HP OMEN 880 Instrucciones de instalación

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Product End-of-Life Disassembly Instructions

Product Category: Personal Computers

Marketing Name / Model

[List multiple models if applicable.]

OMEN by HP Desktop PC 880

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions

for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU

directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).

1.0Items Requiring Selective Treatment

1.1 Items listed below are classified as requiring selective treatment.

1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as

applicable.

Item Description Notes

Quantity

of items

included

in product

Printed Circuit Boards (PCB) or Printed Circuit

Assemblies (PCA)

With a surface greater than 10 sq cm

Batteries

All types including standard alkaline and lithium coin

or button style batteries

Mercury-containing components

For example, mercury in lamps, display backlights,

scanner lamps, switches, batteries

Liquid Crystal Displays (LCD) with a surface greater

than 100 sq cm

Includes background illuminated displays with gas

discharge lamps

Cathode Ray Tubes (CRT)

Capacitors / condensers (Containing PCB/PCT)

Electrolytic Capacitors / Condensers measuring

greater than 2.5 cm in diameter or height

300W,500W,750W Power supply

External electrical cables and cords

Gas Discharge Lamps

Plastics containing Brominated Flame

Retardantsweighing > 25 grams (not including

PCBs or PCAs already listed as a separate item

above)

TOP base-1 83g & Release button 27g & Hurr-side-

windows 366g & front cover 101g & front bezel 214g

& led trim 37g & hdd cover 85g

Components and parts containing toner and ink,

including liquids, semi-liquids (gel/paste) and toner

Include the cartridges, print heads, tubes, vent

chambers, and service stations.

Components and waste containing asbestos

Components, parts and materials containing

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refractory ceramic fibers

Components, parts and materials containing

radioactive substances

2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where components

and materials requiring selective treatment can be removed.

Tool Description

Tool Size (if

applicable)

Screw driver

PH1

Screw driver

PH2

Micro shear

Screw driver

Description #5

3.0 Product Disassembly Process

3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:

1. Remove Side cover L (see Figure 1-2)

2. Remove Gfx and CPU cooler (see Figure 3-8)

3. Remove MB (see Figure 7-9)

4. Remove the DIMM,CPU and Battery (see Figure 10-12)

5. Remove the Side cover R (see Figure 13)

6. Remove the Function Board (see Figure 15-16)

7. Remove the HDD (see Figure 17-21)

8. Remove the ODD (see Figure 22-24)

9. Remove the Top base module (see Figure 25-29)

10. Remove the Front bezel module (see Figure 30-33)

11. Remove the Plastic foots (see Figure 34)

12. Remove the Rear gasket (see Figure 35)

13. Remove the Plastic lock (see Figure 36)

14. Remove the Antenna cable (see Figure 37)

15. Remove the Front fan (see Figure 38)

16. Remove the Power supply (see Figure 39)

17. Remove the Plastic side windows (see Figure 40)

18. Remove the LC cooler fan guard (see Figure 41)

19. Remove the LC cooler fan (see Figure 42)

20. Remove the Electrolytic Capacitors from PSU board PS-6301-07HE (300W)(see Figure 43-52)

21. Remove the Electrolytic Capacitors from PSU board PS-8501-2HB (500W)(see Figure 53-63)

22. Remove the Electrolytic Capacitors from PSU board HP P/N: 918590-003 (750W)(see Figure 64-71)

3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items

contained in the product that require selective treatment (with descriptions and arrows identifying locations).

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Figure1 Press the latch button on rear side

Figure2 Remove the access side cover L

Figure3 Remove internal lighting module by 3 screws

Figure4 Release GFX holder screws and cables PWR

then remove GFX card from the chassis inside

Figure5 Unplug the cables of fan and pump

Figure6 Release the CPU Pump and radiator screw to

remove CPU LC

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Figure7 Unplug all cables connector from PCA.

Figure8 Release 8 PCS screws from PCA

Figure9 Remove MB cap and uninstall the MB screws to

take off PCA from the chassis inside

Figure10 Push the memory hook son both sides and then

pick up the memory

Figure11 Rotate the handle and open it up and remove

the CPU from board

Figure12 Remove the battery from the PCA

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Figure13Remove the access right side cover R by 2 PCS

screws

Figure14 Release 5pcs screws from TOP base both side

and take off it

Figure15 Unplug all cables connector from the function

board PCA

Figure16 Release 7pcs screws from top base module and

remove function board PCBA

Figure17 Open the HDD Door and push HDD locker to

release high end HDD cage module

Figure18 Pull up the HDD cage and release 4 screws to

remove HDD

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Figure19Unplug HDD cable connector from bottom HDD

and pull up HDD cage module to remove HDD

Figure20 Uninstall HDD cage screws and remove high

end HDD SATA cable from high end HDD back plate

Figure21 Unplug all cable connector from TOP HDD and

pull up HDD cage to remove HDD

Figure22 Disconnect ODD cable connector from ODD

device

Figure23 Release ODD plastic latch and remove from the

chassis MB tray right side

Figure24 Remove the ODD module from the chassis

inside

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Figure25 Remove the KEYMOD screw and take off

Figure26 Remove the hand down cover screws and take

off

Figure27 Remove the top bas cover from chassis top

side

Figure28 Remove the top fillet r from the top base cover

from chassis top side

Figure29 Remove the power switch cable from top base

module

Figure30 Remove the front bezel hook and bezel uninstall

from the chassis front side

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Figure31 Uninstall the front bezel hook and remove bezel

part from chassis

Figure32 Remove the front cover voodoo lighting from

bezel cover by 4 PCS screws to uninstall

Figure33Remove the trim lighting module from the bezel

cover

Figure34 Remove the plastic foots from chassis bottom

Figure35 Remove the gasket from the chassis rear inside

Figure36 Remove the plastic lock screw and remove it

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Figure37Remove the top antenna screws and remove

antenna cables

Figure38Release 4 screws from front fan and remove it

Figure39Release 4 screws from Power supply and

remove it

Figure40 Remove plastic side windows from side cover L

hook feature

Figure41 Remove LC cooler fan guard by 4pcs

Figure42Remove the screws between Fan and radiator

then remove GFX LC FAN from LC cooler module

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300W Power supply tear down

Figure43 Cut the cable tie.

Figure44 Remove the screw for top

Figure45 Remove the FAN and inlet screws

Figure46Remove the FG screw

Figure47 Disconnect the fan connector

Figure48 Remove the LED holder

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