HP Envy Recline23 TouchSmart Beats SE... Instrucciones de instalación

Product End-of-Life Disassembly Instructions

Product Category: Personal Computers

Marketing Name / Model

[List multiple models if applicable.]

HP Envy Recline23 TouchSmart Beats SE All-in-One PC

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions

for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU

directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).

1.0 Items Requiring Selective Treatment

1.1 Items listed below are classified as requiring selective treatment.

1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as

applicable.

Item Description Notes

Quantity

of items

included

in product

Printed Circuit Boards (PCB) or Printed Circuit

Assemblies (PCA)

With a surface greater than 10 sq cm

Mother Board, USB Board, Power Board, Touchpad

Module, TP Board, WLAN Card, RAM Module (x2)

Batteries

All types including standard alkaline and lithium coin

or button style batteries RTC Battery

Mercury-containing components

For example, mercury in lamps, display backlights,

scanner lamps, switches, batteries

Liquid Crystal Displays (LCD) with a surface greater

than 100 sq cm

Includes background illuminated displays with gas

discharge lamps Touch LCD display

Cathode Ray Tubes (CRT)

Capacitors / condensers (Containing PCB/PCT)

Electrolytic Capacitors / Condensers measuring

greater than 2.5 cm in diameter or height

External electrical cables and cords

Gas Discharge Lamps

Plastics containing Brominated Flame Retardants

weighing > 25 grams (not including PCBs or PCAs

already listed as a separate item above)

Components and parts containing toner and ink,

including liquids, semi-liquids (gel/paste) and toner

Include the cartridges, print heads, tubes, vent

chambers, and service stations.

Components and waste containing asbestos

Components, parts and materials containing

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refractory ceramic fibers

Components, parts and materials containing

radioactive substances

2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where components

and materials requiring selective treatment can be removed.

Tool Description

Tool Size (if

applicable)

Description #Screwdiver

TORX T8

Description #2

Description #3

Description #4

Description #5

3.0 Product Disassembly Process

3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:

1. Disassembly Ram Door

2. Disassembly HDD & Dongle

3. Disassembly Ram Shielding

4. Disassembly DDR Ram*2

5. Disassembly Rear cover sub assay

6. Disassembly Camera Module, PCB modules

7. Disassembly Thermal module Fan

8. Disassembly Mother board shielding

9. Disassembly WLAN Card

10. Disassembly Thermal module

11. Disassembly CPU

12. Disassembly Hinge Cap L&R

13. Disassembly Stand unit

14. Disassembly Support bridge

15. Disassembly Mother Board + USB 3.0 PCB and RTC battery

16. Disassembly Separate the USB 3.0 PCB from M/B

17. Disassembly Speaker left & right side

18. Disassembly Base Pan sub assay

19. Disassembly Loosen FPC

20. Disassembly LCD Panel

3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items

contained in the product that require selective treatment (with descriptions and arrows identifying locations).

3.21 Disassembly Ram Door 3.22 Disassembly HDD & Dongle

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Template Revision B

PSG instructions for this template are available at EL-MF877-01

3.23 Disassembly Ram Shielding 3.24 Disassembly DDR Ram*2

3.25 Disassembly Rear cover sub assay 3.26 Disassembly Camera Module, PCB modules

3.27 Disassembly Thermal module Fan 3.28 Disassembly Mother board shielding

3.29 Disassembly WLAN Card 3.30 Disassembly Thermal module

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3.31 Disassembly CPU 3.32 Disassembly Hinge Cap L&R

3.33 Disassembly Stand unit 3.34 Disassembly Support bridge

3.35 Disassembly Mother Board + USB 3.0 PCB and RTC battery 3.36 Disassembly Separate the USB 3.0 PCB from M/B

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PSG instructions for this template are available at EL-MF877-01

3.37 Disassembly Speaker left & right side 3.38 Disassembly Base Pan sub assay

3.39 Disassembly Loosen FPC 3.40 Disassembly LCD Panel

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PSG instructions for this template are available at EL-MF877-01

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