Intersil ISL70002SEHEVAL1Z Manual de usuario

USER’S MANUAL

AN1732

Rev.1.00

December 6, 2016

ISL70002SEHEVAL1Z

Evaluation Board

AN1732 Rev.1.00 Page 1 of 13

December 6, 2016

Circuit Comments

The ISL70002SEHEVAL1Z evaluation board is designed to

demonstrate the features of the ISL70002SEH, a TID and SEE

hardened 12A synchronous buck regulator IC with integrated

MOSFETs intended for space applications. For more detailed

information about the ISL70002SEH, refer to the

ISL70002SEH datasheet.

The ISL70002SEHEVAL1Z evaluation board accepts a nominal

3V to 5.5V input voltage and provides a regulated output

voltage ranging from 0.8V to 85% of the input voltage at

output currents ranging from 0A to 12A. The output can be

quickly set to a preset voltage of 1.0V, or adjusted to an

alternate voltage using the onboard potentiometer. A

Power-Good (PGOOD) signal goes high and lights a red LED to

indicate that the output voltage is within a ±11% typical

regulation window. A toggle switch is provided to conveniently

enable or disable the output voltage.

The ISL70002SEHEVAL1Z evaluation board can be set to run

from the nominal 500kHz or 1MHz internal oscillator of the

ISL70002SEH or synchronized to a 500kHz to 1MHz ±20%

external clock. Two ISL70002SEH ICs can be synchronized to

each other in a master/slave configuration, providing nearly

twice the output current while switching 180° out-of-phase

with respect to each other. See AN1953, “Dual Phase Current

Share Evaluation Board User Guide”.

Related Literature

• For a full list of related documents, visit our website

-ISL70002SEH product page

Schematic and BOM

A photograph, schematic, and BOM of the

ISL70002SEHEVAL1Z evaluation board are shown in Figure 1,

Figure 20 on page 6, and Table 1 on page 7, respectively. The

schematic indicates the test points, which allow many nodes

of the evaluation circuit to be monitored directly. The BOM

shows components that are representative of the types

needed for a design, but these components are not

space-qualified. Equivalent space-qualified components would

be required for flight applications. A 1µH inductor is

recommended for 500kHz and a 500µH inductor is

recommended for 1MHz.

Recommended Test Equipment

• A 0V to 6V power supply with at least 20A current capability

• An electronic load capable of sinking current up to 12A

• Two Digital Multimeters (DMMs)

• A 500MHz dual-trace oscilloscope

Ordering Information

PART NUMBER DESCRIPTION

ISL70002SEHEVAL1Z ISL70002SEHEVAL1Z Evaluation Board

FIGURE 1. ISL70002SEHEVAL1Z TOP VIEW

AN1732 Rev.1.00 Page 2 of 13

December 6, 2016

ISL70002SEHEVAL1Z

Quick Start

1. Toggle S1 to the down (OFF) position.

2. Turn on the power supply. Set the output voltage to 3.3V and

set the output current limit to 20A. Turn off the power supply.

3. Connect the positive lead of the power supply to J1 and the

negative lead of the power supply to J2.

4. Turn on the electronic load and set the output current to 6A.

5. Connect the positive lead of the electronic load to J39 and

connect the negative lead of the electronic load to J40.

6. Configure one DMM to monitor the input voltage from TP7 to

TP11.

7. Configure another DMM to monitor the output voltage from

TP13 to TP11.

8. Connect Channel 1 of the oscilloscope to J6 (or from TP33 to

TP28) to monitor the rectangular waveform on the LXx pins.

9. Connect Channel 2 of the oscilloscope to J14 (or from TP36 to

TP37) to monitor the output voltage. Ripple voltage is

customarily measured with 20MHz bandwidth limiting.

10. Toggle S1 to the up (ON) position.

11. Verify the output voltage is 1.0V ±3% and the frequency of the

LXx waveform is 1MHz ±10%.

Layout Guidelines

1. Use an eight-layer PCB with 2 ounce (70µm) copper or

equivalent in thinner layers.

2. Two layers should be dedicated for ground plane.

3. Top and bottom layers should be used primarily for signals,

but can also be used to increase the VIN, VOUT, and ground

planes as required.

