HP Omen X Instrucciones de instalación

EL-MF877-00 Page 1

Template Revision B

PSG instructions for this template are available at EL-MF877-01

Product End-of-Life Disassembly Instructions

Product Category: Notebooks and Tablet PCs

Marketing Name / Model

[List multiple models if applicable.]

OMEN X by HP Laptop PC 17

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions

for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU

directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).

1.0 Items Requiring Selective Treatment

1.1 Items listed below are classified as requiring selective treatment.

1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as

applicable.

Item Description

Notes

Quantity

of items

included

in product

Printed Circuit Boards (PCB) or Printed Circuit

Assemblies (PCA)

With a surface greater than 10 sq cm

M/B , Audio Board, Power Board, DB ,TP BOARD

Batteries

All types including standard alkaline and lithium

coin or button style batteries Main Battery

Mercury-containing components

For example, mercury in lamps, display backlights,

scanner lamps, switches, batteries

Liquid Crystal Displays (LCD) with a surface

greater than 100 sq cm

Includes background illuminated displays with gas

discharge lamps 17.3"

Cathode Ray Tubes (CRT)

Capacitors / condensers (Containing PCB/PCT)

Electrolytic Capacitors / Condensers measuring

greater than 2.5 cm in diameter or height

External electrical cables and cords

Power Cord

Gas Discharge Lamps

Plastics containing Brominated Flame Retardants

weighing > 25 grams (not including PCBs or PCAs

already listed as a separate item above)

Components and parts containing toner and ink,

including liquids, semi-liquids (gel/paste) and toner

Include the cartridges, print heads, tubes, vent

chambers, and service stations.

Components and waste containing asbestos

EL-MF877-00 Page 2

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Components, parts and materials containing

refractory ceramic fibers

Components, parts and materials containing

radioactive substances

2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where components

and materials requiring selective treatment can be removed.

Tool Description

Tool Size (if

applicable)

Description #1 Screwdriver

#1,#0

Description #2

Description #3

Description #4

Description #5

3.0 Product Disassembly Process

3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:

1. Dis-fasten D cover screw *10

2. Remove D cover

3. Dis-fasten centel hook screw *2

4. Pull out Battery cable

5. Dis-fasten battery screw *4

6. Remove Battery

7. Dis-fasten trunk assy screw *6

8. Remove Trunk assy

9. Dis-fasten Fan screw *3

10. Pull out Fan cable (Left side)

11. Remove Thermal Fan

12. Dis-fasten SSD screw *1(2)

13. Remove SSD

14. Dis-fasten Thermal module screw *11

15. Pull out Fan cable (Right side)

16. Remove Thermal module

17. Dis-fasten Speaker screw *2

18. Pull out Speaker cable

19. Remove Speaker -L & -R

20. Dis-fasten TP module screw *4

21. Pull out TP cable

22. Remove TP module

23. Pull out FFC/ Wire Cable ( DB, Audio, KB, BL,PW, HDD FFC , LCD/ LED/ DC cable Antenna Cable)

24. Remove HDD assy

25. Dis-fasten PCBA screw *7

26. Remove PCBA

27. Remove DC Cable

28. Dis-fasten Hinge Support BKT screw *12

29. Remove LED cable & Hinge support BKT

30. Dis-fasten Hinge screw *8

31. Remove Hinge support BKT

32. Dis-fasten Panel screw *4

33. Pull out LCD cable

34. Remove Panel

35. Dis-fasten Hinge BKT screw *6

EL-MF877-00 Page 3

Template Revision B

PSG instructions for this template are available at EL-MF877-01

36. Remove Hinge BKT L/R

37. Pull out Camera/ LED module Cable

38. Remove Antenna cable

39. Dis-fasten Hinge screw *6

40.

41.

3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items

contained in the product that require selective treatment (with descriptions and arrows identifying locations).

3.21 Total part disassembly

3.22 Remove battery module

3.23 Remove service door (N/A)

3.24 LCD module set disassembly

Remove Hinge support Bkt

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Template Revision B

PSG instructions for this template are available at EL-MF877-01

Remove Bezel

Remove Panel

Remove Hinge BKT L/R

Remove Camera

Remove Hinge (LCD /Antenna Cable)

EL-MF877-00 Page 5

Template Revision B

PSG instructions for this template are available at EL-MF877-01

3.25 Top case disassembly

Remove center hook & Battery

Remove Trunk assy

Remove Thermal Fan / SSD / Thermal module /HDD

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Template Revision B

PSG instructions for this template are available at EL-MF877-01

Remove Speaker

Remove TP module /DC Jack / K-Lock BKT & PW /Audio Board & DB ,KB

EL-MF877-00 Page 7

Template Revision B

PSG instructions for this template are available at EL-MF877-01

3.26 Thermal module and mother board disassembly

Remove Trunk assy

EL-MF877-00 Page 8

Template Revision B

PSG instructions for this template are available at EL-MF877-01

Remove Thermal Fan

Remove SSD

Remove Thermal Module

EL-MF877-00 Page 9

Template Revision B

PSG instructions for this template are available at EL-MF877-01

Remove PCBA

3.27 Bottom case disassembly

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