Texas Instruments SimpleLink CC3200MOD Manual de usuario

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CC3200MOD

SWRS166 –DECEMBER 2014

CC3200MOD SimpleLink™ Wi-Fi

and Internet-of-Things Module Solution, a Single-Chip

Wireless MCU

1 Module Overview

1.1 Features

1– TCP/IP Stack

• The CC3200MOD is a Wi-Fi Module that Consists

of the CC3200R1M2RGC Single-Chip Wireless • 8 Simultaneous TCP, UDP, or RAW Sockets

MCU. This Fully Integrated Module Includes all • 2 Simultaneous TLS v1.2 or SSL 3.0

Required Clocks, SPI Flash, and Passives. Sockets

• Modular FCC, IC, and CE Certifications Save – Powerful Crypto Engine for Fast, Secured

Customer Effort, Time, and Money WLAN Connections With 256-Bit Encryption

• Wi-Fi CERTIFIED™ Modules, With Ability to – Station, Access Point, and Wi-Fi Direct™ Modes

Request Certificate Transfer for Wi-Fi Alliance – WPA2 Personal and Enterprise Security

Members – SimpleLink Connection Manager for Managing

• 1.27-mm Pitch LGA Package for Easy Assembly Wi-Fi Security States

and Low-Cost PCB Design – TX Power

• 17 dBm at 1 DSSS

• Applications Microcontroller Subsystem • 17.25 dBm at 11 CCK

– ARM Cortex-M4 Core at 80 MHz • 13.5 dBm at 54 OFDM

– Embedded Memory Options – RX Sensitivity

• Integrated Serial • –94.7 dBm at 1 DSSS

• RAM (up to 256KB) • –87 dBm at 11 CCK

• Peripheral Drivers in ROM • –73 dBm at 54 OFDM

– Hardware Crypto Engine for Advanced – Application Throughput

Hardware Security Including • UDP: 16 Mbps

• AES, DES, and 3DES • TCP: 13 Mbps

• SHA and MD5 • Power-Management Subsystem

• CRC and Checksum – Integrated DC-DC Converter With a Wide-

– 8-Bit, Fast, Parallel Camera Interface Supply Voltage:

– 1 Multichannel Audio Serial Port (McASP) • VBAT: 2.3 to 3.6 V

Interface With Support for I2S Format – Low-Power Consumption at 3.6 V

– 1 SD (MMC) Interface • Hibernate With Real-Time Clock (RTC):

– 32-Channel Micro Direct Memory Access 7μA

(μDMA) • Low-Power Deep Sleep: <275 μA

– 2 Universal Asynchronous • RX Traffic: 59 mA at 54 OFDM

Receivers/Transmitters (UARTs) • TX Traffic: 229 mA at 54 OFDM

– 2 Serial Peripheral Interfaces (SPIs) – Additional Integrated Components

– 1 Inter-integrated Circuit (I2C) • 40.0-MHz Crystal

– 4 General-Purpose Timers (GPTs) • 32.768-kHz Crystal (RTC)

– 16-Bit Pulse-Width Modulation (PWM) Mode • 8-Mbit SPI Serial Flash RF Filter and

– 1 Watchdog Timer Module Passive Components

– 4-Channel 12-Bit Analog-to-Digital Converters – Package and Operating Conditions

(ADCs) • 1.27-mm Pitch, 63-Pin, 20.5-mm ×

– Up to 25 Individually Programmable GPIO Pins 17.5 mm LGA Package for Easy Assembly

• Wi-Fi Network Processor Subsystem and Low-Cost PCB Design

– 802.11b/g/n Radio, Baseband, and Medium • Operating Temperature Range: –20°C to

Access Control 70°C

An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,

intellectual property matters and other important disclaimers. PRODUCTION DATA.

CC3200MOD

SWRS166 –DECEMBER 2014

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1.2 Applications

• Internet of Things (IoT) • Internet Gateway

• Cloud Connectivity • Industrial Control

• Home Automation • Smart Plug and Metering

• Home Appliances • Wireless Audio

• Access Control • IP Network Sensor Nodes

• Security Systems • Wearables

• Smart Energy

1.3 Description

Start your design with the industry’s first programmable FCC, IC, CE, and Wi-Fi Certified Wireless

microcontroller (MCU) module with built-in Wi-Fi connectivity. Created for the Internet of Things (IoT), the

SimpleLink CC3200MOD is a wireless MCU module that integrates an ARM Cortex-M4 MCU, allowing

customers to develop an entire application with a single device. With on-chip Wi-Fi, Internet, and robust

security protocols, no prior Wi-Fi experience is required for faster development. The CC3200MOD

integrates all required system-level hardware components including clocks, SPI flash, RF switch, and

passives into an LGA package for easy assembly and low-cost PCB design. The CC3200MOD is provided

as a complete platform solution including software, sample applications, tools, user and programming

guides, reference designs, and the TI E2E™ support community

The applications MCU subsystem contains an industry-standard ARM Cortex-M4 core running at 80 MHz.

