Texas Instruments TPA2018D1YZFEVM Manual de usuario

1 Introduction

1.1 Description

User's GuideSLOU256 – August 2009

TPA2018D1YZFEVM

Contents1 Introduction ................................................................................................................... 12 Operation ..................................................................................................................... 23 TPA2018D1YZFEVM Schematic .......................................................................................... 74 TPA2018D1YZFEVM PCB Layers ........................................................................................ 95 TPA2018D1YZFEVM Parts List .......................................................................................... 10

List of Figures

1 Place Shunts Horizontally Across SDA and SCL ........................................................................ 22Found New Hardware Wizard Advisory Screen ....................................................................... 33 Starting the Software ........................................................................................................ 44 Software Interface ........................................................................................................... 55 Connect I

C Controls to JP3 ............................................................................................... 66 TPA2018D1YZFEVM – YZF-Device Schematic, Page 1 ............................................................... 77 TPA2018D1YZFEVM – YZF-Device Schematic, Page 2 ............................................................... 88 TPA2018DYZF1EVM – YZF-Device Top Layer ......................................................................... 99 TPA2018D1YZFEVM – YZF-Device Bottom Layer ..................................................................... 9

List of Tables

1 Bill of Materials for TPA2018D1YZFEVM ............................................................................... 10

The TPA2018D1 is a mono, filter-free Class-D audio power amplifier with automatic gain control (AGC),dynamic range compression (DRC) and I

C digital volume control. The AGC and DRC functions enhancethe perceived audio loudness, and at the same time prevent speaker damage from overdrive. TheTPA2018D1 has independent software shutdown control and a 30-step volume control. Availability in theWCSP package makes TPA2018D1 an ideal choice for both cellular handsets and PDAs.

The TPA2018D1 evaluation module (EVM) is a complete, stand-alone audio board. It contains theTPA2018D1 WCSP (YZF) Class-D audio power amplifier.

All components and the EVM are Pb free.

Windows is a trademark of Microsoft Corporation.

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1.2 TPA2018D1YZFEVM Specifications

2 Operation

2.1 Quick Start List for Stand-Alone Operation

2.1.1 Software Installation Sequence

2.1.2 Evaluation Module Preparations

Operation

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Supply voltage range –0.3 V to 6 VI

Supply current 2 A MaximumP

Continuous output power per channel, 8 Ω, Vdd = 5.0 V, THD + N = 10% 1.7 WV

Audio Input Voltage 0.5 V to V

- 0.5 VRL Minimum load impedance 8 Ω

The TPA2018D1YZFEVM can be evaluated in a stand-alone mode or when connected to existing circuitswith I

C controls.

A desktop or laptop computer with Windows™ XP installed is required in the stand-alone operation. Installthe software before connecting the EVM to a computer with a USB cable. The inputs accept standardRCA plugs and the outputs accept banana connectors.

1. Insert the CD provided.2. Unzip the files to a temporary folder.3. Install TPA2018D1 software by executing setup.exe located in TPA2018D1 Interface\.

Accept license agreement and defaults, and complete the installation. Note: you can uninstall later withAdd/Remove Programs.

Note: It is unnecessary to repeat the steps in Section 2.1.1 , once the software is installed.

1. Ensure that all external power sources are set to OFF.2. Install shunt in jumper JP4;3. Install shunts in jumpers JP2 when single-ended audio input is used; this ties IN– to ground.4. Install shunts in J1 and J3 as shown in Figure 1 . This sets the TPA2018D1 to accept I

C inputs fromthe EVM itself.

Figure 1. Place Shunts Horizontally Across SDA and SCL

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Operation

5. Powering the EVM:•The EVM can be powered via USB connection or by external power supply:a. Via USB power: Install shunt for USBPWR if USB power is used.b. External power supply: connect an external regulated power supply adjusted for 2.5 V–5.5 V to theVDD and GND banana jacks, taking care to observe marked polarity. Make sure USBPWR isremoved in this case.Note:

i. USB interface may not be able to provide enough current. For best audio performance, useexternal power supply.ii. Make sure only one power source is used. Connecting two power sources will cause damageto the device and the supply.6. Connect audio source to RCA jacks IN.7. Connect speakers (8 Ωto 32 Ω) to the output banana jacks OUTP and OUTM.8. Plug in USB.9. Turn on the power supply.10. If this is the first time a TPA2018D1YZFEVM is plugged in after installing the software, follow theWindows dialog (Figure 2 ), questions, and selections:a. Select "Install from a list or specific location (Advanced)", then click next.

