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HP-00007-01, Appendix 3 13-Oct-2004

Page 1

Appendix 3 Product End-of-Life Disassembly instructions

Product Identification:

Marketing Name / Model Description

Compaq V4000 Series Notebook PC Notebook PC

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the

basic instructions for the disassembly of HP products to remove components and materials requiring

selective treatment.

1.0 Items Requiring Selective Treatment

1.1 Items listed below are classified as requiring selective treatment.

1.2 Enter the quantity of items contained within the product which require selective treatment in

the right column, as applicable.

Item Description Notes Quantity of

items included

in product.

Printed Circuit Boards (PCB) or Printed

Circuit Assemblies (PCA) With a surface greater than 10

square cm 3

Batteries All types including standard

alkaline and lithium coin or button

style batteries

2

Mercury containing components For example, mercury in lamps,

display backlights, scanner lamps,

switches, batteries

1

Liquid Crystal Displays (LCD) with a

surface greater than 100 square cm Includes background illuminated

displays with gas discharge lamps 1

Cathode Ray Tubes (CRT) 0

Capacitors / condensers (Containing

PCB / PCT)

Electrolytic Capacitors / Condensers

measuring greater than 2.5 cm in

diameter or height

0

External electrical cables and cords 0

Gas Discharge Lamps 0

Plastics containing Brominated Flame

Retardants Declaration limited to case

plastics only. 0

Components and parts containing toner

and ink, including liquids, semi-liquids

(gel/paste) and toner

Include the cartridges, print

heads, tubes, vent chambers, and

service stations.

0

Components and waste containing

asbestos 0

Components, parts and materials

containing refractory ceramic fibers 0

HP-00007-01, Appendix 3 13-Oct-2004

Page 2

Components, parts and materials

containing radioactive substances 0

2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a

point where components and materials requiring selective treatment can be removed.

Tool Description Tool Size (if applicable)

Screwdriver Type-Phillip #1

Screwdriver Type-Phillip #0

Screwdriver Type-T #8

3.0 Product Disassembly Process

3.1 List the basic steps that should typically be followed to remove components and materials

requiring selective treatment:

1 Remove 6 cell battery

2 Remove M2.5*6L screws on HDD door, then remove HDD and ODD module.

3 Remove M2.5*6L screws and M2*3L screws on lower case , then reverse it.

4 Remove middle cover assy., then remove M2*3L screws on upper case.

5 Remove keyboard and LCD assy.

6 Remove M2*12L screws and M2*3L screws on upper case.

7 Remove upper case assy.

8 Remove M2.5*6L screws, then remove MB.

9 Remove IO/R and lower case assy.

10 Divide MB from connecter and Remove RTC coin cell battery on MB for selective

treatment.

11 Remove six M2.5*6L screws, then remove LCD bezel

12 Remove two M2.5*5L screws, then remove daughter board and LCD module.

13 Remove four M2*2L screws on middle cover assy., then Remove launch board.

14 Disassemble LCD assembly and remove mercury bulb for selective treatment.

3.2 OPTIONAL: Depending upon the complexity of the disassembly process, a graphic

depicting the locations of items contained within the product which require selective

treatment (with descriptions and arrows identifying locations) can be inserted below:

HP-00007-01, Appendix 3 13-Oct-2004

Page 3