HP Pavilion Elite m9400 - Desktop PC Instrucciones de instalación
EL-MF877-00 Page 1
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Product End-of-Life Disassembly Instructions
Product Category: Personal Computers
Marketing Name / Model
[List multiple models if applicable.]
HP Pavilion Elite m9400/m9500 series PC
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description
Notes
Quantity
of items
included
in product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sq cm
2
Batteries
All types including standard alkaline and lithium coin
or button style batteries
1
Mercury-containing components
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
0
Liquid Crystal Displays (LCD) with a surface greater
than 100 sq cm
Includes background illuminated displays with gas
discharge lamps
0
Cathode Ray Tubes (CRT)
0
Capacitors / condensers (Containing PCB/PCT)
0
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
The QTY may vary from different PSU Models
2
External electrical cables and cords
0
Gas Discharge Lamps
0
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
PSU fan, CPU fan, system fan
3
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
0
Components and waste containing asbestos
0
EL-MF877-00 Page 2
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Components, parts and materials containing
refractory ceramic fibers
0
Components, parts and materials containing
radioactive substances
0
1.3 Markings for plastic parts greater than 25 grams
Plastic Part Name
Plastic Part Description
Weight
(grams)
ISO 11469:2000
Plastic Part Mark
Optional:
Photo
NEPTUNE2_MAIN_BEZEL
Main bezel
235
>ABS<
NEPTUNE2_TRIM_BEZEL
main bezel trim
45
>ABS<
NEPTUNE2_COSMETIC_BEZEL
main bezel cosmetic part
34
>ABS<
NEPTUNE2_TOP_CAP_BASE
top cap
215
>ABS<
Fan Frame
CPU fan frame
36
>PBT-GF30-
FR(17)<
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Description #1 Phillips screw driver
NO 2
Description #2
Description #3
Description #4
Description #5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Remove cover from the unit
2. Remove all the cables from PCA
3. remove PCI & PCI-E card from the PCA
4. Remove HDD from the system Remove ODD from PCA
5. take off Front Panel
6. Take off ODD
7. Take off Cooler
8. Take off CMOS battery
9. Take off PS from the Unit
10. cut off wire tie
11. open PS
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
EL-MF877-00 Page 3
Template Revision B
PSG instructions for this template are available at EL-MF877-01
1 Remove cover from the unit
Rotate screw to open the cover
2 Remove all the cables from PCA
Press the button to pull power cords off
Pull the other cords off PCA
3 remove PCI & PCI-E card from the PCA
Use screw driver to take off the screw as shown in the
photo
EL-MF877-00 Page 4
Template Revision B
PSG instructions for this template are available at EL-MF877-01
3 Take PCI & PCI-E cards off the PCA
Use one hand to push the white plastic use the other hand to
pull off the card
4 、Remove HDD from the system
Rotate the screw driver to take off the HDD holder
5 take off Front Panel
Pull the button up and then take off the front panel
EL-MF877-00 Page 5
Template Revision B
PSG instructions for this template are available at EL-MF877-01
6 Take off ODD
Use one hand to pull the steel up , and the same time take off
ODD use the other hand
7 Take off Cooler
Press the steel button to loose Cooler fan
7 Take off Cooler
Rotate screw driver to loose screw and then take the
cooler off PCA
EL-MF877-00 Page 6
Template Revision B
PSG instructions for this template are available at EL-MF877-01
8 Take off CMOS battery
Pull the battery holder as shown in the photo, and
then the battery will off the PCA
9 Take off PS from the Unit
Use screw driver to loose screws and then take the PS
off the Unit
10 cut off wire tie
EL-MF877-00 Page 7
Template Revision B
PSG instructions for this template are available at EL-MF877-01
11 open PS
12 use screw driver to separate the small PCA from
the main board
13 Screw driver
Phillips screw driver NO 2
Este manual sirve para los siguientes modelos
1
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