(1)

b. Browse to the folder where the TPA2018D1 interface is installed then click ok.c. Windows will automatically install the driver.

Figure 2. Found New Hardware Wizard Advisory Screen

Note: It is not necessary to repeat steps 10. a. to c., once the driver is installed.

(1)

Computer screen images showing Windows XP interface are courtesy of Microsoft Corporation

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2.1.3 Using the Software

Operation

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1. Start the TPA2018D1 Interface by clicking the Start menu and clicking on the TPA2018D1 Interfaceicon.

Figure 3. Starting the Software

2. The TPA2018D1 software interface is as shown in Figure 4 .

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Operation

Figure 4. Software Interface

Note: The TPA2018D1 powers up with the amplifier in software shutdown. To hear an output,uncheck shutdown.

3. Uncheck and check SPK_EN to place the Class-D output in and out of CHANNEL SHUTDOWN.4. Click Shutdown to place the TPA2018D1 in and out of SOFTWARE SHUTDOWN.5. Adjust the Attack Time, Release Time and Hold Time by sliding the bar or clicking the tap in the GUI.You can also type a value in the box; in that case, the value will be rounded to the closest availablesetting.

6. Adjust the Fixed Gain, Maximum Gain and Limiter Level by dragging the bar or clicking the tap in theGUI. You can also type a value in the box; in that case, the value will be rounded to the closestavailable setting.7. Adjust Compression Ratio and Noise Gate Threshold by clicking the value.8. The Limiter Power Level can be calculated by selecting the Load Resistance.9. I2C Status box reports the status of I

C communications. An error or failure has occurred if it showsI2C failure.10. To read the I

C status, click Refresh.11. Thermal box reports the status of thermal failure. A thermal fault has occurred if it turns red.12. Click Show Graph to display the AGC transfer function. The transfer function is automatically updatedwith the current AGC parameters (fixed gain, maximum gain, limiter level and compression) in GUI.Click Hide Graph to hide the transfer function.13. Volume Macro simulates volume control by changing fixed gain, limiter level and maximum gainsimultaneously. Follow the steps below to use the Volume Marco.•At the top left corner of the GUI, select Volume Macro.•Slide the volume bar to adjust the volume.•Click Volume Marco again to go back to GUI.•Click refresh to update the AGC parameters.14. The GUI has a built-in I

C programming interface. Follow the steps below to use the I

C programmingfunction.

•At the top left corner of the GUI, click File to access the I

C programming interface.

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2.1.4 Shutdown Control

2.2 Quick Start List When Connected to Existing Circuits With I

C Controls

2.2.1 Evaluation Module Preparations

Operation

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•Save Script can record the current register values. Select Save Script >> Click the folder icon tobrowse to the place where you want to save the script >> name the file in text format, then selectOK to save.•Load Script can load the previously saved script to program the entire register file. Select LoadScript >> Click the folder icon to browse to the place where the script is located >> Select the filethen click OK >> Click Load.•I2C interface can program individual register value of TPA2018D1. Select I

C Interface >> I

Caddress is xB0, which is the address of TPA2018D1. Device address is from 1 to 7, which is theregister address of TPA2018D1.

The TPA2018D1 EVM provides independent hardware shutdown controls for the Class-D power amplifierand the USB controller.1. Press and hold push button S1 to shutdown TPA2018D1. Release S1 to activate TPA2018D1.2. Press and hold push button S2 to shutdown the USB controller. Release S2 to activate the USBcontroller.

The TPA2018D1YZFEVM can be easily connected to existing circuits with I

C controls. Connections to theEVM module can be made using banana plugs for the power supply. The inputs accept standard RCAplugs and the outputs accept banana connectors.

1. Ensure that all external power sources are set to OFF.2. Install shunts in jumpers JP4.3. Remove shunts between J1 and J3 and connect I

C controls to J1 as shown in Figure 5 .

