EPOX EP-4BDM Manual de usuario
TRADEMARK
All products and company names are trademarks or registered
trademarks of their respective holders.
These specifications are subject to change without notice.
Manual Revision 1.1
March 04, 2002
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A Pentium 4 Processor based AGPA Pentium 4 Processor based AGP
A Pentium 4 Processor based AGPA Pentium 4 Processor based AGP
A Pentium 4 Processor based AGP
(4X) mainboard (100/133MHz)(4X) mainboard (100/133MHz)
(4X) mainboard (100/133MHz)(4X) mainboard (100/133MHz)
(4X) mainboard (100/133MHz)
SupporSuppor
SupporSuppor
Supports PC1600/PC2100 Memorts PC1600/PC2100 Memor
ts PC1600/PC2100 Memorts PC1600/PC2100 Memor
ts PC1600/PC2100 Memoryy
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ModulesModules
ModulesModules
Modules (DDR Memor(DDR Memor
(DDR Memor(DDR Memor
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Table of Contents
Section 1 Introduction
Components Checklist.............................................. 1-1
Overview
System Overview ....................................................... 1-2
Chipset Components ................................................. 1-3
ntel Pentium 4 Processors ...................................... 1-4
Accelerated Graphics Port ....................................... 1-5
Utlra ATA66/100 ....................................................... 1-5
Hardware Monitoring................................................ 1-6
Bandiwdth Overview .................................................. 1-6
Mainboard Form-Factor............................................ 1-7
/O Shield Connector ................................................ 1-8
Power-On/Off (Remote) .......................................... 1-8
System Block Diagram ............................................. 1-9
Section 2 Features
Mainboard Features ................................................... 2-1
Section 3 Installation
Mainboard Detailed Layout ...................................... 3-2
Easy Installation Procedure
CPU nstallation ........................................................ 3-3
Jumper Settings ......................................................... 3-5
System Memory Configuration ................................ 3-6
Device Connectors.................................................... 3-8
External Modem Ring-in Power ON and
Keyboard Power ON Function (KBPO)................... 3-13
STR Function ............................................................. 3-15
845 Platform AGP Card 3.3V Protection ................ 3-17
Page
Section 4 Award BIOS Setup
Main Menu ................................................................ 4-1
Standard CMOS Setup ............................................... 4-3
Advanced B OS Features........................................... 4-7
Advanced Chipset Features ....................................... 4-11
ntegrated Peripherals ............................................... 4-14
Power Management Setup ........................................ 4-21
PNP/PC Configuration Setup .................................. 4-25
PC Health Status........................................................ 4-27
Frequency/Voltage Control ....................................... 4-29
Defaults Menu ........................................................... 4-31
Supervisor/User Password Setting ........................... 4-32
Exit Selecting ............................................................ 4-33
Section 5 Driver Installation
845 and Sound Driver nstallation ............................ 5-1
Appendi Appendi A
Avance Media Player Users Guide .......................... A-1
Appendi B
GHOST 5.1/6.03 Quick Users Guide (Optional) ... B-1
Appendi C
EEPROM BO S Remover ......................................... C-1
Appendi D
Update Your System B OS ........................................ D-1
Introduction
Page 1-1
Section 1
INTRODUCTION
Components Checklist
B
A
C
D
USERS
MANUAL
Package Contents
A. (1) Mainboard
B. (1) Users manual
C. (1) Floppy ribbon cable
D. (1) ATA-66 100 Hard drive ribbon
cable
E. (1) Driver and utility
Optional Item
F. (1) ATA-33 Hard drive ribbon
cable
G. (1) USB Cable
E
or
G
F
Introduction
Page 1-2
System Overview
This board is designed with Intel® 845 chipset. The Intel® 845 chipset includes
MCH(FW82845), ICH2(FW82801BA) and FWH three chips. The Intel® 845
chipset is the generation desktop chipset designed for Intels FC-PGA2 socket
478 package architecture and support the 4X capability of the AGP 2.0 Interface
Specification. A new chipset component interconnect, the hub interface, is
designed into the Intel® 845 chipset to provide more efficient communication
between chipset components.
Support of AGP 4X, 266MHz DDR SDRAM and the hub interface provides a
balanced system architecture for the Pentium® 4 in the Socket 478 architecture
processor minimizing bottlenecks and increasing system performance. By
increasing memory bandwidth to 2.128GB s through the use of AGP 4X, the
Intel® 845 chipset will deliver the data throughput necessary to take advantage of
the high performance provided by the powerful Pentium® 4 in the Socket 478
architecture processor.
The Intel® 845 chipset architecture removes the requirement for the ISA expan-
sion bus that was traditionally integrated into the I O subsystem of Intel chipsets.
This removes many of the conflicts experienced when installing hardware and
drivers into legacy ISA systems. The elimination of ISA will provide true plug-and
play for the Intel® 845 platform.
Intel® 845 chipset contains three core components: the Memory Controller Hub
(MCH), the I O Controller Hub (ICH) and the Firmware Hub (FWH). The MCH
integrates the data transfer rate of 400 533MHz, Pentium® 4 processor bus
controller, AGP 2.0 controller, 266MHz DDR SDRAM controller and a high-
speed hub interface for communication with the ICH2. The ICH2 integrates an
UltraATA 66 100 controller, USB host controller, LPC interface controller, FWH
interface controller, PCI interface controller, and a hub interface for communica-
tion with the MCH. The Intel® 845 chipset will provide the data buffering and
interface arbitration required to ensure that system interfaces operate efficiently
and provide the system bandwidth necessary to obtain peak performance the
Pentium® 4 in the Socket 478 architecture.