4. Connect all AGND, DGND, and PGNDx pins directly to the

ground plane. Connect all PVINx pins directly to the VIN

portion of the power plane.

5. Locate ceramic bypass capacitors as close as possible to U1.

Prioritize the placement of the bypass capacitors on the pins

of U1 in the order shown: PVINx, REF, AVDD, DVDD, SS, EN,

PGOOD.

6. Locate the output voltage resistive divider as close as

possible to the FB pin of the IC. The top leg of the divider

should connect directly to the load and the bottom leg of the

resistive divider should connect directly to AGND. The junction

of the resistive divider should connect directly to the FB pin.

7. Use a small island of copper to connect the LXx pins of U1 to

the inductor(s), L1 and L2, to minimize the routing

capacitance that degrades efficiency. Separate the island

from ground and power planes as much as possible.

8. Keep all signal traces as short as possible.

9. A small series snubber (R25 and C20) connected from the LXx

pins to the PGNDx pins may be used to dampen ringing on the

LXx pins if desired.

10. For optimum thermal performance, place a pattern of vias on

the top layer of the PCB directly underneath U1. Connect the

vias to the ground planes, which serve as a heatsink. Thermal

interface material such as a Sil-Pad should be used to fill the

gap between the vias and the bottom of U1 to ensure good

thermal contact. Using a Sil-Pad has the added benefit of

raising the bottom of U1 from the PCB surface so that a slight

bend can be added to the leads for strain relief.

AN1732 Rev.1.00 Page 3 of 13

December 6, 2016

ISL70002SEHEVAL1Z

ISL70002SEHEVAL1Z Efficiency Curves The efficiency data presented in Figures 2 through 17 was taken

with the ISL70002SEHEVAL1Z immersed in a temperature-calibrated liquid bath to ensure the notated IC case temperature.

FIGURE 2. EFFICIENCY vs LOAD vs OUTPUT VOLTAGE

VIN = 3.3V, fSW = 500kHz, -55°C CASE TEMPERATURE

FIGURE 3. EFFICIENCY vs LOAD vs OUTPUT VOLTAGE

VIN = 3.3V, fSW = 1MHz, -55°C CASE TEMPERATURE

FIGURE 4. EFFICIENCY vs LOAD vs OUTPUT VOLTAGE

VIN = 5V, fSW= 500kHz, -55°C CASE TEMPERATURE

FIGURE 5. EFFICIENCY vs LOAD vs OUTPUT VOLTAGE

VIN = 5V, fSW = 1MHz, -55°C CASE TEMPERATURE

FIGURE 6. EFFICIENCY vs LOAD vs OUTPUT VOLTAGE

VIN = 3.3V, fSW = 500kHz, +25°C CASE TEMPERATURE

FIGURE 7. EFFICIENCY vs LOAD vs OUTPUT VOLTAGE

VIN = 3.3V, fSW = 1MHz, +25°C CASE TEMPERATURE

100

0123456789101112

EFFICIENCY (%)

LOAD CURRENT (A)

1.0VOUT

2.5VOUT

1.8VOUT

1.5VOUT 1.2VOUT

100

0123456789101112

EFFICIENCY (%)

LOAD CURRENT (A)

1.0VOUT

1.5VOUT

1.2VOUT

2.5VOUT

1.8VOUT

100

0123456789101112

EFFICIENCY (%)

LOAD CURRENT (A)

2.5VOUT

1.8VOUT

1.5VOUT 1.2VOUT

3.3VOUT

1.0VOUT

100

0123456789101112

EFFICIENCY (%)

LOAD CURRENT (A)

2.5VOUT

1.8VOUT

1.5VOUT 1.2VOUT 1.0VOUT

3.3VOUT

100

0123456789101112

EFFICIENCY (%)

LOAD CURRENT (A)

1.5VOUT

1.2VOUT

1.8VOUT

1.0VOUT

2.5VOUT

100

0123456789101112

EFFICIENCY (%)

LOAD CURRENT (A)

