HP Pavilion x2 Detachable Instrucciones de montaje

EL-MF877-00 Page 1

Template Revision B

PSG instructions for this template are available at EL-MF877-01

Product End-of-Life Disassembly Instructions

Product Category: Notebooks and Tablet PCs

Marketing Name / Model

[List multiple models if applicable.]

HP Pavilion x2 Detachable PC

HP Pavilion x2 Detachable

HP Pavilion x2 Detachable 12

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions

for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU

directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).

1.0 Items Requiring Selective Treatment

1.1 Items listed below are classified as requiring selective treatment.

1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as

applicable.

Item Description

Notes

Quantity

of items

included

in product

Printed Circuit Boards (PCB) or Printed Circuit

Assemblies (PCA)

With a surface greater than 10 sq cm

Batteries

All types including standard alkaline and lithium coin

or button style batteries RTC,Battery

Mercury-containing components

For example, mercury in lamps, display backlights,

scanner lamps, switches, batteries

Liquid Crystal Displays (LCD) with a surface greater

than 100 sq cm

Includes background illuminated displays with gas

discharge lamps

Cathode Ray Tubes (CRT)

Capacitors / condensers (Containing PCB/PCT)

Electrolytic Capacitors / Condensers measuring

greater than 2.5 cm in diameter or height

External electrical cables and cords

Gas Discharge Lamps

Plastics containing Brominated Flame Retardants

weighing > 25 grams (not including PCBs or PCAs

already listed as a separate item above)

Components and parts containing toner and ink,

including liquids, semi-liquids (gel/paste) and toner

Include the cartridges, print heads, tubes, vent

chambers, and service stations.

Components and waste containing asbestos

Components, parts and materials containing

refractory ceramic fibers

EL-MF877-00 Page 2

Template Revision B

PSG instructions for this template are available at EL-MF877-01

Components, parts and materials containing

radioactive substances

2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where components

and materials requiring selective treatment can be removed.

Tool Description

Tool Size (if

applicable)

Screwdriver

Description #2

Description #3

Description #4

Description #5

3.0 Product Disassembly Process

3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:

1. Disassemble the slate & docking ass'y

2. Remove battery cable from connecter on MB

3. Disassemble bezel ass'y from A-cover ass'y

4. Remove LCD cable with touch glass control board

5. Release SPK L&R screw *4 pcs

6. Remove speaker L&R

7. Release slate pogo connecter screw *2 pcs

8. Release pogo cable connecter on MB

9. Remove the pogo cable & RTC battery

10. Release battery screw *4 pcs

11. Remove battery pack

12. Release ssd screw *1 pcs

13. Remove ssd card

14. Release antenna connecter *2

15. Release antenna board screw *1 pcs

16. Remove antenna board

17. Release power & audio & usb ffc connecter on MB

18. Release camera cable connecter on MB

19. Release MB screw *6 pcs

20. Release MG bracket *1 pcs

21. Remove Mother Board

22. Release MG bracket screw *3 pcs

23. Remove MG bracket

24. Release audio board screw *3 pcs

25. Remove audio bracket

26. Release ffc connecter on audio board

27. Remove audio bord

28. Remove audio and usb ffc

29. Release ffc connecter on vol. board

30. Release vol. board screw *2 pcs

31. Remove vol.board

32. Remove vol. ffc

33. Release ffc connecter on power board

34. Release power board screw *1 pcs

35. Remove power board

36. Remove power ffc

37. Release camera cable connecter on camera module

EL-MF877-00 Page 3

Template Revision B

PSG instructions for this template are available at EL-MF877-01

38. Remove camera cable

39. Remove camera module

40. Remove antenna cable

41. Remove base rubber

42. Release base screw *4 pcs

43. Remove base mylar *2 pcs

44. Release base screw *2 pcs

45. Disassemble the base cover from docking ass'y

46. Release docking pogo cable connecter *2 pcs from docking DB

47. Release the KB membrane from docking DB

48. Releae ffc connecter on docking DB & TP module

49. Remove TP module ffc

50. Release docking DB screw *2 pcs

51. Remove docking DB

52. Release TP bracket screw *3 pcs

53. Remove TP bracket

54. Release TP holder screw *3 pcs

55. Remove TP ass'y

56. Remove TP mylar

57. Remove TP module

58. Release hinge bracket L&R screw *4 pcs

59. Disassemble the hinge bar ass'y from top ass'y

60. Disassemble the hinge bar bezel from hinge bar cover ass'y

61. Release docking pogo cable connecter screw *2 pcs

62. Remove docking pogo cable

63. Release hinge L&R screw *4 pcs

64. Remove hinge L&R from hinge bar cover ass'y

65. END

3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items

contained in the product that require selective treatment (with descriptions and arrows identifying locations).

3.21 Total part disassembly

3.22 Remove battery module

EL-MF877-00 Page 4

Template Revision B

PSG instructions for this template are available at EL-MF877-01

3.23 Remove service door

3.24 LCD module set disassembly

3.25 Top case disassembly

3.26 Thermal module and mother board disassembly

3.27 Bottom case disassembly

EL-MF877-00 Page 5

Template Revision B

PSG instructions for this template are available at EL-MF877-01

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