HP Compaq W2052a Instrucciones de instalación

EL-MF877-00 Page 1

Template Revision B

PSG instructions for this template are available at EL-MF877-01

Product End-of-Life Disassembly Instructions

Product Category: Monitors and Displays

Marketing Name / Model

[List multiple models if applicable.]

Compaq W2052a 20-inch LED Backlit LCD Monitor

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions

for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU

directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).

1.0 Items Requiring Selective Treatment

1.1 Items listed below are classified as requiring selective treatment.

1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as

applicable.

Item Description

Notes

Quantity of items

included in

product

Printed Circuit Boards (PCB) or Printed Circuit

Assemblies (PCA)

With a surface greater than 10 sq cm

Batteries

All types including standard alkaline and lithium

coin or button style batteries

Mercury-containing components

For example, mercury in lamps, display

backlights, scanner lamps, switches, batteries

Liquid Crystal Displays (LCD) with a surface

greater than 100 sq cm

Includes background illuminated displays with

gas discharge lamps

Cathode Ray Tubes (CRT)

Capacitors / condensers (Containing PCB/PCT)

Electrolytic Capacitors / Condensers measuring

greater than 2.5 cm in diameter or height

External electrical cables and cords

W2052a/W2072a:3

LV2011/LV2011q:2

Gas Discharge Lamps

Plastics containing Brominated Flame

Retardants weighing > 25 grams (not including

PCBs or PCAs already listed as a separate item

above)

Components and parts containing toner and ink,

including liquids, semi-liquids (gel/paste) and

Include the cartridges, print heads, tubes, vent

chambers, and service stations.

EL-MF877-00 Page 2

Template Revision B

PSG instructions for this template are available at EL-MF877-01

toner

Components and waste containing asbestos

Components, parts and materials containing

refractory ceramic fibers

Components, parts and materials containing

radioactive substances

2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where components

and materials requiring selective treatment can be removed.

Tool Description

Tool Size (if

applicable)

Description #1 Screw driver of "+" type

200mm

Description #2 Hexagonal nut screw driver for DVI and D-SUB connector

200mm

Description #3

Description #4

Description #5

3.0 Product Disassembly Process

3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:

1. Dismantle the screws of stand，get down the stand

2. Dismantle the cover of monitor

3. Dismantle the button，pull out the pin of KEPC board ,get down the KEPC board

4. Dismantle mainframe

5. Dismantle BEZEL

6. Dismantle the screws of PANEL

7. Pull out the PIN of lamp

8. Pull out the PIN of LVDS cable，separate the mainframe and PANEL

9. Dismantle the power board screws

10. Dismantle the VGA screws

11. First: Tear off the adhesive tape;

12. Second: Pull out the connector PIN which connect PWPC and main board;

13. Third: Take off both boards

14. Pull out the pin of KEPC cable

15.

16.

3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items

contained in the product that require selective treatment (with descriptions and arrows identifying locations).

Pls. refer the attached:

HP-W2072a/W2052a/LV2011/LV2011q

DisassemblyProcess

From:Clean.Zhang

Date:Sep.-26-11

1.RemoveCableFrom DisplayHead. 2.Dissecting to Complete.

ExternalElectricCables Dissecting Process

PowerCable

D-SUB&DVICable

RemoveStand Base FromDisplay

1.Take Screw(*5)from RearCover. 2. Demount Stand & RemoveStand Base FormDisplay.

RemoveRear Cover From DisplayHead

1.Both Hands UpwardlyPull Up.

3. Towardthe arrowhead, take the Rear

Coverfrom the Front Cover. 4. RemoveRearCover.

2.TurnoverDisplayHead.

RemoveKEPCboard FromFrontCover

1.Take the KEPCassemblyfrom theFront

Cover. 2.RemoveConnectoroff from KEPCboard

and disassemble KEPCassembly.

RemoveMainframe&Panel

1. RemoveConnectoroff from Power

board& Panel. 2.RemovetheConductive Tapefrom

theMainframe.

3.RemoveMainframe&Panel. 4.Removetheconnecting wire&Remove

InsulatorSheetoff frompanel.

RemoveFrontCover &Panel

1.TurnoverPanel, and removethe Front

Coveroff from Panel. 2. Dissecting to complete.

1.Take Screw(*4or2)from Mainframe. 2. Take Screw(*6)from PowerBd&MainBd .

Take ScrewoffFrom MainframeAssembly

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