HP Invent Q1575 Series Instrucciones de montaje

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Product End-of-Life Disassembly Instructions

Product Category: Data Storage Devices

Marketing Name / Model

[List multiple models if applicable.]

DAT160m (array module) / Q1575X. Where X = any alphanumeric combination

Purpose: The documentis intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions

for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU

directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).

1.0 Items Requiring Selective Treatment

1.1 Items listed below are classified as requiring selective treatment.

1.2 Enter the quantity of items contained within the product whichrequire selective treatment in the right column, as

applicable.

Item Description Notes

Quantity

of items

included

in product

Printed Circuit Boards (PCB) or Printed Circuit

Assemblies (PCA) With a surface greater than 10 sq cm 5

Batteries All types including standard alkaline and lithium coin

or button style batteries 0

Mercury-containing components For example, mercury in lamps, display backlights,

scanner lamps, switches, batteries 0

Liquid Crystal Displays (LCD) with a surface greater

than 100 sq cm Includes background illuminated displays with gas

discharge lamps 0

Cathode Ray Tubes (CRT) 0

Capacitors / condensers (Containing PCB/PCT) 0

Electrolytic Capacitors / Condensers measuring

greater than 2.5 cm in diameter or height 0

External electrical cables and cords 0

Gas Discharge Lamps 0

Plastics containing Brominated Flame Retardants 0

Components and parts containing toner and ink,

including liquids, semi-liquids (gel/paste) and toner Include the cartridges, print heads, tubes, vent

chambers, and service stations. 0

Components and waste containing asbestos 0

Components, parts and materials containing

refractory ceramic fibers 0

Components, parts and materials containing

radioactive substances 0

2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where components

and materials requiring selective treatment can be removed.

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Tool Description Tool Size (if

applicable)

Crosshead screwdriver

Torx screwdriver T-10

Nippers N/A

3.0 Product Disassembly Process

3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:

3.1.1. Remove the array cradle fromthe mechanism. Secured with 4 x T-10 screws –2 x on either side. Remove the 1 x

SCSI I/O PCA > 10 square cm’s fromthe cradle using a T-10.

Remove metal wing brackets (5.25” product only, 4 x T-10 screws) and the front panel.

3.1.2. Remove side panels and the lid by unscrewing 14 x crosshead (CH) screws from eachside. See image 1.

Remove the lid by removing 1 x CHscrew at the rear of the mechanism (See image 2) and 2 x CH screws at the front top

of the mechanism. See image 3.

3.1.3. Remove the base and the cartridge assembly (see image 4) and remove 1 x CH screw from the BOM-ASSY. (see

image 5)

3.1.4. Unlock and release FFCs and FPCs from the PCA (see image 6).

3.1.5. Unscrew 5 x CH screws from the base of the PCA and remove main PCA (> 10 sq cm). See images 7&8.

3.1.6. Remove REC-SW-PCA (> 10 square cm’s). See image 9.

3.1.7. Remove ARM-HOUSING, HC-W-ASSY, ARM-P8-SUB-ASSY, the GUIDE-V-PR, and PR-ASSY from drive to access

the MODE-DRIVE-ASSY. (see images10 and 11)

1.1.8. Unlock FFC connector and release FFC-9pin. Unscrew 6 x CH screwsand remove MODE-DRIVE-ASSY. See

image 12.

1.1.9. Cut out the 4 x wires from the mode-drive-assembly and unscrew the 4 x CH screws to release the PWB-MODE-A.

PWB-MODE-A is > 10 square cm’s.See image 13.

1.1.11 Remove 5 x CH screws to release the P-SUB-CHASSIS, 7 x CH screws to remove the REEL-MOTORand PWB-

MODE-B-ASSY and 3 x CH screws to release the DRUM-ASSY. PWD-MODE-B-ASSY is > 10 square cm’s. See image

14.

3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items

contained inthe product that require selective treatment (with descriptions and arrows identifying locations).

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1) 2) 3)

Remove 14 screws per side. Remove M1.7 screw a rear side. Remove 2 xM1.7 screws at front top.

4) 5) 6)

Remove base and cartridge housing Remove 1 x CH screw from BOM

ASSY Unlock and release FFCs and FPCs

fromthe PCA.

7) 8) 9)

Remove 5 x CH screws to remove

the PCA Remove main PCA (> 10 square

cm’s). Unscrew 3 x CH screws to remove

the REC-SW-PCA-assembly (> 10

square cm’s)

10) 11) 12)

13)

Clip 4 wires and remove 3 screws.

PWB-MODE-A is > 10 square cm’s

LID

BASE

CARTRIDGE

HOUSING

BOM

ASSY

PCA

ARM

HOUSING

ASSY

ARM

SUB

ASSY

UIDE

FFC

9PIN

Connector

PWB

MODE

REC

PCA

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14)

Remove PWA-MODE-B-ASSY > 10 square cm’s

REEL

MOTOR

ASSY

PWA

MODE

ASSY

DRUM

ASSY

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