Telit Wireless Solutions WE310F5-I Manual de instalación

WE310F5-I/P Module Hardware

User Guide

1VV0301662 Rev 2 –2020-09-01

WE310F5-I/P Module Hardware User Guide

1VV0301662 Rev 2 Page 2of 60 2020-09-01

SPECIFICATIONS ARE SUBJECT TO CHANGE WITHOUT NOTICE

NOTICE

While reasonable efforts have been made to assure the accuracy of this document, Telit

assumes no liability resulting from any inaccuracies or omissions in this document, or from

use of the information obtained herein. The information in this document has been

carefully checked and is believed to be reliable. However, no responsibility is assumed for

inaccuracies or omissions. Telit reserves the right to make changes to any products

described herein andreserves the right to revisethis document and to make changes from

time to time in content hereof with no obligation to notify any person of revisions or

changes. Telit does not assume any liability arising out of the application or use of any

product, software, or circuit described herein; neither does it convey license under its

patent rights or the rights of others.

It is possible that this publication may contain references to, or information about Telit

products (machines and programs), programming, or services that are not announced in

your country. Such references or information must not be construed to mean that Telit

intends to announce such Telit products, programming, or services in your country.

COPYRIGHTS

This instruction manual and the Telit products described in this instruction manual may

be, include or describe copyrighted Telit material, such as computer programs stored in

semiconductor memories or other media. Laws in the Italy and other countries preserve

for Telit and its licensors certain exclusive rights for copyrighted material, including the

exclusive right to copy, reproduce in any form, distribute and make derivative works of the

copyrighted material. Accordingly, any copyrighted material of Telit and its licensors

contained herein or in the Telit products described in this instruction manual may not be

copied, reproduced, distributed, merged or modified in any manner without the express

written permission of Telit. Furthermore, the purchase of Telit products shall not be

deemed to grant either directly or by implication, estoppel, or otherwise, any license under

the copyrights, patents or patent applications of Telit, as arises by operation of law in the

sale of a product.

COMPUTER SOFTWARE COPYRIGHTS

The Telit and 3rd Party supplied Software (SW) products described in this instruction

manual may include copyrighted Telit and other 3rd Party supplied computer programs

stored in semiconductor memories or other media. Laws in the Italy and other countries

preserve for Telit and other 3rd Party supplied SW certain exclusive rights for copyrighted

computer programs, including the exclusive right to copy or reproduce in any form the

copyrighted computer program. Accordingly, any copyrighted Telit or other 3rd Party

supplied SW computer programs contained in the Telit products described in this

instruction manual may not be copied (reverse engineered) or reproduced in any manner

without the express written permission of Telit or the 3rd Party SW supplier. Furthermore,

the purchase of Telit products shall not be deemedto grant either directly or by implication,

estoppel, or otherwise, any license under the copyrights, patents or patent applications of

Telit or other 3rd Party supplied SW, except for the normal non-exclusive, royalty free

license to use that arises by operation of law in the sale of a product.

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USAGE AND DISCLOSURE RESTRICTIONS

I. License Agreements

The software described in this document is the property of Telit and its licensors. It is

furnished by express license agreement only and may be used only in accordance with

the terms of such an agreement.

II. Copyrighted Materials

Software and documentation are copyrighted materials. Making unauthorized copies is

prohibited by law. No part of the software or documentation may be reproduced,

transmitted, transcribed, stored in a retrieval system, or translated into any language or

computer language, in any form or by any means, without prior written permission of Telit

III. High Risk Materials

Components, units, or third-party products used in the product described herein are NOT

fault-tolerant and are NOT designed, manufactured, or intended for use as on-line control

equipment in the following hazardous environments requiring fail-safe controls: the

operation of Nuclear Facilities, Aircraft Navigation or Aircraft Communication Systems, Air

Traffic Control, Life Support, or Weapons Systems (High Risk Activities"). Telit and its

supplier(s) specifically disclaim any expressed or implied warranty of fitness for such High

Risk Activities.

IV. Trademarks

TELIT and the Stylized T Logo are registered in Trademark Office. All other product or

service names are the property of their respective owners.

V. Third Party Rights

The software may include Third Party Right software. In this case you agree to comply

with all terms and conditions imposed on you in respect of such separate software. In

addition to Third Party Terms, the disclaimer of warranty and limitation of liability provisions

in this License shall apply to the Third Party Right software.

