HP SpectreXT TouchSmart Instrucciones de montaje

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Product End-of-Life Disassembly Instructions

Product Category: Notebooks and Tablet PCs

Marketing Name / Model

[List multiple models if applicable.]

HP SpectreXT TouchSmart

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions

for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU

directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).

1.0 Items Requiring Selective Treatment

1.1 Items listed below are classified as requiring selective treatment.

1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as

applicable.

Item Description

Notes

Quantity

of items

included

in product

Printed Circuit Boards (PCB) or Printed Circuit

Assemblies (PCA)

With a surface greater than 10 sq cm

Mother board

Batteries

All types including standard alkaline and lithium coin

or button style batteries battery and RTC battery

Mercury-containing components

For example, mercury in lamps, display backlights,

scanner lamps, switches, batteries

Liquid Crystal Displays (LCD) with a surface greater

than 100 sq cm

Includes background illuminated displays with gas

discharge lamps LCD

Cathode Ray Tubes (CRT)

Capacitors / condensers (Containing PCB/PCT)

Electrolytic Capacitors / Condensers measuring

greater than 2.5 cm in diameter or height

External electrical cables and cords

Power cords,Adapter

Gas Discharge Lamps

Plastics containing Brominated Flame Retardants

Components and parts containing toner and ink,

including liquids, semi-liquids (gel/paste) and toner

Include the cartridges, print heads, tubes, vent

chambers, and service stations.

Components and waste containing asbestos

Components, parts and materials containing

refractory ceramic fibers

Components, parts and materials containing

radioactive substances

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2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where components

and materials requiring selective treatment can be removed.

Tool Description

Tool Size (if

applicable)

Description #1 screw driver

Philip #1 /

TORX T

Description #2 screw driver

Philip #0 /

TORX T

Description #3

Description #4

Description #5

3.0 Product Disassembly Process

3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:

1. remove log low

2. remove battery pack

3. remove LCD Module

4. remove Front Speaker

5. remove DC_IN & Cable and I/O Board

6. remove HDD Module

7. remove Thermal Module

8. remove Card Module

9. remove MB

10. remove Rear Speaker

11. remove TP LED Board

12. remove TP Module

13. remove Antenna

14. remove Power Board

15. remove KB support Brk

16. remove KB

17. remove ESD PCB

18. divide Display assy (remove LCD Bezel)

19. divide Display assy (remove LCD Hinge Cap L-R)

20. divide Display assy (remove LCD module)

21. divide Display assy (remove LCD Hinge Brk L-R)

22. divide Display assy (remove LVDS Cable & control board cable)

23. divide M/B assy (remove Rj45 Door ASSY)

24. divide M/B assy (remove Shielding can ASSY_TOP)

25. divide MB assy (remove RTC Battery)

26. divide MB assy (Shielding can ASSY_BTM)

27. divide Display assy (remove LCD cover AL skin)

28. divide Log UP assy(remove Log up AL skin)

3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items

contained in the product that require selective treatment (with descriptions and arrows identifying locations).

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Step 1 Remove log low Step2 Remove Battery pack

Step 5 Remove DC_IN & Cable and I/O Board Step 6 Remove HDD Module.

Step 3 Remove LCD Module. Step4 Remove Front Speaker

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Step 7 Remove Thermal Module. Step8 Remove Card Module

Step 9 Remove MB Step10 Remove Rear Speaker

Step 11 Remove TP LED Board Step12 Remove TP Module

Step 13 Remove Antenna Step14 Remove Power Board

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Step 15 Remove KB support Bracket Step16 Remove KB

Step 17 Remove ESD PCB

Step 18 divide Display assy (remove LCD Bezel) Step 19 divide Display assy (remove LCD Hinge Cap L-R)

Step 20 divide Display assy (remove LCD module) Step21 divide Display assy (remove LCD Hinge Brk L-R)

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Step 22 divide Display assy (remove LVDS Cable & control board cable)

Step23 divide M/B Assy (remove RJ 45 Door ASSY) Step 24 divide M/B Assy (Shielding can ASSY_TOP)

Step 25 divide MB assy (remove RTC Battery) Step 26 divide MB assy (Shielding can ASSY_BTM)

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Step 27 divide Display assy(remove lcd cover AL skin) Step28 divide Log UP assy(remove Log up AL skin)

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