1.5VOUT

1.2VOUT 1.8VOUT

1.0VOUT

2.5VOUT

AN1732 Rev.1.00 Page 4 of 13

December 6, 2016

ISL70002SEHEVAL1Z

FIGURE 8. EFFICIENCY vs LOAD vs OUTPUT VOLTAGE

VIN = 5V, fSW = 500kHz, +25°C CASE TEMPERATURE

FIGURE 9. EFFICIENCY vs LOAD vs OUTPUT VOLTAGE

VIN = 5V, fSW = 1MHz, +25°C CASE TEMPERATURE

FIGURE 10. EFFICIENCY vs LOAD vs OUTPUT VOLTAGE

VIN = 3.3V, fSW = 500kHz, +85°C CASE TEMPERATURE

FIGURE 11. EFFICIENCY vs LOAD vs OUTPUT VOLTAGE

VIN = 3.3V, fSW = 1MHz, +85°C CASE TEMPERATURE

FIGURE 12. EFFICIENCY vs LOAD vs OUTPUT VOLTAGE

VIN = 5V, fSW = 500kHz, +85°C CASE TEMPERATURE

FIGURE 13. EFFICIENCY vs LOAD vs OUTPUT VOLTAGE

VIN = 5V, fSW = 1MHz, +85°C CASE TEMPERATURE

ISL70002SEHEVAL1Z Efficiency Curves The efficiency data presented in Figures 2 through 17 was taken

with the ISL70002SEHEVAL1Z immersed in a temperature-calibrated liquid bath to ensure the notated IC case temperature. (Continued)

100

0123456789101112

EFFICIENCY (%)

LOAD CURRENT (A)

1.8VOUT

3.3VOUT

2.5VOUT

1.5VOUT 1.2VOUT

1.0VOUT

100

0123456789101112

EFFICIENCY (%)

LOAD CURRENT (A)

1.8VOUT

1.5VOUT

1.0VOUT

1.2VOUT

2.5VOUT

3.3VOUT

100

0123456789101112

EFFICIENCY (%)

LOAD CURRENT (A)

1.8VOUT 1.5VOUT

1.0VOUT

1.2VOUT

2.5VOUT

100

0123456789101112

EFFICIENCY (%)

LOAD CURRENT (A)

1.2VOUT

1.8VOUT 1.5VOUT

1.0VOUT

2.5VOUT

100

0123456789101112

EFFICIENCY (%)

LOAD CURRENT (A)

2.5VOUT

3.3VOUT

1.8VOUT 1.5VOUT

1.2VOUT

1.0VOUT

100

0123456789101112

EFFICIENCY (%)

LOAD CURRENT (A)

2.5VOUT

1.8VOUT

1.5VOUT 1.2VOUT

1.0VOUT

3.3VOUT

AN1732 Rev.1.00 Page 5 of 13

December 6, 2016

ISL70002SEHEVAL1Z

FIGURE 14. EFFICIENCY vs LOAD vs OUTPUT VOLTAGE, VIN = 3.3V,

fSW = 500kHz, +125°C CASE TEMPERATURE

FIGURE 15. EFFICIENCY vs LOAD vs OUTPUT VOLTAGE

VIN = 3.3V, fSW = 1MHz, +125°C CASE TEMPERATURE

FIGURE 16. EFFICIENCY vs LOAD vs OUTPUT VOLTAGE

VIN = 5V, fSW= 500kHz, +125°C CASE TEMPERATURE

FIGURE 17. EFFICIENCY vs LOAD vs OUTPUT VOLTAGE

VIN = 5V, fSW = 1MHz, +125°C CASE TEMPERATURE

FIGURE 18. GAIN/PHASE PLOT, VIN = 5V, fSW = 500kHz, +25°C

AMBIENT TEMPERATURE

FIGURE 19. GAIN/PHASE PLOT, VIN = 5V, fSW = 1MHz, +25°C

AMBIENT TEMPERATURE

ISL70002SEHEVAL1Z Efficiency Curves The efficiency data presented in Figures 2 through 17 was taken

with the ISL70002SEHEVAL1Z immersed in a temperature-calibrated liquid bath to ensure the notated IC case temperature. (Continued)

100

0123456789101112

EFFICIENCY (%)

LOAD CURRENT (A)

1.8VOUT

1.5VOUT

1.2VOUT 1.0VOUT

2.5VOUT

100

0123456789101112

EFFICIENCY (%)

LOAD CURRENT (A)

