Top-Side HV

Connector

RC Filter

Breakout Sensor Sec on

Figure 2-1. ISOTMP35BEVM Board Top Side

Bo om-Side HV connector

Breakout Sensor Secon

Figure 2-2. ISOTMP35BEVM Board Bottom Side

HV SIDE

LV SIDE

ISOTMP35

MSP430

ADC Input (15pF)



onal RC Filter (R15 & C20)

Analog Out

ADC Input Cap (C17)

GND

Microcontroller Sec



on Breako



Sensor Sec



HV Cu Plate Connector

HEAT

100pF

GND

RC Filter Cap (C20)

RC Filter Res (R15)

Figure 2-3. ISOTMP35BEVM Board Block Diagram

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2.2 High Voltage Connection Setup Guide

2.2.1 Detaching the Sensor

The ISOTMP35BEVM functions with or without the sensor breakout board. However, to evaluate the ISOTMP35

in high voltage high temperature applications, the sensor breakout board must be detached to disconnect the

breakout sensor board. To detach the sensor board and reconnect correctly, follow these recommendations:

• De-solder bridge connectors from pads on both side.

• Break off the sensor board from the controller board along the perforations.

• Reconnect sensor board and controller board with wires soldered to labeled pads. The signals traveling

across these wires are low voltage, however the wires themselves must be rated to handle high-voltage

levels.

Depending on the application, the sensor board can be connected in such a way that the wires

connecting the EVM cross over other high voltage signals or components. If low voltage rated wires

are used in that case, then the wires and EVM can be damaged if the wires and EVM come into

physical contact with a high voltage signal.

The user can also choose the voltage on the sensor breakout board 3.3 V & GND pads. The ISOTMP35 can

accept any supply voltage from 2.3 V to 5.5 V.

2.2.2 Attaching Sensor Section to High Voltage Heat Source

Once the user has reconnected the sensor breakout board, the user can attach the EVM to a high-voltage heat

source using the bottom-side copper plate. This plate can be attached directly to a heat source, such as a

heat-sink from a high-power MOSFET or a high-voltage bus bar, using glue or screws.

• For best thermal conductivity, do not place an insulator between the high-voltage heat source and the EVM

bottom copper plate. Direct metal-to-metal contact is recommended.

• To decrease the ISOTMP35 response time, apply a thin layer of thermal conductive paste between the

connector and the high-voltage heat source.

• Dissimilar metals in contact can increase the thermal resistance, to minimize this effect use thermal

conductive paste.

• If screwing the EVM bottom copper connector on a high-power MOSFET, then TI recommends to minimize

connection distance to the MOSFET.

• When screwing on the EVM to any high-voltage heat source, note that the FR4 expands and contracts with

temperature. FR4 is a forgiving dielectric in terms of thermal expansion, but the user must periodically check

that the screwing remains fastened when safe to do so.

• When gluing the EVM copper pad to a high voltage heat source, use as little glue as possible to make sure

the connection is secure, excess glue increases the thermal resistance, therefore increasing response time.

Once again, thermal conductive paste between the two different metals helps to reduce the metal-to-metal

thermal resistance.

2.3 Perforations

There are perforations between the USB controller and the ISOTMP35 sensor, these exist so that after the

bridge connectors between the pads are desoldered, the two sides of the EVM can be broken apart easily.

2.4 Status LEDs & Subregulator

The ISOTMP35BEVM includes LEDs to indicate the board status; the green LED D3 illuminates when voltage

is supplied to the 3.3V net. The 3.3V net is connected directly to pin 1 of the ISOTMP35. U1 is the onboard

regulator which supplied the 3.3V net, and is enabled and disabled by switch S1. For normal operation of the

EVM, S1 must be enabled. When S1 is disabled, the green LED D3 turns off.

The red LED D4 is the MSP430F5528 status LED. Table 2-1 shows what the different modes of operation mean.

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ISOTMP35 Evaluation Module 5

Table 2-1. D4 LED Status

D4 LED STATUS MEANING

Off EVM is connected to EVM GUI

Blinking in 4 blink burst EVM is plugged into PC, not connected to EVM GUI

Steady blinking Connected to USB power

2.5 Programming Header

The ISOTMP35BEVM comes pre-loaded with firmware necessary for correct operation. Header J2 is provided

for Spy-Bi-Wire access to the MSP430F5528, but TI does not recommend that users access this header or

reprogram the device.

2.6 Pushbutton Switch

Switch SW1 is used for entering USB BSL mode; this can be used for firmware updates. To enter BSL mode,

connect the EVM to a PC USB port while holding down SW1.

