Freescale Semiconductor MPC8313E PowerQUICC II Pro Manual de usuario

Freescale Semiconductor

User’s Guide

The MPC8313E reference design board (RDB) is a system

featuring the PowerQUICC™ II Pro processor, which

includes a built-in security accelerator. This low-cost,

high-performance system solution consists of a printed

circuit board (PCB) assembly plus a software board support

package (BSP) distributed in a CD image. This BSP enables

the fastest possible time-to-market for development or

integration of applications including printer engines,

broadband gateways, no-new-wires home adapters/access

points, and home automation boxes.

This document describes the hardware features of the board

including specifications, block diagram, connectors,

interfaces, and hardware straps. It also describes the board

settings and physical connections needed to boot the

MPC8313E RDB. Finally, it considers the software shipped

with the platform.

When you finish reading this document, you should:

• Be familiar with the board layout

• Understand the default board configuration and your

board configuration options

• Know how to get started and boot the board

• Know about the software and further documentation

that supports the board

Document Number: MPC8313ERDBUG

Rev. 4, 02/2009

Contents

1. MPC8313E RDB Hardware . . . . . . . . . . . . . . . . . . . . 2

2. Board-Level Functions . . . . . . . . . . . . . . . . . . . . . . . . 7

3. Connectors, Jumpers, Switches, and LEDs . . . . . . . 19

4. Micro-Jumper/Resistor Options for eTSEC1 . . . . . . 27

5. MPC8313E RDB Board Configuration . . . . . . . . . . 38

6. Getting Started . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43

7. MPC8313E RDB Software . . . . . . . . . . . . . . . . . . . . 46

8. Frequently Asked Questions (FAQs) . . . . . . . . . . . . 47

9. Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49

WARNING

This is a class A product. In a domestic

environmentthisproductmaycauseradio

interference, in which case the user may

be required to take adequate measures.

PowerQUICC™ MPC8313E Reference

Design Board (RDB)

PowerQUICC™ MPC8313E Reference Design Board (RDB), Rev. 4

2Freescale Semiconductor

MPC8313E RDB Hardware

Use this manual in conjunction with the following documents:

•MPC8313E PowerQUICC™ II Pro Integrated Communications Processor Family Reference

Manual (MPC8313ERM)

•MPC8313E PowerQUICC II Pro Processor Hardware Specifications (MPC8313EEC)

• “Hardware and Layout Design Considerations for DDR Memory Interfaces” (AN2582)

NOTE

The normal function of the product may be disturbed by strong

electromagnetic interference. If so, simply reset the product to resume

normal operation by following the instructions in the manual. If normal

function does not resume, use the product in another location.

This equipment has been tested and found to comply with the limits for a

Class A digital device, pursuant to Part 15 of the FCC Rules. These limits

are designed to provide reasonable protection against harmful interference

when the equipment is operated in a commercial environment. This

equipment generates, uses, and can radiate radio frequency energy. If it is

not installed and used in accordance with the instruction manual, it may

cause harmful interference to radio communications. Operation of this

equipment in a residential area is likely to cause harmful interference, in

which case the user will be required to correct the interference at his or her

own expense.

1 MPC8313E RDB Hardware

This section covers the features, block diagram, specifications, and mechanical data of the MPC8313E

RDB.

1.1 Features

The board features are as follows:

• CPU: Freescale MPC8313E running at 333/166 MHz; CPU/coherent system bus (CSB)

• Memory subsystem:

— 128 Mbyte unbuffered DDR2 SDRAM discrete devices

— 8 Mbyte flash single-chip memory

— 32 Mbyte NAND flash memory

— 256 Kbit M24256 serial EEPROM

— SD connector to interface with the SD memory card in SPI mode

• Interfaces:

— 10/100/1000 BaseT Ethernet ports:

– eTSEC1, RGMII: five 10/100/1000 BaseT RJ-45 interfaces using Vitesse™VSC7385 L2

switch, orselectable one 10/100/1000BaseT RJ-45 interface using Marvell™88E1111 PHY

in REVC board

PowerQUICC™ MPC8313E Reference Design Board (RDB), Rev. 4

Freescale Semiconductor 3

MPC8313E RDB Hardware

– eTSEC2, selectable RGMII or SGMII: one 10/100/1000 BaseT RJ-45 interface using

Marvell 88E1111 PHY

— USB 2.0 port: high-speed host/device

— USB interface: selectable on-chip PHY or external ULPI PHY interface by SMSC USB3300