2.5VOUT

1.8VOUT

1.5VOUT

1.2VOUT 1.0VOUT

100

0123456789101112

EFFICIENCY (%)

LOAD CURRENT (A)

2.5VOUT

1.8VOUT

1.5VOUT

1.0VOUT

3.3VOUT

1.2VOUT

100

0123456789101112

EFFICIENCY (%)

LOAD CURRENT (A)

2.5VOUT

1.8VOUT

1.5VOUT 1.2VOUT

3.3VOUT

1.0VOUT

-150

-100

-50

100

150

-60

-40

-20

100 1000 10000 100000 1000000

FREQUENCY (Hz)

GAIN (dB)

PHASE (DEGREE)

GAIN (dB)

PHASE (o)

-150

-100

-50

100

150

-40

-30

-20

-10

100 1000 10000 100000 1000000

FREQUENCY (Hz)

GAIN (dB)

PHASE (DEGREE)

GAIN (dB)

PHASE (o)

AN1732 Rev.1.00 Page 6 of 13

December 6, 2016

ISL70002SEHEVAL1Z

FIGURE 20. ISL70002SEHEVAL1Z BOARD SCHEMATIC

ISL70002SEH

AN1732 Rev.1.00 Page 7 of 13

December 6, 2016

ISL70002SEHEVAL1Z

TABLE 1. ISL70002SEHEVAL1Z BILL OF MATERIALS

PART NUMBER REF DES QTY VALUE TOL VOLTAGE POWER PACKAGE TYPE JEDEC TYPE MANUFACTURER DESCRIPTION

C0805C103K2RAC C12, C14 2 0.01µF 10% 200V 805 CAP_0805 KEMET Ceramic Chip Cap

H1082-OPEN C16 1 OPEN 10% OPEN 1210 CAP_1210 GENERIC Ceramic Chip Cap

C1812C472F2GAC C17 1 4700pF 1% 200V 1812 CAP_1812 KEMET Multilayer Cap

H1045-00471-25V20 C1-C3 3 470pF 20% 25V 603 CAP_0603 GENERIC Multilayer Cap

C0805C102K2RAC C20 1 1000pF 10% 200V 805 CAP_0805 KEMET Ceramic Chip Cap

H1045-OPEN C28, C29, C32,

C33, C35

5 OPEN 5% OPEN 603 CAP_0603 GENERIC Multilayer Cap

C1825C224K2RAC C31 1 0.22µF 10% 200V 1825 CAP_1825 KEMET Ceramic Chip Cap

C1210C104K2RAC C36 1 0.1µF 10% 200V 1210 CAP_1210 KEMET Ceramic Chip Cap

T530D157M010AHE006 C4, C5, C11, C1,

C19, C21-C26

11 150µF 20% 10V SMD CAP_7343_31 KEMET High Capacitance Ultra-Low ESR

Tantalum SMD Cap

C2225C105K2RAC C6, C7, C10, C13,

C18, C27, C30, C34

8 1µF 10% 200V 2225 CAP_2225 KEMET Multilayer Cap

C0805C682K2RAC C8, C9 2 6800pF 10% 200V 805 CAP_0805 KEMET Multilayer Cap

LTST-C170CKT D1 1 SMD LTST_C170CKT LITEON AlGaAs on GaAs Red LED

1N5822US D2 0 SMD2 DIO_CASE_D-5B MICROSEMI 3A 40V SCHOTTKY

BARRIER RECTIFIER

575-4 J1, J2, J39, J40 4 CONN CON_BAN_575 KEYSTONE SOLDER MOUNT

BANANA PLUG

JUMPER-3-100 J13, J18, J23,

J26-J29

7 THOLE JUMPER-3 GENERIC Three Pin Jumper

JUMPER2_100 J30-J32 3 THOLE JUMPER-1 GENERIC Two Pin Jumper

131-4353-00 J33, J36 2 CONN TEK131-4353-00 TEKTRONIX Scope Probe Test

Point PCB Mount

IHLP-2525CZ-ER-1R0-M-01 L1, L2 2 1µH 20% 11A SMD IND_IHLP-2525CZ-01 VISHAY LOW PROFILE HIGH CURRENT

INDUCTOR (RoHS COMPLIANT)

