EPOX EP-4BDM Manual de usuario

TRADEMARK

All products and company names are trademarks or registered

trademarks of their respective holders.

These specifications are subject to change without notice.

Manual Revision 1.1

March 04, 2002

User’User’

User’ss

ManualManual

Manual

A Pentium 4 Processor based AGPA Pentium 4 Processor based AGP

A Pentium 4 Processor based AGP

(4X) mainboard (100/133MHz)(4X) mainboard (100/133MHz)

(4X) mainboard (100/133MHz)

SupporSuppor

Supports PC1600/PC2100 Memorts PC1600/PC2100 Memor

ts PC1600/PC2100 Memorts PC1600/PC2100 Memor

ts PC1600/PC2100 Memoryy

ModulesModules

Modules (DDR Memor(DDR Memor

(DDR Memor(DDR Memor

(DDR Memory)y)

y)y)

60000024M+110

Table of Contents

Section 1 Introduction

Components Checklist.............................................. 1-1

Overview

System Overview ....................................................... 1-2

Chipset Components ................................................. 1-3

ntel Pentium 4 Processors ...................................... 1-4

Accelerated Graphics Port ....................................... 1-5

Utlra ATA66/100 ....................................................... 1-5

Hardware Monitoring................................................ 1-6

Bandiwdth Overview .................................................. 1-6

Mainboard Form-Factor............................................ 1-7

/O Shield Connector ................................................ 1-8

Power-On/Off (Remote) .......................................... 1-8

System Block Diagram ............................................. 1-9

Section 2 Features

Mainboard Features ................................................... 2-1

Section 3 Installation

Mainboard Detailed Layout ...................................... 3-2

Easy Installation Procedure

CPU nstallation ........................................................ 3-3

Jumper Settings ......................................................... 3-5

System Memory Configuration ................................ 3-6

Device Connectors.................................................... 3-8

External Modem Ring-in Power ON and

Keyboard Power ON Function (KBPO)................... 3-13

STR Function ............................................................. 3-15

845 Platform AGP Card 3.3V Protection ................ 3-17

Page

Section 4 Award BIOS Setup

Main Menu ................................................................ 4-1

Standard CMOS Setup ............................................... 4-3

Advanced B OS Features........................................... 4-7

Advanced Chipset Features ....................................... 4-11

ntegrated Peripherals ............................................... 4-14

Power Management Setup ........................................ 4-21

PNP/PC Configuration Setup .................................. 4-25

PC Health Status........................................................ 4-27

Frequency/Voltage Control ....................................... 4-29

Defaults Menu ........................................................... 4-31

Supervisor/User Password Setting ........................... 4-32

Exit Selecting ............................................................ 4-33

Section 5 Driver Installation

845 and Sound Driver nstallation ............................ 5-1

Appendi Appendi A

Avance Media Player Users Guide .......................... A-1

Appendi B

GHOST 5.1/6.03 Quick Users Guide (Optional) ... B-1

Appendi C

EEPROM BO S Remover ......................................... C-1

Appendi D

Update Your System B OS ........................................ D-1

Introduction

Page 1-1

Section 1

INTRODUCTION

Components Checklist

USERS

MANUAL

Package Contents

A. (1) Mainboard

B. (1) Users manual

C. (1) Floppy ribbon cable

D. (1) ATA-66 100 Hard drive ribbon

cable

E. (1) Driver and utility

Optional Item

F. (1) ATA-33 Hard drive ribbon

cable

G. (1) USB Cable

Introduction

Page 1-2

System Overview

This board is designed with Intel® 845 chipset. The Intel® 845 chipset includes

MCH(FW82845), ICH2(FW82801BA) and FWH three chips. The Intel® 845

chipset is the generation desktop chipset designed for Intels FC-PGA2 socket

478 package architecture and support the 4X capability of the AGP 2.0 Interface

Specification. A new chipset component interconnect, the hub interface, is

designed into the Intel® 845 chipset to provide more efficient communication

between chipset components.

Support of AGP 4X, 266MHz DDR SDRAM and the hub interface provides a

balanced system architecture for the Pentium® 4 in the Socket 478 architecture

processor minimizing bottlenecks and increasing system performance. By

increasing memory bandwidth to 2.128GB s through the use of AGP 4X, the

Intel® 845 chipset will deliver the data throughput necessary to take advantage of

the high performance provided by the powerful Pentium® 4 in the Socket 478

architecture processor.