Figure 5. Connect I

C Controls to JP3

4. Install shunts in jumpers JP2 when single-ended audio input is used; this ties IN– to ground.5. Remove USBPWR.6. Connect an external regulated power supply adjusted for 2.5 V–5.5 V to the VDD and GND bananajacks, taking care to observe marked polarity.7. Connect audio source to IN.8. Connect speakers (8 Ωto 32 Ω) to the output banana jacks OUTP and OUTM.9. Turn on power supply.

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3 TPA2018D1YZFEVM Schematic

P1.0

USB+

VDD

JP2

1000pfd/50V

0603

1000pfd/50V

0603

4700pfd/50V

0603

4700pfd/50V

0603

FROM CONTROLLER J3

GND

100K

0603 R1

1.0ufd/10V

0603

1.0ufd/10V

0603

1.0ufd/10V

0603

1.0K

0805

DNP

1.0K

0805

DNP

RCA (Black)

FROM TAS1020 BSS138ZXCT

SOT23-DBV3

GND

Vdd

GND

JP_IN

DNP

JP_VDD

DNP

JP_OUT DNP

GND

OUTP

OUTM

White

TP OUTP

White

TP OUTM

Black

TP GND

White

SDA

White

SCL0805

FB1

0805

FB2

DNP

0603

C21

USB PWR

10ufd/6.3V

1206

VDD

GND

+3.3VD

USB+

WCSP9-YZF

0.0

0805

R16

MEASUREMENT FILTER

TPA2018D1YZF

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TPA2018D1YZFEVM Schematic

Figure 6. TPA2018D1YZFEVM – YZF-Device Schematic, Page 1

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USB+

P1.0

MRESET~

JP4

0.5in 0.5in 0.5in 0.5in

+3.3VD

+3.3VD +3.3VD

+3.3VD

GND

GND GND

GND

GND GND

GND

GND GND GND GND

27.4

0603

27.4

0603

3.3V/500mA

SOP8-D

VR1

100K

0603

R13

100K

0603

R11

3.09K

0603

R10

1.50K

0603

TAS1020BPFB

20191817

151413

2423

373839

42 41

434445

4647

24LC64-I/SN

SOP8-D(SOIC)

600 OHMS

0805

FB3

600 OHMS

0805

FB4

USB MINIB

Data-

ID_NC

GND

Data+

Case

100ufd/10V

C18

TANT2412

6.00MHz

HC49/US

2.00K

0603

R12

2.00K

0603

2.00K

0603

0.0

0805

R15

0.1ufd/10V

0603

C17

0.1ufd/10V

0603

C19

0.1ufd/10V

0603

C15

33pfd/50V

0603

C11

33pfd/50V

0603

C12

1000pfd/50V

0603

C14

0.1ufd/10V

0603

C20

47pfd/50v

0603

47pfd/50v

0603

C10

10ufd/6.3V

1206

C16

USB+

100pfd/50V

0603

C13

TPA2018D1

SCL

SDA

STANDOFF HARDWARE

USB TO I2C CONTROLLER

TPA2018D1YZFEVM Schematic

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Figure 7. TPA2018D1YZFEVM – YZF-Device Schematic, Page 2

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4 TPA2018D1YZFEVM PCB Layers

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TPA2018D1YZFEVM PCB Layers

Figure 8. TPA2018DYZF1EVM – YZF-Device Top Layer

Figure 9. TPA2018D1YZFEVM – YZF-Device Bottom Layer

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5 TPA2018D1YZFEVM Parts List

TPA2018D1YZFEVM Parts List

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Table 1. Bill of Materials for TPA2018D1YZFEVMRef Des Description QTY MFR Part No. MFR Vendor Part No. Vendor

TI SEMICONDUCTORS

U5 1.7 W Mono speaker driver W/AGC I2C CTRL, 1 TPA2018D1YZF Texas TPA2018D1YZF TexasWCSP9-YZF ROHS Instruments Instruments

VR1 VOLT REG 3.3V 500mA LDO fast transient response 1 TPS77533D Texas 296-2776-5 Digi-KeySOP8-D ROHS Instruments

U4 USB Streaming controller TQFP48-PFB ROHS 1 TAS1020BPFB Texas 296-13041-5 Digi-KeyInstruments