The device includes a wide variety of peripherals, including a fast parallel camera interface, I2S, SD/MMC,

UART, SPI, I2C, and four-channel ADC. The CC3200 family includes flexible embedded RAM for code

and data; ROM with external serial flash bootloader and peripheral drivers; and SPI flash for Wi-Fi network

processor service packs, Wi-Fi certificates, and credentials.

The Wi-Fi network processor subsystem features a Wi-Fi Internet-on-a-chip™ and contains an additional

dedicated ARM MCU that completely off-loads the applications MCU. This subsystem includes an 802.11

b/g/n radio, baseband, and MAC with a powerful crypto engine for fast, secure Internet connections with

256-bit encryption. The CC3200MOD supports station, access point, and Wi-Fi Direct™ modes. The

device also supports WPA2 personal and enterprise security and WPS 2.0. The Wi-Fi Internet-on-a-chip

includes embedded TCP/IP and TLS/SSL stacks, HTTP server, and multiple Internet protocols. The

power-management subsystem includes integrated DC-DC converters supporting a wide range of supply

voltages. This subsystem enables low-power consumption modes, such as the hibernate with RTC mode

requiring less than 7 μA of current.

Table 1-1. Module Information(1)

PART NUMBER PACKAGE BODY SIZE

CC3200MODR1M2AMOB MOB (63) 20.5 mm × 17.5 mm

(1) For more information, see Section 9,Mechanical Packaging and Orderable Information.

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CC3200MOD

VCC

GPIO &

Peripheral

Interfaces RF Filter

Serial

Flash

8Mbit

Pull-up

resistors

CC3200R1M2RGC

Power

Inductors

Caps

32-KHz

Crystal 40-MHz

Crystal

CC3200MOD

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SWRS166 –DECEMBER 2014

1.4 Functional Block Diagram

Figure 1-1 shows the functional block diagram of the CC3200MOD module.

(1) For 3200MOD module pin multiplexing details, refer to CC3200R device datasheet (literature number: SWAS032)

Figure 1-1. CC3200MOD Module Functional Block Diagram

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ARM Cortex-M4 80 MHz Processor

ARM Processor (Wi-Fi Network Processor)

Wi-Fi Baseband

Wi-Fi MAC

Wi-Fi Radio

Wi-Fi Driver

Supplicant

TCP/IP

TLS/SSL

Internet Protocols

User Application

Embedded Wi-Fi

Embedded Internet

CC3200MOD

SWRS166 –DECEMBER 2014

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Figure 1-2. CC3200 Hardware Overview

Figure 1-3. CC3200 Software Overview

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Table of Contents

1 Module Overview ........................................ 15.3 ARM Cortex-M4 Processor Core Subsystem....... 42

1.1 Features .............................................. 15.4 CC3200 Device Encryption ......................... 43

1.2 Applications........................................... 25.5 Wi-Fi Network Processor Subsystem............... 44

1.3 Description............................................ 25.6 Power-Management Subsystem .................... 45

1.4 Functional Block Diagram ............................ 35.7 Low-Power Operating Mode ........................ 45

2 Revision History ......................................... 65.8 Memory.............................................. 46

3 Terminal Configuration and Functions.............. 75.9 Boot Modes.......................................... 48

3.1 CC3200MOD Pin Diagram ........................... 76 Applications, Implementation, and Layout ....... 51

3.2 Pin Attributes ......................................... 86.1 Reference Schematics .............................. 51

3.3 Pin Attributes and Pin Multiplexing.................. 10 6.2 Bill of Materials...................................... 52

3.4 Recommended Pin Multiplexing Configurations .... 19 6.3 Layout Recommendations .......................... 52

3.5 Drive Strength and Reset States for Analog-Digital 7 Environmental Requirements and

Multiplexed Pins..................................... 22 Specifications........................................... 56