The Intel® 845 chipset architecture removes the requirement for the ISA expan-

sion bus that was traditionally integrated into the I O subsystem of Intel chipsets.

This removes many of the conflicts experienced when installing hardware and

drivers into legacy ISA systems. The elimination of ISA will provide true plug-and

play for the Intel® 845 platform.

Intel® 845 chipset contains three core components: the Memory Controller Hub

(MCH), the I O Controller Hub (ICH) and the Firmware Hub (FWH). The MCH

integrates the data transfer rate of 400 533MHz, Pentium® 4 processor bus

controller, AGP 2.0 controller, 266MHz DDR SDRAM controller and a high-

speed hub interface for communication with the ICH2. The ICH2 integrates an

UltraATA 66 100 controller, USB host controller, LPC interface controller, FWH

interface controller, PCI interface controller, and a hub interface for communica-

tion with the MCH. The Intel® 845 chipset will provide the data buffering and

interface arbitration required to ensure that system interfaces operate efficiently

and provide the system bandwidth necessary to obtain peak performance the

Pentium® 4 in the Socket 478 architecture.

Introduction

Page 1-3

Chipset Components

The Intel® 845 chipset consists of the Memory Controller Hub (MCH), the I O

Controller Hub (ICH2) and the Firmware Hub (FWH).



Memory Controller Hub (MCH)

The MCH provides the interconnect between the DDR SDRAM and the system

logic. It integrates:

- Support for single processor with a data transfer rate of 400 533MHz.

- 200 266MHz DDR SDRAM interface supporting 2GB of DDR SDRAM.

- 2X, 4X, 1.5V AGP interface (Only support 1.5V on AGP interface).

- Downstream hub link for access to the ICH2.



I/O Controller Hub (ICH2)

The I O controller Hub provides the I O subsystem with access to the rest of

the system. Additionally, it integrates may I O functions. The ICH integrates:

- Upstream hub link for access to the MCH

- 2 Channel Ultra ATA 33 66 100 Bus Master IDE controller

- USB controller

- SMBus controller

- FWH interface

- LPC interface

- PCI 2.2 interface

- Integrated System Management Controller

- Integrated LAN Controller



Firmware Hub (FWH)

The FWH component is a key element to enabling a new security and manage-

ability infrastructure for the PC platform. The device operates under the FWH

interface and protocol. The hardware features of this device include a unique a

Random Number Generator (RNG), register-based locking, and hardware-

based locking.

Introduction

Page 1-4

Intel Pentium 4 processors

Formally known as the Willamette, the PentiumTM 4 is the next generation IA-32

processor from Intel. This next generation design is based upon a new micro-

architecture that brings higher clock speeds and performance than previous

processors could deliver. Among other advanced features the Pentium 4 offers

Streaming SIMD extensions 2, Advanced Dynamic Execution, Hyper Pipelined

Technology, and a data transfer rate of 400 533MHz system bus.

Streaming SIMD Extensions 2

Building upon the foundations of core features of their previous line of proces-

sors the Pentium III, this new version introduces Streaming SIMD Extensions 2

technology commonly referred to as SSE2. But what does this mean? SIMD stands

for Single Instruction Multiple Data. Usually, processors process one data

element in one instruction, called Single Instruction Single Data, or SISD. In

contrast, with Single Instruction Single Data (SISD), SIMD has the ability to

process more than one piece of data element during one instruction.

This technology is useful for 3D graphics applications that handle considerable

amounts of floating-point numbers. With SIMD applications such as 3D graphics

will be able to processor more data per instruction when equates to better

performance. This technology adds 144 new instructions to the CPU core that can

be used in a wide variety of applications. Software programmers can for example,

take advantage of these new instructions and write more optimized code that take

advantage of newer SIMD double-precision floating-point, integer, and cache

ability instructions. In theory this will enable better next generation services such

as Interactive Digital TV to be produced.

dvanced Dynamic Execution

Advanced Dynamic Execution describes the improved implementation and

abilities over the older P6 processor lines out-of-order decoupled super scalar

execution. Dynamic execution allows instructions to the processor to be executed

without the need to do so in order. The ability to do this can add a significant

performance increase versus ordered execution.