Introduction
Page 1-3
Chipset Components
The Intel® 845 chipset consists of the Memory Controller Hub (MCH), the I O
Controller Hub (ICH2) and the Firmware Hub (FWH).
Memory Controller Hub (MCH)
The MCH provides the interconnect between the DDR SDRAM and the system
logic. It integrates:
- Support for single processor with a data transfer rate of 400 533MHz.
- 200 266MHz DDR SDRAM interface supporting 2GB of DDR SDRAM.
- 2X, 4X, 1.5V AGP interface (Only support 1.5V on AGP interface).
- Downstream hub link for access to the ICH2.
I/O Controller Hub (ICH2)
The I O controller Hub provides the I O subsystem with access to the rest of
the system. Additionally, it integrates may I O functions. The ICH integrates:
- Upstream hub link for access to the MCH
- 2 Channel Ultra ATA 33 66 100 Bus Master IDE controller
- USB controller
- SMBus controller
- FWH interface
- LPC interface
- PCI 2.2 interface
- Integrated System Management Controller
- Integrated LAN Controller
Firmware Hub (FWH)
The FWH component is a key element to enabling a new security and manage-
ability infrastructure for the PC platform. The device operates under the FWH
interface and protocol. The hardware features of this device include a unique a
Random Number Generator (RNG), register-based locking, and hardware-
based locking.
Introduction
Page 1-4
Intel Pentium 4 processors
Formally known as the Willamette, the PentiumTM 4 is the next generation IA-32
processor from Intel. This next generation design is based upon a new micro-
architecture that brings higher clock speeds and performance than previous
processors could deliver. Among other advanced features the Pentium 4 offers
Streaming SIMD extensions 2, Advanced Dynamic Execution, Hyper Pipelined
Technology, and a data transfer rate of 400 533MHz system bus.
Streaming SIMD Extensions 2
Building upon the foundations of core features of their previous line of proces-
sors the Pentium III, this new version introduces Streaming SIMD Extensions 2
technology commonly referred to as SSE2. But what does this mean? SIMD stands
for Single Instruction Multiple Data. Usually, processors process one data
element in one instruction, called Single Instruction Single Data, or SISD. In
contrast, with Single Instruction Single Data (SISD), SIMD has the ability to
process more than one piece of data element during one instruction.
This technology is useful for 3D graphics applications that handle considerable
amounts of floating-point numbers. With SIMD applications such as 3D graphics
will be able to processor more data per instruction when equates to better
performance. This technology adds 144 new instructions to the CPU core that can
be used in a wide variety of applications. Software programmers can for example,
take advantage of these new instructions and write more optimized code that take
advantage of newer SIMD double-precision floating-point, integer, and cache
ability instructions. In theory this will enable better next generation services such
as Interactive Digital TV to be produced.
dvanced Dynamic Execution
Advanced Dynamic Execution describes the improved implementation and
abilities over the older P6 processor lines out-of-order decoupled super scalar
execution. Dynamic execution allows instructions to the processor to be executed
without the need to do so in order. The ability to do this can add a significant
performance increase versus ordered execution.
Hyper Pipelined Technology & 400/533MHz System Bus
Hyper Pipelined Technology doubles the pipeline depth the Pentium 4 delivers to
20 stages. This significantly increases the performance and frequency capabilities.
Pentium 4 also introduces a 400 533MHz system bus as opposed to the 100 and
Introduction
Page 1-5
133MHz bus seen in previous Pentium III processors. This allows 3.2Gbytes per
second of throughput while the Pentium III had a limited 1.06Gbyte s throughput.
Willamette will reportedly be introduced in the 0.18-micron using aluminum.
For more information about all the cool new features the Pentium 4 delivers
check out the Intel website at http://www.intel.com
Accelerated Graphics Port
(AGP or A.G.P.)
Typically, 3D graphics rendering requires a tremendous amount of memory, and
demands ever increasing throughput speed as well. As 3D products for the
personal computer become more and more popular, these demands will only
increase. This will cause a rise in costs for both end users and manufacturers.
Lowering these costs as well as improving performance is the primary motivation
behind AGP. By providing a massive increase in the bandwidth available between
the video card and the processor, it will assist in relieving some of these pressures
for quite sometime.
The board provides the AGP 2.0 interface. The AGP Interface Specification
revision 2.0 enhances the functionality of the original AGP Interface Specifica-
tion (revision 1.0) by allowing 4X data transfers (4 data samples per clock) and
1.5 volt (power supply) operation. The AGP 2.0 interface, along with SDRAM
memory technology, allows graphics controllers to access main memory at over
1GB s. In order to match the 2X and 4X AGP Card. The board used the Universal
AGP connector. (1.5 volt AGP Card supports only).
Ultra ATA/66/100
The ICH2 provides two channel Ultra ATA 66 100 Bus Master IDE controllers,
that support Ultra ATA 66 100 protocols, perfect for such demanding applications
as real-time video, multimedia, and high performance operating system. A new
IDE cable is required for Ultra ATA 66 100. This cable is an 80 conductor cable;
however the connectors are, of course, backwards compatible with ATA 33.
Introduction
Page 1-6
Hardware Monitoring
Hardware monitoring allows you to monitor various aspects of your systems
operations and status. The features include CPU temperature, voltage and RPM of
fan.
Bandwidth Overview
Table 1 provides a summary of the bandwidth requirements for the Intel® 845 chipset.
Table 1: Intel® 845 platform Bandwidth Summary
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