SEMICONDUCTIORS

U2 64K I2C SERIAL EEPROM SOP8-D 1 24LC64-I/SN Microchip 24LC64-I/SN Digi-Key

Q1 N-CH Enhancement mode VERT DMOS FET 1 BSS138TA Zetex BSS138ZXCT Digi-KeySOT23-DBV3 ROHS

Y1 Crystal, 6.000 MHz, SMT-HC49/US CSM-7 ROHS 1 ECS-60-32-5PXDN-TR ECS XC1295CT Digi-Key

CAPACITORS

C11,C12 CAP 33 pF 50V 5% CERM 0603 NPO ROHS 2 ECJ-1VC1H330J Panasonic PCC330ACVCT Digi-Key

C9, C10 CAP 47 pF 50V 5% CERM 0603 NPO ROHS 2 ECJ-1VC1H470J Panasonic PCC470ACVCT Digi-Key

C13 CAP 100 pF 50V 5% CERM 0603 NPO ROHS 1 ECJ-1VC1H101J Panasonic PCC101ACVCT Digi-Key

C14 CAP 1000 pF 50V 5% CERM 0603 COG ROHS 1 C1608C0G1H102J TDK Corp. 445-1293-1 Digi-Key

C6, C7 CAP 4700 pF 50V CERM 0603 X7R ROHS 2 ECJ-1VB1H472K Panasonic PCC1780CT Digi-Key

C15, C17, CAP SMT0603 CERM 0.1 µF 10V 5% X7R ROHS 4 C0603C104K8RACTU Kemet 399-1095-1 Digi-KeyC19, C20

C1–C3 CAP 1.0 µF 10V 10% CERM 0603 X5R ROHS 3 ECJ-1VB1A105K Panasonic PCC2174CT Digi-Key

C8, C16 CAP 10 µF 6.3V 10% CERM 1206 X5R ROHS 2 C3216X5R0J106K TDK 445-1388-1 Digi-Key

C18 CAP TANT2412 100 µF 10V 10% B45197A ROHS 1 B45197A2107K309 Kemet 495-1528-1 Digi-Key

RESISTORS

R15, R16 RES 0 Ω1/8W 5% SMD 0805 ROHS 2 ERJ-6GEY0R00V Panasonic P0.0ACT Digi-Key

R8, R9 RESISTOR SMD0603 27.4 Ω1/10W 1% ROHS 2 CRCW060327R4FKEA Vishay 541-27.4HCT Digi-Key

R7 RES SMD0603 1.50 k Ω1/10W 1% ROHS 1 ERJ-3EKF1501V Panasonic P1.50KHCT Digi-Key

R5, R6, R12 RES 2.00 k Ω1/16W 1% SMD 0603 ROHS 3 ERJ-3EKF2001V Panasonic P2.00KHCT Digi-Key

R10 RES 3.09k Ω1/10W 1% SMD 0603 ROHS 1 ERJ-3EKF3091V Panasonic P3.09KHCT Digi-Key

R1, R11, R13 RES 100 k Ω1/16W 1% SMD 0603 ROHS 3 ERJ-3EKF1003V Panasonic P100KHCT Digi-Key

FERRITE BEADS

FB3, FB4 Ferrite SMD0805 600 Ω0.24 A RDC=0.14 ROHS 2 MMZ2012R601A TDK 445-1554-1 Digi-Key

FB1, FB2 Ferrite bead SMD0805 80 Ωat 100 MHz 5A ROHS 2 HI0805R800R-10 Steward 240-2395-1 Digi-Key

HEADERS AND JACKS

J3, JP2, JP4, Header 2 Pin, PCB 2,0 mm ROHS 4 26630201RP2 Norcomp 2663S-02 Digi-KeyUSB PWR

J1 Header 4 Pin, PCB 2,0 mm ROHS 1 26630401RP2 Norcomp 2663S-04 Digi-Key

IN Jack, RCA 3-Pin PCB-RA Black ROHS 1 PJRAN1X1U01X Switchcraft 65K7770 NEWARK

J2 Jack USB MINIB SMT-RA 5Pin ROHS 1 UX60-MB-5ST Hirose H2959CT Digi-Key

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