TELIT HEREBY DISCLAIMS ANY AND ALL WARRANTIES EXPRESS OR IMPLIED

FROM ANY THIRD PARTIES REGARDING ANY SEPARATE FILES, ANY THIRD

PARTY MATERIALS INCLUDED IN THE SOFTWARE, ANY THIRD PARTY MATERIALS

FROM WHICH THE SOFTWARE IS DERIVED (COLLECTIVELY “OTHER CODE”), AND

THE USE OF ANY OR ALL THE OTHER CODE IN CONNECTION WITH THE

SOFTWARE, INCLUDING (WITHOUT LIMITATION) ANY WARRANTIES OF

SATISFACTORY QUALITY OR FITNESS FOR A PARTICULAR PURPOSE.

NO THIRD PARTY LICENSORS OF OTHER CODE SHALL HAVE ANY LIABILITY FOR

ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR

CONSEQUENTIAL DAMAGES (INCLUDING WITHOUT LIMITATION LOST PROFITS),

HOWEVER CAUSED AND WHETHER MADE UNDER CONTRACT, TORT OR OTHER

LEGAL THEORY, ARISING IN ANY WAY OUT OF THE USE OR DISTRIBUTION OF

THE OTHER CODE OR THE EXERCISE OF ANY RIGHTS GRANTED UNDER EITHER

OR BOTH THIS LICENSE AND THE LEGAL TERMS APPLICABLE TO ANY SEPARATE

FILES, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGES.

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APPLICABILITY TABLE

PRODUCTS

WE310F5-I

WE310F5-P

WE310F5-I/P Module Hardware User Guide 
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Contents 
NOTICE…………….. ...................................................................................... 2 
COPYRIGHTS................................................................................................ 2 
COMPUTER SOFTWARE COPYRIGHTS...................................................... 2 
USAGE AND DISCLOSURE RESTRICTIONS............................................... 3 
CONTENTS.................................................................................................... 5 
FIGURE LIST ................................................................................................. 7 
TABLE LIST................................................................................................... 8 
1. INTRODUCTION.......................................................................... 9 
 Scope........................................................................................... 9 
 Audience....................................................................................... 9 
 Contact Information, Support........................................................ 9 
 Text Conventions........................................................................ 10 
 Related Documents.................................................................... 10 
2. PRODUCT DESCRIPTION......................................................... 11 
 Overview..................................................................................... 11 
 Block Diagram............................................................................ 13 
3. FEATURE DESCRIPTION ......................................................... 14 
 Main Features............................................................................. 14 
 Bootloader.................................................................................. 17 
 General Purpose I/O................................................................... 18 
 ADC-DAC Converter................................................................... 18 
4. POWER SUPPLY....................................................................... 20 
 Power Supply Requirements....................................................... 20 
 Logic Levels................................................................................ 20 
 Power Up/ Shutdown Sequences ............................................... 20 
 Power Consumption ................................................................... 22 
 Current Consumption Wi-Fi modes............................................ 22 
 Tx Output Power Wi-Fi and Bluetooth......................................... 23 
 Rx Sensitivity.............................................................................. 25 

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5. PINS ALLOCATION................................................................... 27 
 Pin-out........................................................................................ 27 
 Pads Layout................................................................................ 33 
6. DESIGN GUIDELINES............................................................... 35 
 General Digital Interface Recommendations............................... 35 
 Power circuitry............................................................................ 36 
 Bypass Capacitors...................................................................... 36 
 Antenna Guidelines .................................................................... 37 
 Audio considerations .................................................................. 40 
 Other General Design Considerations ........................................ 40 
7. MECHANICAL DESIGN............................................................. 43 
 WE310F5-I ................................................................................. 43 
 WE310F5-P................................................................................ 45 
 PCB Pad Design......................................................................... 46 
 PCB Pad Dimensions ................................................................. 46 
 Stencil......................................................................................... 47 
 Solder Paste............................................................................... 47 
 Solder Reflow............................................................................. 48 
8. PACKAGING.............................................................................. 50 
 Tray............................................................................................ 50 
 Moisture Sensitivity..................................................................... 51 
9. CONFORMITY ASSESSMENT ISSUES .................................... 52 
 FCC/IC Regulatory Notices......................................................... 52 
10.FCC/IC COMPLIANCE............................................................... 53 
11. SAFETY RECOMMENDATIONS................................................ 56 
 Read Carefully............................................................................ 56 
12. ACRONYMS............................................................................... 57 
13. DOCUMENT HISTORY.............................................................. 59 
 