3.6 Pad State After Application of Power To Chip But 7.1 Temperature......................................... 56

Prior To Reset Release ............................. 22 7.2 Handling Environment .............................. 56

4 Specifications........................................... 23 7.3 Storage Condition ................................... 56

4.1 Absolute Maximum Ratings......................... 23 7.4 Baking Conditions................................... 56

4.2 Handling Ratings.................................... 23 7.5 Soldering and Reflow Condition .................... 56

4.3 Power-On Hours .................................... 23 8 Product and Documentation Support.............. 58

4.4 Recommended Operating Conditions............... 23 8.1 Development Support ............................... 58

4.5 Brown-Out and Black-Out........................... 24 8.2 Device Nomenclature ............................... 58

4.6 Electrical Characteristics (3.3 V, 25°C) ............. 25 8.3 Community Resources.............................. 59

4.7 Thermal Resistance Characteristics for MOB 8.4 Trademarks.......................................... 59

Package ............................................. 26 8.5 Electrostatic Discharge Caution..................... 59

4.8 Reset Requirement ................................. 26 8.6 Export Control Notice ............................... 59

4.9 Current Consumption ............................... 27 8.7 Glossary............................................. 59

4.10 WLAN RF Characteristics........................... 30 9 Mechanical Packaging and Orderable

4.11 Timing Characteristics............................... 31 Information .............................................. 60

5 Detailed Description ................................... 42 9.1 Mechanical Drawing................................. 60

5.1 Overview ............................................ 42 9.2 Package Option ..................................... 61

5.2 Functional Block Diagram........................... 42

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SWRS166 –DECEMBER 2014

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2 Revision History

DATE REVISION NOTES

November 2014 * Initial release.

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28 29 30 31 3332 34 35 36 37 38 39 40 41 42 43

16 15 14 13 1112 10 9 8 7 6 5 4 3 2 1

62 61

57 56

GND

ANTSEL2

ANTSEL1

SOP1

SOP2

JTAG_TMS

JTAG_TCK

GPIO28

JTAG_TDO

GND

JTAG_TDI

GPIO22

GPIO13

GPIO12

GPIO17

GPIO16

GPIO15

GPIO14

GPIO11

GPIO10

GND

GPIO0

GPIO1

GPIO2

GPIO3

GPIO4

GPIO5

GPIO6

GPIO7

GPIO8

GPIO9

GND

RF_BG

GND

SOP0

nRESET

VBAT_DCDC_ANA

VBAT_DCDC_PA

GND

VDD_ANA2

VBAT_DCDC_DIG_IO

GPIO30

GND

CC3200MOD

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SWRS166 –DECEMBER 2014

3 Terminal Configuration and Functions

3.1 CC3200MOD Pin Diagram

Figure 3-1 shows the pin diagram for the CC3200MOD.

Figure 3-1. CC3200MOD Pin Diagram (Bottom View)

NOTE

Figure 3-1 shows the approximate location of pins on the module. For the actual mechanical

diagram refer to Section 9.

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CC3200MOD

SWRS166 –DECEMBER 2014

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3.2 Pin Attributes

Table 3-1 lists the pin descriptions of the CC3200MOD module. "DEVICE PIN NO" refers to the pin

number of the QFN part CC3200. This is stated here because the QFN pin is referred to in the SDK.

Table 3-1. Pin Attributes

MODULE MODULE PIN NAME TYPE DEVICE PIN NO MODULE PIN DESCRIPTION

PIN NO.

1 GND - Ground

2 GND - Ground

3 GPIO10 I/O 1 GPIO(1)

4 GPIO11 I/O 2 GPIO(1)

5 GPIO14 I/O 5 GPIO(1)

6 GPIO15 I/O 6 GPIO(1)

7 GPIO16 I/O 7 GPIO(1)

8 GPIO17 I/O 8 GPIO(1)

9 GPIO12 I/O 3 GPIO(1)

10 GPIO13 I/O 4 GPIO(1)

11 GPIO22 I/O 15 GPIO(1)

12 JTAG_TDI I/O 16 GPIO(1)

13 NC - 13 Reserved for TI

14 NC - 14 Reserved for TI

15 NC - 11 Reserved for TI

16 GND - Ground

17 NC - 12 Reserved for TI

18 JTAG_TDO I/O 17 GPIO(1)

19 GPIO28 I/O 18 GPIO(1)

20 NC - 23 Unused. Do not connect.

21 JTAG_TCK I/O 19 JTAG TCK input. Needs 100-kΩpulldown resistor to ground.(1)

22 JTAG_TMS I/O 20 JTAG TMS input. Leave unconnected if not used on product.(1)

23 SOP2 - 21 Add 2.7-kΩpulldown resistor to ground needed for functional

mode. Add option to pullup required for entering the UART load

mode for flashing.

