HP HC270cr Instrucciones de instalación

Product End-of-Life Disassembly Instructions

Product Category: Monitors and Displays

Marketing Name / Model

[List multiple models if applicable.]

HP HC270cr Display

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions

for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU

directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).

1.0 Items Requiring Selective Treatment

1.1 Items listed below are classified as requiring selective treatment.

1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as

applicable.

Item Description

Notes

Quantity

of items

included

in product

Printed Circuit Boards (PCB) or Printed Circuit

Assemblies (PCA)

With a surface greater than 10 sq cm

IF BD, OSD key BD, Lync key BD, BLS BD

Batteries

All types including standard alkaline and lithium coin

or button style batteries

Mercury-containing components

For example, mercury in lamps, display backlights,

scanner lamps, switches, batteries

Liquid Crystal Displays (LCD) with a surface greater

than 100 sq cm

Includes background illuminated displays with gas

discharge lamps Panel

Cathode Ray Tubes (CRT)

Capacitors / condensers (Containing PCB/PCT)

Electrolytic Capacitors / Condensers measuring

greater than 2.5 cm in diameter or height

Power BD only (C805)

External electrical cables and cords

DP, USB A-B, USB C-C, HDMI, VGA Cable, Power

cord

Gas Discharge Lamps

Plastics containing Brominated Flame Retardants

Components and parts containing toner and ink,

including liquids, semi-liquids (gel/paste) and toner

Include the cartridges, print heads, tubes, vent

chambers, and service stations.

Components and waste containing asbestos

Components, parts and materials containing

refractory ceramic fibers

Components, parts and materials containing

radioactive substances

2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where components

and materials requiring selective treatment can be removed.

Tool Description

Tool Size (if

applicable)

Description #1 SCREW DRIVER(PHILLIPS HEAD)

Description #2 SCREW DRIVER(PHILLIPS HEAD)

Description #3 SCREW DRIVER(PHILLIPS HEAD)

Description #4

Description #5

3.0 Product Disassembly Process

3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:

1. Remove Cable From Display Head.

2. Push the release button

3. Remove Stand Base From Display Head. Remove Mid cover From Display Head

4. Release four screws

5. Remove Rear Cover from the bottom side.

6. Peel off the two mylars at the bottom side of R/C.

7. Peel off four pcs Logo in R/C.

8. Remove bottom lots of EMI Al tape and top black EMI tape and two speakers

9. Release six screws and five cable connectors

10. Uplift Chassis then unlock the cable above shows, and we get two ASSY as right picture show

11. Release five screws for PCB fix and five screws for Connector fix

12. Take off PCB and unlock all the cables

13. Take away thermal pads and take off heatsink after release screws, get all the parts as right picture show.

14. Release four screws around Panel then Panel can be taken apart from Middle Frame.

15. Release five screws and peel off two little PCBs. Disassemble the top slider ASSY.

16. Release four side screws and one piece EMI mylar

17. Peel off four Rubbers on the front side and one PCB on rear side

18. Release three screws in VESA and four screws in Base

19. Release three screws and two springs

20. Release ten screws and peer off two rubbers

21. Release around screws and take off plastic

22. Panel disassemble

3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items

contained in the product that require selective treatment (with descriptions and arrows identifying locations).

HP HC270cr Disassembly Process

▪Tonny Hu

▪Mechanical Engineer

▪Jan-30-2018

External Electric Cables Dissecting Process

1.Remove Cable From Display Head.

Remove Stand Base From Display Head

3.Remove Stand Base From Display Head.2. Push the release button

5.Remove Rear Cover from the bottom side.

Remove Rear Cover From Display Head

4.Release four screws

6.Peel off the two mylars at the bottom

side of R/C. 7.Peel off four pcs Logo in R/C.

Remove Bracket from Display Head

8.Remove bottom lots of EMI Al tape and top

black EMI tape and two speakers

9. Release six screws and five cable

connectors

10. Uplift Chassis then unlock the cable above shows, and

we get two ASSY as right picture show

Disassemble Chassis ASSY

11. Release five screws for PCB fix and five

screws for Connector fix 12. Take off PCB and unlock all the cables

13. Take away thermal pads and take off heatsink

after release screws, get all the parts as right picture show.

Disassemble Metal ASSY

Disassemble Panel and Middle Frame

14. Release four screws around Panel then Panel can

be taken apart from Middle Frame.

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