2.7 RC Filter

On the sensor breakout board, R15 and C20 can be used for an optional RC circuit to filter the voltage output

of the ISOTMP35. R15 is already installed on the board, but is a 0 Ohm jumper so acts as a short. C20 is not

installed by default. The user can desolder R15, solder on a different resistor in the place of R15, and solder on

a capacitor for C20 to create an RC filter.

The user must be aware to not use a capacitor value greater than 885 pF for C20. The ISOTMP35 has a

maximum capacitive load of 1000 pF, however C17 on the controller portion of the EVM is a 100 pF cap that is

loaded onto the output voltage line. C17 prevents the voltage from dropping on the microcontroller ADC input, so

C17 must not be removed. The ADC pin of the MSP430F5528 has 15 pF of capacitive loading as well.

A typical value that helps reduce noise in most cases and minimize ADC sampling error is 680 pF. Adding any

resistor in place of R15 increases the output settling time, so the user must not exceed 100K Ohms if adding

a resistor. An output impedance 10K Ohms is enough to avoid instability on the ISOTMP35 output. A resistor

between 10K Ohms to 100K Ohms is acceptable.

In Table 2-2, three resistor and capacitor values for an RC circuit on the ISOTMP35 analog output pin are

provided, and the settling time and cutoff frequencies are calculated from that to help the user choose the right

resistor and capacitor combination for their application.

• 115 pF is shown because this is the capacitance already loading the ISOTMP35 analog output (100 pF from

C17, 15 pF from ADC pin of microcontroller) if the user does not add any capacitor to C20.

• 795 pF is shown because this takes the 115 pF already loaded and adds an additional 680 pF load which is

recommended above.

• 1000 pF is shown because this is the maximum capacitive load that can be put onto the ISOTMP35 analog

output.

Table 2-2. ISOTMP35 Settling Time & Cutoff Frequencies With Different RC Combinations

Settling Time

(us) & Cutoff

Frequency (KHz)

Settling Time (5*RC Time Constant) Cutoff Frequency (fC = 1/(2πRC))

115 pF 795 pF 1000 pF 115 pF 795 pF 1000 pF

1K Ohms 0.575 us 3.975 us 5 us 1384 KHz 200.3 KHz 159.2 KHz

10K Ohms 5.75 us 39.75 us 50 us 138.4 KHz 20.03 KHz 15.92 KHz

100K Ohms 57.5 us 397.5 us 500 us 13.84 KHz 2.003 KHz 1.592 KHz

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3 Software

The ISOTMP35BEVM software allows a user to read temperature from the ISOTMP35 by using the

MSP430F5528. The analog output voltage is read by the microcontroller and converted to displayed temperature

in software. Once the EVM hardware is connected to the GUI, temperature is sampled automatically once the

user navigates to the Data Capture tab. The ISOTMP35BEVM GUI also contains a functional block diagram, key

specs, and associated collateral for ISOTMP35.

3.1 Software Download

The PC GUI Software for ISOTMP35BEVM runs on TI's GUI Composer framework. The software is available

as a live version that runs in a browser and as a download for offline use. The software is compatible with

Microsoft® Windows®, Mac®, and Linux® operating systems.

3.1.1 Online Software

Access the online version by navigating to https://dev.ti.com/gallery/info/THSApps/ISOTMP35BEVM. The online

software works with Google Chrome®, Firefox®, and Safari® browsers. Users can access the live GUI be

following the link and clicking on the application icon withing the gallery to launch the software. If prompted,

install the TI Cloud Agent browser plug-in.

3.1.2 Offline Software

Fully offline version can be accessed by navigating to https://dev.ti.com/gallery/info/THSApps/ISOTMP35BEVM

and downloading the application and runtime for Linux, Mac, or Microsoft Windows, and then following the

on-screen installation instructions.

Figure 3-1. Download Pop-Up

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ISOTMP35 Evaluation Module 7

3.2 Home Tab

When opening the GUI, the Home tab is displayed, see the figure below. From the home tab, device features

such as a key specs and a functional block diagram can be seen when clicking the Learn More button. From the

Home tab, there are shortcuts on the left bar and on the bottom to the Data Capture tab and the Collateral tab.

Figure 3-2. Home Tab

3.3 Data Capture Tab

The Data Capture tab automatically begins making temperature measurements. The data displays on a graph

that scales with the temperature readings with recorded temperature on the y-axis, and measurement count

on the x-axis. The default capture rate is 1 measurement per second. The drop-down menu allows the user to

choose a different measurement rate, with the following options:

• Off

• As fast as possible

• Every 500 ms

• Every 1 s

• Every 5 s

• Every 10 s

• Every 60 s

The SAVE START and SAVE STOP buttons enable the user to log the EVM temperature results in a .csv

file. When SAVE START is selected, the file begins downloading, and downloading ends when SAVE STOP is

selected.