USB PHY

— PCI: 32-bit PCI interface running at up to 66 MHz

– One 32-bit 3.3 V PCI slot connected to PCI bus

– One 32-bit 3.3 V miniPCI slot connected to PCI bus

— Dual UART ports:

– DUART interface: supports two UARTs up to 115200 bps for console display

• Board connectors:

— LCD connectors by GPIO

— ATX power supply connector

— JTAG/COP for debugging

• IEEE Std. 1588™ signals for test and measurement

• Real-time clock and thermal sensor on I2C bus

• Programmable LEDs for debug use

• 6-layer PCB routing (4-layer signals, 2-layer power and ground)

PowerQUICC™ MPC8313E Reference Design Board (RDB), Rev. 4

4Freescale Semiconductor

MPC8313E RDB Hardware

Figure 1 shows the MPC8313E RDB block diagram.

Figure 1. MPC8313E RDB Block Diagram

MPC8313E

eTSEC1 Vitesse

L2 Switch

RGMII/

ULPI/ SMSC

USB PHY

IEEE1588

eTSEC2 Marvell

PHY

RGMII/SGMII

Clock, pulse, etc.

On-Chip

USB

Dual

UART

USB

mini-AB

USB

mini-AB

SPI SD card

33/66 MHz

3.3 V 32-Bit

PCI Slot

3.3 V 32-Bit

miniPCI Slot PCI Bus

System Clock

and USB Clock

128 Mbyte

DDR2

8 Mbyte NOR

Flash Memory

32-Bit DDR2

Bus

32 Mbyte NAND

Flash Memory

LEDs/status

Buffers

16-Bit Local

Bus

DAC for

IEEE1588

Clock (optional)

I2C Bus

Real-Time

Clock

Thermal

Sensor

GPIO

LCD

Connectors

JTAG/COP

Header JTAG/COP

Power Supply

with Low Power

Mode

Test

Points

: selected by resistor options

---NOTE---

EEPROM

Marvell

PHY

RGMII/SGMII

PowerQUICC™ MPC8313E Reference Design Board (RDB), Rev. 4

Freescale Semiconductor 5

MPC8313E RDB Hardware

1.2 Specifications

Table 1 lists the specifications of the MPC8313E RDB.

Table 1. MPC8313E-RDB Specifications

Characteristics Specifications

Power requirements (without add-on card): Typical Maximum

12 V DC 0A 0 A

5.0 V DC1 mA1.5 A

Communication processor MPC8313E running at 266 MHz

Addressing: Total address range

Flash memory (local bus)

DDR2 SDRAM

4 Gbyte (32 address lines)

8 Mbyte with one chip-select

128 Mbyte DDR2 SDRAM

Operating temperature 0o C to 70o C (room temperature)

Storage temperature –25oC to 85oC

Relative humidity 5% to 90% (noncondensing)

PCB dimensions:

Length

Width

Thickness

6693 mil (REVA and REVB) or 7692 mil (REVC)

6693 mil

62 mil

PowerQUICC™ MPC8313E Reference Design Board (RDB), Rev. 4

6Freescale Semiconductor

MPC8313E RDB Hardware

1.3 Mechanical Data

Figure 2 shows the MPC8313E RDB REVAx and REVB dimensions (in mil and [mm]). The board

measures 170 mm ×170 mm (6693 mil × 6693 mil) for integration in a mini-ITX chassis.

Figure 2. Dimensions of the MPC8313E RDB (REVAx and REVB)

PowerQUICC™ MPC8313E Reference Design Board (RDB), Rev. 4

Freescale Semiconductor 7

Board-Level Functions

Figure 3 shows the MPC8313E RDB Rev C dimensions (in mil and [mm]). The board measures

195 mm ×170 mm (7692 mil ×6693 mil).

Figure 3. Dimensions of the MPC8313E RDB (REVC)

2 Board-Level Functions

The board-level functions are reset, external interrupts, clock distribution, DDR SDRAM controller, local

bus controller, I2C interfaces, SD memory card interface, USB interface, eTSEC1 10/100/1000 BaseT

interface, dual RS-232 ports, PCI bus, and COP/JTAG.

