HP ProDesk 400 G5 Instrucciones de instalación

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Product End-of-Life Disassembly Instructions

Product Category: Personal Computers

Marketing Name / Model

[List multiple models if applicable.]

HP ProDesk 400 G5 SFF Business PC

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions

for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU

directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).

1.0 Items Requiring Selective Treatment

1.1 Items listed below are classified as requiring selective treatment.

1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as

applicable.

Item Description

Notes

Quantity

of items

included

in product

Printed Circuit Boards (PCB) or Printed Circuit

Assemblies (PCA)

With a surface greater than 10 sq cm

MB, VGA card, Legacy card, Memory*2, SSD, Type

C board

Batteries

All types including standard alkaline and lithium coin

or button style batteries RTC

Mercury-containing components

For example, mercury in lamps, display backlights,

scanner lamps, switches, batteries

Liquid Crystal Displays (LCD) with a surface greater

than 100 sq cm

Includes background illuminated displays with gas

discharge lamps

Cathode Ray Tubes (CRT)

Capacitors / condensers (Containing PCB/PCT)

Electrolytic Capacitors / Condensers measuring

greater than 2.5 cm in diameter or height

External electrical cables and cords

Power cord

Gas Discharge Lamps

Plastics containing Brominated Flame Retardants

weighing > 25 grams (not including PCBs or PCAs

already listed as a separate item above)

Components and parts containing toner and ink,

including liquids, semi-liquids (gel/paste) and toner

Include the cartridges, print heads, tubes, vent

chambers, and service stations.

Components and waste containing asbestos

Components, parts and materials containing

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refractory ceramic fibers

Components, parts and materials containing

radioactive substances

2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where components

and materials requiring selective treatment can be removed.

Tool Description

Tool Size (if

applicable)

Star screwdriver

OD 3.3mm

Cross screwdriver

OD 3.0mm

Cross screwdriver

OD 6.0mm

Description #4

Description #5

3.0 Product Disassembly Process

3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:

1. Remove side panel

2. Remove front bezel

3. Unplug ODD & HDD cables

4. Remove drive cage

5. Remove FIO cage

6. Remove ODD & HDD

7. Remove all cables

8. Remove fan duct

9. Remove cooler

10. Remove CPU

11. Remove Memory

12. Remove WLAN module

13. Remove all PCIEXP cards

14. Remove card reader

15. Remove antenna cable

16. Remove MB and bettery

17. Remove PSU

18. Remove speaker

3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items

contained in the product that require selective treatment (with descriptions and arrows identifying locations).

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Release thumb screw

on the chassis rear

side.

Push side panel in

the end as shown,

and then pick up from

chassis.

See photo 1, 2

Screw tool:

Cross screwdriver

OD 6.0mm.

Photo 1

Photo 2

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

Release 4 bezel

latches from chassis

by pulling outwards

the bezel latches

then as shown.

See Photo 3

Pick up bezel in the

order as shown.

See Photo 4

Photo 3

Photo 4

Lift up bezel away

from chassis

Rotate bezel until

the bezel latches

align this line.

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Unplug ODD & HDD

cables as shown.

See Photo 7

Photo 7

ODD cable

HDD cable

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Press HDD cage first

then push button as

shown.

See Photo 8

Rotation drive cage

then pass through

HDD cables to drive

cage then remove

drive cage as shown.

See Photo 9, 10

Photo 8

Press HDD cage first

Push button

Photo 9

HDD SATA & PWR

cable pass through

to cage hole.

Rotate

Photo 10

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Pick up FIO bracket

from chassis as shown.

See Photo 11

Photo 11

Photo 12

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Release 4 screws then

pull up HDD from drive

cage as shown.

See Photo 12, 13

Screw tool:

Star screwdriver OD

3.3mm.

Push ODD latch then

pull ODD as shown.

See Photo 14, 15

Photo 14

Photo 13

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Photo 16

Photo 17

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Release all cables

See Photo 16, 17,

18, 19, 20

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