24 SOP1 - 34 Reserved. Do not connect.

25 ANTSEL1 I/O 29 Antenna selection control(1)

26 ANTSEL2 I/O 30 Antenna selection control(1)

27 GND - Ground

28 GND - Ground

29 NC - 27, 28 Reserved for TI

30 GND - Ground

31 RF_BG I/O 31 2.4-GHz RF input/output

32 GND - Ground

33 NC - 38 Reserved for TI

34 SOP0 - 35 Optional 10-kΩpullup if user chooses to use SWD debug mode

instead of 4-wire JTAG

35 nRESET I 32 Power on reset. Does not require external RC circuit

36 VBAT_DCDC_ANA - 37 Power supply for the device, can be connected to battery (2.3 V

to 3.6 V)

37 VBAT_DCDC_PA - 39 Power supply for the device, can be connected to battery (2.3 V

to 3.6 V)

38 GND - Ground

(1) For pin multiplexing details, refer to CC3200R device data sheet

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Table 3-1. Pin Attributes (continued)

MODULE MODULE PIN NAME TYPE DEVICE PIN NO MODULE PIN DESCRIPTION

PIN NO.

39 NC - 47 Leave unconnected

40 VBAT_DCDC_DIG_IO - 10, 44, 54 Power supply for the device, can be connected to battery (2.3 V

to 3.6 V)

41 NC - 25, 36, 48 Reserved for TI

42 GPIO30 I/O 53 GPIO(1)

43 GND - Ground

44 GPIO0 I/O 50 GPIO(1)

45 NC - 51 Reserved for TI

46 GPIO1 I/O 55 GPIO(1)

47 GPIO2 I/O 57 GPIO(1)

48 GPIO3 I/O 58 GPIO(1)

49 GPIO4 I/O 59 GPIO(1)

50 GPIO5 I/O 60 GPIO(1)

51 GPIO6 I/O 61 GPIO(1)

52 GPIO7 I/O 62 GPIO(1)

53 GPIO8 I/O 63 GPIO(1)

54 GPIO9 I/O 64 GPIO(1)

55 GND - Thermal Ground

56 GND - Thermal Ground

57 GND - Thermal Ground

58 GND - Thermal Ground

59 GND - Thermal Ground

60 GND - Thermal Ground

61 GND - Thermal Ground

62 GND - Thermal Ground

63 GND - Thermal Ground

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CC3200MOD

SWRS166 –DECEMBER 2014

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3.3 Pin Attributes and Pin Multiplexing

The module makes extensive use of pin multiplexing to accommodate the large number of peripheral

functions in the smallest possible package. To achieve this configuration, pin multiplexing is controlled

using a combination of hardware configuration (at module reset) and register control.

The board and software designers are responsible for the proper pin multiplexing configuration. Hardware

does not ensure that the proper pin multiplexing options are selected for the peripherals or interface mode

used. Table 3-2 describes the general pin attributes and presents an overview of pin multiplexing. All pin

multiplexing options are configurable using the pin mux registers. The following special considerations

apply:

• All I/Os support drive strengths of 2, 4, and 6 mA. Drive strength is configurable individually for each

pin.

• All I/Os support 10-μA pullups and pulldowns.

• These pulls are not active and all of the I/Os remain floating while the device is in Hibernate state.

• The VIO and VBAT supply must be tied together at all times.

• All digital I/Os are nonfail-safe.

NOTE

If an external device drives a positive voltage to the signal pads and the CC3200MOD is not

powered, DC current is drawn from the other device. If the drive strength of the external

device is adequate, an unintentional wakeup and boot of the CC3200MOD can occur. To

prevent current draw, TI recommends any one of the following:

• All devices interfaced to the CC3200MOD must be powered from the same power rail as

the chip.

• Use level-shifters between the module and any external devices fed from other

independent rails.

• The nRESET pin of the CC3200MOD must be held low until the VBAT supply to the

module is driven and stable

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