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Figure 3-3. Data Capture Tab

3.4 Collateral Tab

The Collateral tab contains links to relevant sites and documentation for the EVM. This includes links to the EVM

user's guide, the ISOTMP35 data sheet, the tool page on http://www.ti.com, any application notes, compliance

documentation, and any other relevant literature.

Figure 3-4. Collateral Tab

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ISOTMP35 Evaluation Module 9

4 Hardware Design Files

4.1 ISOTMP35BEVM Schematic

Figure 4-1 shows the EVM schematic.

VBUS

220 ohm

3P3V

3NC 4

OUT 5

GND

TLV70033DCKR

VBUS 1

D- 2

D+ 3

GND 4

2.2uF

100k

1.0k

GND

10uF

GND

6.2V

BZT52C6V2T-7

1.00M

1.50k

GND

10pF

16V

10pF

16V

GND

PUR

GND GND

Green

GND

TPD4E004DRYR

IO1 1

IO2 2

GND

IO3

IO4

VCC 6

GND

VCC

110

MP2MP1

MP3 MP4

SW1

GND

0.1uF

10V

GND

BSL

3NC 4

OUT 5

GND

TLV70033DCKR

VCC

VCORE VUSB

2.2uF

V18

GND

SBWTCK

10uF

Header_3x1

GND

SBWTDIO

0.47uF

6.3V

0.47uF

6.3V

0.47uF

6.3V

C10

GND GND GND

GND

VCC

Super Red

1.0k

R13

XT2IN

MSP430F5528IRGCR

P6.0/CB0/A0 1

P6.1/CB1/A1 2

P6.2/CB2/A2 3

P6.3/CB3/A3 4

P6.4/CB4/A4 5

P6.5/CB5/A5 6

P6.6/CB6/A6 7

P6.7/CB7/A7 8

P5.0/A8/VREF+/VEREF+

P5.1/A9/VREF-/VEREF-

AVCC1

P5.4/XIN

P5.5/XOUT

AVSS1 14

DVCC1

15 DVSS1 16

VCORE

P1.0/TA0CLK/ACLK

P1.1/TA0.0

P1.2/TA0.1

P1.3/TA0.2

P1.4/TA0.3

P1.5/TA0.4

P1.6/TA1CLK/CBOUT

P1.7/TA1.0

P2.0/TA1.1 26

P2.1/TA1.2 27

P2.2/TA2CLK/SMCLK 28

P2.3/TA2.0 29

P2.4/TA2.1 30

P2.5/TA2.2 31

P2.6/RTCCLK/DMAE0 32

P2.7/UCB0STE/UCA0CLK 33

P3.0/UCB0SIMO/UCB0SDA

P3.1/UCB0SOMI/UCB0SCL

P3.2/UCB0CLK/UCA0STE

P3.3/UCA0TXD/UCA0SIMO

P3.4/UCA0RXD/UCA0SOMI

DVSS2 39

DVCC2

P4.0/PM_UCB1STE/PM_UCA1CLK 41

P4.1/PM_UCB1SIMO/PM_UCB1SDA 42

P4.2/PM_UCB1SOMI/PM_UCB1SCL 43

P4.3/PM_UCB1CLK/PM_UCA1STE 44

P4.4/PM_UCA1TXD/PM_UCA1SIMO 45

P4.5/PM_UCA1RXD/PM_UCA1SOMI 46

P4.6/PM_NONE 47

P4.7/PM_NONE 48

VSSU 49

PU.0/DP

PUR

PU.1/DM

VBUS

VUSB

V18

AVSS2 56

P5.2/XT2IN

P5.3/XT2OUT

TEST/SBWTCK 59

PJ.0/TDO 60

PJ.1/TDI/TCLK 61

PJ.2/TMS 62

PJ.3/TCK 63

RST/NMI/SBWTDIO 64

QFN PAD 65

XT2OUT

4NC

VCC

33.0k

R14

PUR

SBWTDIOV18

VCORE SBWTCK

VBUS

2200pF

50V

C13

VUSB

VCC

GND

0.1uF

10V

C14

0.1uF

10V

C15

0.1uF

10V

C16

GNDGND GND

VBUS = 5V INPUT

VUSB = 3.3V OUT

VUSB 12mA Max

MCU_SDA

MCU_SCL

6.2V

BZT52C6V2T-7

3P3V

GND

0.1uF

10V

C11

ADC

VDD

GND1

PWMANA

NC1

GND

3P3V

GND1

0.1uF

10V

C18

ADC

50V

100pF

C17

GND

50V

1000pF

C20

50V

1000pF

C19

R15 VOUT

5100TR

THRM

MH6-32

N/A

VDD

1TSENSE 5

TSENSE 6

TSENSE 7

VOUT

GND

PISOTMP35BDFQR

GND1

Figure 4-1. ISOTMP35BEVM Schematic

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