EL-MF877-00 Page 2
Template Revision B
PSG instructions for this template are available at EL-MF877-01
PCBs or PCAs already listed as a separate
item above)
Components and parts containing toner and
ink, including liquids, semi-liquids (gel/paste)
Include the cartridges, print heads, tubes, vent chambers,
and service stations. NO
Components and waste containing asbestos
Components, parts and materials containing
refractory ceramic fibers
C903/C904/C908/C909/C913/C923/C929/C930/C906/C928
Components, parts and materials containing
radioactive substances
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Size (if
applicable)
ESD wrist ring Wrist which forfend static
ESD glove Glove which forfend static
Screwdriver type:3220/5200
、
：φ
、
Screwdriver type:3220/5200、shank type hexagram：φ=5mm、L=85mm
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Dismantle the screws of stand，get down the stand
2. Dismantle BEZEL
3. Dismantle the button，pull out the pin of function key board ,get down function key board
4. Pull out the PIN of power of function key board ,and get down it
5. Dismantle REAR COVER
6. Dismantle the D-SUB screws and DVI screws
7. Pull out the Pin of the lamps
8. Dismantle the screws of PANEL
9. Pull out the PIN of FFC cabel，separate the mainframe and PANEL
10. Dismantle the screws of main board and power supply board
11. First : take off the power supply unit and main board from the metal cabinet
12. Pull out the connectors that between power supply unit and main board;
13. Pull out the connector between cable to function key board and FFC cable from main board
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