2N7002-7-F Q1 1 SOT23 SOT23 FAIRCHILD N-Channel EMF Effect

Transistor (Pb-Free)

H2505-DNP-DNP-1 R12, R18 2 DNP 1% DNP 603 RES_0603 GENERIC Metal Film Chip Resistor

(Do Not Populate)

S0603CPZ1R00F10 R13, R14 2 1 1% 1/10W 603 RES_0603 State of the Art 100ppm Thick Film Chip Resistor

S0603CA1002BEZ R15 1 10k 0.10% 1/10W 603 RES_0603 State of the Art 25ppm Thin Film Chip Resistor

MCR03EZPFX1001 R16 1 1k 1% 1/10W 603 RES_0603 ROHM Metal Film Chip Resistor

S0603CPZ1001F10 R17 1 1k 1% 1/10W 603 RES_0603 State of the Art 100ppm Thick Film Chip Resistor

AN1732 Rev.1.00 Page 8 of 13

December 6, 2016

ISL70002SEHEVAL1Z

H2511-00R00-1/16W1 R19 1 0 1% 1/16W 603 RES_0603 GENERIC Thick Film Chip Resistor

ERJ3GEY0R00V R1-R7 7 0 0% 1/10W 603 RES_0603 PANASONIC Thick Film Chip Resistor

S0603CA1501BEZ R20 1 1.5k 0.10% 1/10W 603 RES_0603 State of the Art 25ppm Thin Film Chip Resistor

S0603CA1001BEZ R21 1 1k 0.10% 1/10W 603 RES_0603 State of the Art 25ppm Thin Film Chip Resistor

S0603CPZ1000F10 R22 1 100 1% 1/10W 603 RES_0603 State of the Art 100ppm Thick Film

Chip Resistor

3299W-1-502-LF R23 1 5k 10% 1/2W RADIAL RES_POT_3299W BOURNS TRIMMER POTENTIOMETER

(RoHS COMPLIANT)

H2511-01001-1/16W1 R24 1 1k 1% 1/16W 603 RES_0603 GENERIC Thick Film Chip Resistor

H2513-001R8-1/8W1 R25 1 1.8 1% 1/8W 1206 RES_1206 GENERIC Thick Film Chip Resistor

S0603CA1962BEZ R8, R10 2 19.6k 0.10% 1/10W 603 RES_0603 State of the Art 25ppm Thin Film Chip Resistor

S0603CA4021BEZ R9, R11 2 4.02k 0.10% 1/10W 603 RES_0603 State of the Art 25ppm Thin Film Chip Resistor

GT11MSCBE-T S1 1 SMT GT13MSCKE C&K SPDT On-None-On SMT

Ultraminiature Toggle Switch

(RoHS compliant)

1514-2 TP1, TP2, TP6, TP10,

TP12

5 THOLE TP-150C100P KEYSTONE Test Point Turret 0.150

Pad 0.100 Thole

5002 TP3-TP5, TP7-TP9,

TP11, TP13

8 THOLE MTP500X KEYSTONE Miniature White Test

Point 0.100 Pad 0.040 Thole

ISL70002SEHVF U1 1 CQFP CQFP64_555X555_635 INTERSIL 12A SYNCHRONOUS

BUCK REGULATOR W/MOSFET

SP2000-0.020-AC-1212 1 Bergquist Thermal Interface Material,

Sil-Pad, 12inx12inx0.020in, with

adhesive, cut to 0.4inx0.4in and

placed on underside of U1

TABLE 1. ISL70002SEHEVAL1Z BILL OF MATERIALS (Continued)

PART NUMBER REF DES QTY VALUE TOL VOLTAGE POWER PACKAGE TYPE JEDEC TYPE MANUFACTURER DESCRIPTION

AN1732 Rev.1.00 Page 9 of 13

December 6, 2016

ISL70002SEHEVAL1Z

Board Layout

FIGURE 21. TOP SIDE ASSEMBLY DRAWING

FIGURE 22. TOP LAYER

AN1732 Rev.1.00 Page 10 of 13

December 6, 2016

ISL70002SEHEVAL1Z

FIGURE 23. LAYER 2

FIGURE 24. LAYER 3

Board Layout (Continued)

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