PowerQUICC™ MPC8313E Reference Design Board (RDB), Rev. 4

8Freescale Semiconductor

Board-Level Functions

2.1 Reset and Reset Configurations

The MPC8313E RDB reset module generates a single reset to the MPC8313E and other peripherals on the

board. The reset unit provides power-on reset, hard reset, and soft reset signals in compliance with the

MPC8313E hardware specification.

Figure 4 shows the reset circuitry. Note the following:

• Hard reset is generated either by the COP/JTAG port or the MPC8313E.

• Power-on reset is generated by the Maxim MAX811 device. When MR is deasserted and 3.3 V is

ready, the MAX811 internal timeout guarantees a minimum reset active time of 150 ms before

PORESET is deasserted. This circuitry guarantees a 150 ms PORESET pulse width after 3.3 V

reaches the right voltage level, which meets the specification of the PORESET input of

MPC8313E.

• COP/JTAG port reset provides convenient hard-reset capability for a COP/JTAG controller. The

RESET line is available at the COP/JTAG port connector. The COP/JTAG controller can directly

generate the hard-reset signal by asserting this line low.

• Push button reset interfaces using the MR signal with debounce capability to produce a manual

master reset of the RDB.

• Soft reset is generated by the COP/JTAG port. Assertion of SRESET causes the MPC8313E to

abort all current internal and external transactions and set most registers to their default values.

Figure 4. Reset Circuitry of the MPC8313E

MAX811

3.3 V

Push Button

GND

HRESET from COP

SRESET from COP

TRST from COP

SRESET to MPC8313E

TRST to MPC8313E

PORESET to MPC8313E

NOR FLASH

L2 Switch

MPC8313E

Reset config logic

Marvell PHY

PowerQUICC™ MPC8313E Reference Design Board (RDB), Rev. 4

Freescale Semiconductor 9

Board-Level Functions

2.2 External Interrupts

Figure 5 shows the external interrupts to the MPC8313E.

Figure 5. MPC8313E Interrupts

The following are descriptions of the interrupt signals shown in Figure 5:

• All external interrupt signals are pulled up by 4.7 KΩ resistors.

•IRQ0is connected to SD Card

•IRQ1is connected to PCI slot INTA.

•IRQ2is connected to and shared by the PCI slot’s INTB and the mini PCI slot INTA.

•IRQ3is connected to the L2 switch as well as to an external USB PHY (by an optional resistor).

•IRQ4is connected to the Marvell GBE PHY as wellas toRTC and LM75 (by an optional resistors).

IRQ0

IRQ2

IRQ3

IRQ4

MPC8313E

SD Card

IRQ1

PCI slot (AD15) INTA

Mini PCI (AD14) INTA and PCI slot (AD15) INTB

L2 Switch and ULPI external USB PHY (optional)

Marvell PHY, RTC (optional) and LM75 (optional)

PowerQUICC™ MPC8313E Reference Design Board (RDB), Rev. 4

10 Freescale Semiconductor

Board-Level Functions

2.3 Clock Distribution

Figure 6 and Table 2 show the clock distribution on the MPC8313E RDB.

Figure 6. MPC8313E-RDB Clock Scheme

MPC8313E

LCLKx (NC)

local bus

PLL

DDR

PLL

PCI

DIV

66.666 MHz

OSC

CLKIN

33/66 MHz

Mini PCI Slot

PCI Slot

OCCR

PCI_SYNC_OUT

PCI_SYNC_IN

System

PLL

M66EN

33/66 MHz

CFG_CLKIN_DIV

48 MHz

OSC

25 MHz

OSC

USB

CLKIN

L2 Switch

GBE PHY GTX_CLK125

SD_REF_CLK

50 MHz OSC/

50 MHz VCXO

IEEE1588

TMR CLK

ULPI USB

GND GND

24 MHz

Crystal

PHY

Real-Time

GND GND

32.768 KHz

Crystal

Clock

DDR2 SDRAM

CLK

MCK

MCK#

133 MHz

PLL

125 MHz

LVDS

OSC

125MHz

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