Hyper Pipelined Technology & 400/533MHz System Bus

Hyper Pipelined Technology doubles the pipeline depth the Pentium 4 delivers to

20 stages. This significantly increases the performance and frequency capabilities.

Pentium 4 also introduces a 400 533MHz system bus as opposed to the 100 and

Introduction

Page 1-5

133MHz bus seen in previous Pentium III processors. This allows 3.2Gbytes per

second of throughput while the Pentium III had a limited 1.06Gbyte s throughput.

Willamette will reportedly be introduced in the 0.18-micron using aluminum.

For more information about all the cool new features the Pentium 4 delivers

check out the Intel website at http://www.intel.com

Accelerated Graphics Port

(AGP or A.G.P.)

Typically, 3D graphics rendering requires a tremendous amount of memory, and

demands ever increasing throughput speed as well. As 3D products for the

personal computer become more and more popular, these demands will only

increase. This will cause a rise in costs for both end users and manufacturers.

Lowering these costs as well as improving performance is the primary motivation

behind AGP. By providing a massive increase in the bandwidth available between

the video card and the processor, it will assist in relieving some of these pressures

for quite sometime.

The board provides the AGP 2.0 interface. The AGP Interface Specification

revision 2.0 enhances the functionality of the original AGP Interface Specifica-

tion (revision 1.0) by allowing 4X data transfers (4 data samples per clock) and

1.5 volt (power supply) operation. The AGP 2.0 interface, along with SDRAM

memory technology, allows graphics controllers to access main memory at over

1GB s. In order to match the 2X and 4X AGP Card. The board used the Universal

AGP connector. (1.5 volt AGP Card supports only).

Ultra ATA/66/100

The ICH2 provides two channel Ultra ATA 66 100 Bus Master IDE controllers,

that support Ultra ATA 66 100 protocols, perfect for such demanding applications

as real-time video, multimedia, and high performance operating system. A new

IDE cable is required for Ultra ATA 66 100. This cable is an 80 conductor cable;

however the connectors are, of course, backwards compatible with ATA 33.

Introduction

Page 1-6

Hardware Monitoring

Hardware monitoring allows you to monitor various aspects of your systems

operations and status. The features include CPU temperature, voltage and RPM of

fan.

Bandwidth Overview

Table 1 provides a summary of the bandwidth requirements for the Intel® 845 chipset.

Table 1: Intel® 845 platform Bandwidth Summary

ecafretnI deepSkcolC

)zHM(

rePselpmaS

kcolC

etaRataD

)s/selpmas-ageM(

htdiWataD

)setB(

htdiwdnaB

)s/BM(

suBUPC 331/0014 335/0048 4624/0023

RDD

MARDS 331/0012 662/0028 8212/0061

0.2PGA 6.664 6624 6601

kniLbuH 6.664 6621662

2.2ICP 3.3313.334 331

Este manual sirve para los siguientes modelos

Tabla de contenidos

Otros manuales de Placa madre de EPOX

Manuales populares de Placa madre de otras marcas

DFI

DFI SD170 Manual de usuario

ASROCK

ASROCK ROMED8-2T Manual de usuario

Asus

Asus P2L97A Manual de usuario

Winmate

Winmate IC70 Manual de usuario

Asus

Asus MES-B Manual de usuario

Grantech

Grantech SYS8F377VGGA-3OMN Manual de usuario

Telit Wireless Solutions

Telit Wireless Solutions SL869-3DR Manual de usuario

Gigabyte

Gigabyte GA-9IVDT Manual de usuario

Texas Instruments

Texas Instruments ADS8372EVM Manual de usuario

Commell

Commell MS-C73 Manual de usuario

IBT Technologies

IBT Technologies MB860 Manual de usuario

Nvidia

Nvidia TEGRA DG-04927-001_V01 Manual de usuario

Biostar

Biostar M7VIT Bravo Instrucciones de funcionamiento e instalación

Intel

Intel D33217CK Manual de usuario

Asus

Asus F1A55-M LX PLUS R2.0 Manual de usuario

EPC

EPC EPC9147C Manual de usuario

Asus

Asus EX-B760M-V5 D4 Manual de usuario

Ski-Doo

Ski-Doo Bombardier MPEM 219 700 090 Manual de usuario