 

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FIGURE LIST 
Figure 1: WE310F5-I 15mm*18mm...............................................................................11 
Figure 2: WE310F5-P 13.1mm*14.3mm .......................................................................11 
Figure 3: WE310F5-I/P Block Diagram .........................................................................13 
Figure 4: Power UP Sequence......................................................................................21 
Figure 5: Shutdown Sequence......................................................................................22 
Figure 6: Pads Layout Top View –WE310F5-I .............................................................33 
Figure 7: Pads Layout Top View –WE310F5-P............................................................34 
Figure 8: Pinout Legend Color-WE310F5-I/P................................................................34 
Figure 9: EMI Filter Example.........................................................................................36 
Figure 10: EMI Suppression on Modem’s Power Supply...............................................36 
Figure 11: Placement Example-Please place the module aligning the PCB outline of the 
module with that one of the EVK...................................................................................37 
Figure 12: Placement Example and Cutout copper area for WE310F5-I-Please place and 
remove the copper in any layer of the board.................................................................38 
Figure 13: Possible Placement for WE310F5-P............................................................38 
Figure 14: RF Track Example .......................................................................................39 
Figure 15: Coplanar Waveguide Dimensioning Example...............................................39 
Figure 16: Minimal RF Matching Network Circuitry........................................................40 
Figure 17: Layout Example for FAST Digital Lines........................................................41 
Figure 18: WE310F5-I Mechanical Design....................................................................43 
Figure 19: WE310F5-I Side View..................................................................................43 
Figure 20: WE310F5-I Recommended Land Pattern.....................................................44 
Figure 21: WE310F5-P Mechanical Design...................................................................45 
Figure 22: WE310F5-P Side View.................................................................................45 
Figure 23: WE310F5-P Recommended Land Pattern ...................................................46 
Figure 24: SMD and NSMD Pad...................................................................................46 
Figure 25: Inhibit Area for Not Solder Covered Vias......................................................47 
Figure 26: Solder Reflow Profile....................................................................................48 
Figure 27: WE310F5-I/P Packaging example (to replace with the final one and add the 
WE310F5-P figure )......................................................................................................50 
 

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TABLE LIST 
Table 1: Feature Description Table...............................................................................16 
Table 2: Peripherals Interfaces .....................................................................................17 
Table 3: GPIO Alternate Pinmux Table.........................................................................18 
Table 4: Power Supply requirements ............................................................................20 
Table 5: Input/output Levels..........................................................................................20 
Table 6: Timing Specification-Power Sequence............................................................21 
Table 7: General Power Consumption ..........................................................................22 
Table 8: Tx Power Consumption @2.4GHz...................................................................23 
Table 9: IEEE 802.11 EVM @2.4GHz...........................................................................25 
Table 10: BLE Transmit Power .....................................................................................25 
Table 11: Rx RF Output Pad Sensitivity @2.4GHz .......................................................26 
Table 12: BLE Sensitivity at RF Output Pad..................................................................26 
Table 13: Pinout Table..................................................................................................33 
Table 14: PCB Finishing Recommendation...................................................................47 
Table 15: Recommended Solder Paste Type...............................................................47 
Table 16: Solder Reflow Table......................................................................................49 
 

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1. INTRODUCTION

Scope

The aim of this document is to describe some of the hardware solutions

useful for developing a product with the Telit WE310F5-I/P Wi-Fi/BLE

module.

Audience

This document is intended for Telit customers, who are integrators, about to

implement their applications using our WE310F5-I/P modules.

Contact Information, Support

For general contact, technical support services, technical questions

and report documentation errors contact Telit Technical Support at:

•TS[email protected]

•TS-AMERICAS@telit.com

•TS-APAC@telit.com

•TS-SRD@telit.com

Alternatively, use:

http://www.telit.com/support

For detailed information about where you can buy the Telit modules or for

recommendations on accessories and components visit:

http://www.telit.com

Our aim is to make this guide as helpful as possible. Keep us informed of your

comments and suggestions for improvements.

Telit appreciates feedback from the users of our information.

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Text Conventions

Danger –This information MUST be followed, or catastrophic

equipment failure or bodily injury may occur.

Caution or Warning –Alerts the user to important points about

integrating the module, if these points are not followed, the module

and end user equipment may fail or malfunction.

Tip or Information –Provides advice and suggestions that may be

useful when integrating the module.

All dates are in ISO 8601 format, i.e. 2019-01-08.

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