Intel Pentium 4 Guía

Intel®Pentium®4 Processor

in the 423-pin Package

Thermal-Mechanical Support

Design Guide

Version 1.0

Reorder Number 249348-001

January 2001

Intel® Pentium® 4 Processor in the 423-pin Package Thermal-Mechanical Support Design Guide

Version 1.0

DISCLAIMERS

1. INTEL CORPORATION (AND ANY CONTRIBUTOR) IS PROVIDING THIS INFORMATION AS A CONVENIENCE AND

ACCORDINGLY MAKES NO WARRANTIES WITH REGARD TO THIS DOCUMENT. IN PARTICULAR, INTEL (AND ANY

CONTRIBUTOR) DOES NOT WARRANT OR REPRESENT THAT THIS DOCUMENT OR ANY PRODUCTS MADE IN

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CUSTOMERS ARE SOLELY RESPONSIBLE FOR ASSESSING THE SUITABILITY OF THE INFORMATION FOR USE IN

PARTICULAR APPLICATIONS. THE INFORMATION IS NOT INTENDED FOR USE IN CRITICAL CONTROL OR SAFETY

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5. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS

IS GRANTED HEREIN.

Version 1.0, December 2000

† Third-party brands and names are the property of their respective owners.

Revision History

Version Revision History Date

1.0 Initial release December 2000

Intel® Pentium® 4 Processor in the 423-pin Package Thermal-Mechanical Support Design Guide

Version 1.0

Contents

1. Overview...........................................................................................................................4

1.1 Related Documents ......................................................................................................4

2. Thermal-Mechanical Support Solution.....................................................................5

2.1 Motherboard Design .....................................................................................................7

2.2 Chassis Design ............................................................................................................8

2.3 Hardware.....................................................................................................................9

3. Conclusion.......................................................................................................................9

Figures

Figure 1. Direct Chassis-Attach Example......................................................................................5

Figure 2. ATX Motherboard Hole Locations for Direct Chassis-Attach ............................................7

Figure 3. ATX Chassis Mounting Holes for Pentium® 4 Processors ...............................................8

Tables

Table 1. Related Documents .......................................................................................................4

Table 2. Design Summary ...........................................................................................................6

Intel® Pentium® 4 Processor in the 423-pin Package Thermal-Mechanical Support Design Guide

Version 1.0

1. Overview

This design guide outlines a successful thermal-mechanical support solution for the Intel®

Pentium® 4 processor in the 423-pin package. The recommended solution is one proposed

method to support large-mass heatsinks during shipping and handling of the product. Board

and system designers should follow the recommendations in this design guide to allow

interchangeable ATX motherboards and chassis that support first-generation Pentium 4

processors. It is the responsibility of the supplier, OEM, and system integrator to test and

validate the final system solution.

1.1 Related Documents

Table 1. Related Documents

Document Location

ATX Specification, Version 2.03 http://www.teleport.com/~ffsupprt/

Intel® Pentium® 4 Processor in the 423-pin Package Thermal-Mechanical Support Design Guide

Version 1.0

2. Thermal-Mechanical Support Solution

Intel’s reference thermal-mechanical support solution for the Intel® Pentium® 4 processor

consists of:

?? Heatsink

?? Heatsink clips

?? Thermal interface material

?? Retention mechanism(s)

?? Chassis standoffs

Large-mass heatsinks on ATX form factor motherboards may cause excessive board

deflection during shipping and handling and may cause damage to board-level components.

Direct-attach of the retention mechanism to the chassis wall, as shown in Figure 1, is

recommended for all Intel® Pentium® 4 processor system solutions.

Figure 1. Direct Chassis-Attach Example

Retention Mechanism

(two-piece enabled-

solution shown as

example)

Intel® Pentium® 4 Processor in the 423-pin Package Thermal-Mechanical Support Design Guide

Version 1.0

Direct chassis-attach is one method that has been tested for managing large-mass heat sinks

during mechanical shock and vibration conditions. There may be some chassis,

motherboard, and heatsink combinations in which direct chassis-attach may not eliminate

the damage induced by large motherboard deflections. It is the responsibility of the

supplier, OEM, and system integrator to perform mechanical shock and vibration

validation on all shipped configurations.

Table 2summarizes the design impacts for the direct chassis-attach solution; the impacts

are detailed in the following sections.

Table 2. Design Summary

Component Design Solution

Motherboard Locate retention mechanism at recommended location

Chassis Add four (4) removable standoffs at recommended locations

Intel® Pentium® 4 Processor in the 423-pin Package Thermal-Mechanical Support Design Guide

Version 1.0

2.1 Motherboard Design

The retention mechanism should be located in relation to the ATX mounting holes as

shown in Figure 2to allow for direct attachment to the chassis. The two-piece enabled

retention mechanism cannot be pre-attached to the motherboard. Therefore, motherboards

intended for use by system integrators should supply two (2) retention mechanisms and two

(2) heatsink clips with each board. Intel boxed processors will not include these

components. ATX chassis will provide four (4) removable standoffs and four (4) screws

that will attach the retention mechanisms and motherboard to the chassis.

Figure 2. ATX Motherboard Hole Locations for Direct Chassis-Attach

Intel® Pentium® 4 Processor in the 423-pin Package Thermal-Mechanical Support Design Guide

Version 1.0

2.2 Chassis Design

The retention mechanism is attached to the chassis via four (4) standoffs, as shown in

Figure 3. These standoffs are in addition to the standard ATX mounting holes defined in

the ATX Specification, Version 2.03. The standoffs must be removable to maintain

backward-compatibility with boards that do not support Pentium® 4 processors. The four

(4) standoffs for the retention mechanism must be the same height as the standard ATX

board standoffs and compatible with 6-32 (x 1/2 inch-3/8 inch) pan-head or round-head

screws. It is the responsibility of the chassis vendor to supply the four (4) 6-32 screws with

the chassis.

Figure 3. ATX Chassis Mounting Holes for Pentium® 4 Processors

The direct chassis-attach solution has been tested at 30 g (11 ms trapezoidal pulse)

unpackaged system shock and 50 g (11 ms trapezoidal pulse) unpackaged board shock to

allow for differences in system structural designs. It is the responsibility of the chassis and

system designer to ensure that the chassis structure does not transfer greater than 50 g

shock to the board at a 30 g system input.

Intel® Pentium® 4 Processor in the 423-pin Package Thermal-Mechanical Support Design Guide

Version 1.0

2.3 Hardware

The screws should be 6-32 (x 1/2 inch-3/8 inch) pan-head or round-head screws (four each)

for the direct chassis-attach solution. The screw head must be less than 0.284 inch

diameter and less than 0.190 inch in height. It is the responsibility of the chassis vendor to

supply the four (4) 6-32 screws with the chassis.

3. Conclusion

ATX systems that support Pentium® 4 processors will require additional structural support

for large-mass heatsink solutions. The direct chassis-attach solution outlined in this design

guide identifies a single tested solution that will allow interchangeable ATX motherboards

and ATX chassis combinations. It is the responsibility of the supplier, OEM, and system

integrator to validate the final system design to ensure there is no damage to the system

components during shipping and handling.

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