Ebyte E19 Series Manual de usuario

E19-915M30S User Manual

SX1276 915MHz 1W SMD Wireless Module

Chengdu Ebyte Electronic Technology Co., Ltd. E19-915M30S User Manual

Contents

Disclaimer.............................................................................................................................................................................. 2

1. Overview............................................................................................................................................................................ 3

1.1 Brief introduction......................................................................................................................................................3

1.2 Features.....................................................................................................................................................................3

2.Specification and parameter............................................................................................................................................. 4

2.1 Limit parameter.........................................................................................................................................................4

2.2 Operating parameter................................................................................................................................................. 4

3.Size and pin definition....................................................................................................................................................... 5

4. Basic operation..................................................................................................................................................................6

4.1 Hardware design....................................................................................................................................................... 6

4.2 Software editing........................................................................................................................................................7

5.Basic application..........................................................................................................................................................8

5.1 Basic circuit diagram................................................................................................................................................ 8

6.FAQ..................................................................................................................................................................................... 8

6.1 Communication range is too short............................................................................................................................ 8

6.2 Module is easy to damage.........................................................................................................................................9

6.3 BER(Bit Error Rate) is high......................................................................................................................................9

7.Production guidance.......................................................................................................................................................... 9

7.1 Reflow soldering temperature...................................................................................................................................9

7.2 Reflow soldering curve...........................................................................................................................................10

8.E19 Series..........................................................................................................................................................................10

9.Antenna guidance............................................................................................................................................................ 11

9.1 Antenna recommendation....................................................................................................................................... 11

10. Package for batch order............................................................................................................................................... 12

Revision history...................................................................................................................................................................12

About us............................................................................................................................................................................... 12

Chengdu Ebyte Electronic Technology Co., Ltd. E19-915M30S User Manual

Disclaimer

EBYTE reserves all rights to this document and the information contained herein.

Products, names, logos and designs described herein may in whole or in part be

subject to intellectual property rights. Reproduction, use, modification or disclosure to

third parties of this document or any part thereof without the express permission of

EBYTE is strictly prohibited.

The information contained herein is provided “as is” and EBYTE assumes no

liability for the use of the information. No warranty, either express or implied, is given,

including but not limited, with respect to the accuracy, correctness, reliability and

fitness for a particular purpose of the information. This document may be revised by

EBYTE at any time. For most recent documents, visit www.ebyte.com.

Chengdu Ebyte Electronic Technology Co., Ltd. E19-915M30S User Manual

1. Overview

1.1 Brief introduction

E19-915M30S is 1W SMD wireless module working at 915MHz, developed based on chip SX1276 from Semtech.

Due to the use of the imported SX1276 as the core of the module,

with PA and LNA its sensitivity and stability are largely improved when

tx power is 1W.Compared with the FSK 、GFSK products, it has made

great progress in anti-interference ability and communication distance.

The module is aimed at smart home, wireless meter reading, scientific

research and medical, and medium and long distance wireless

communication equipment. Since RF performance and component

selection are in accordance with industrial standards, and the product has

obtained FCC, CE, RoHS and other international authoritative

certification reports, users do not need to worry about its performance.

High precision 32MHz crystal is used.

Since the module is a pure RF transceiver module, you need to use the MCU driver or a dedicated SPI debug tool.

1.2 Features

Communication distance tested is up to 10km；

Maximum transmission power of 1W, software multi-level adjustable；

Support the global license-free ISM 915MHz band；

Support air date rate of 0.018kbps~37.5kbp in LoRaTM；

The maximum data transmission rate 300kpbs in FSK mode；

Support multiple modulation methods, LoRaTM /FSK/GFSK/MSK/GMSK/OOK；

Large capacity FIFO, supports 256Byte data buffer；

Support 2.5V~5.5V power supply, power supply over 5.0V can guarantee the best performance；

Industrial grade standard design, support -40 ~ 85 °C for working over a long time；

IPEX and Stamp hole, good for secondary development and integration.

1.3 Application

Home security alarm and remote keyless entry；

Smart home and industrial sensors；

Wireless alarm security system；

Building automation solutions；

Wireless industrial-grade remote control；

Health care products；

Advanced Meter Reading Architecture(AMI)；

Automotive industry applications.

Chengdu Ebyte Electronic Technology Co., Ltd. E19-915M30S User Manual

2.Specification and parameter

2.1 Limit parameter

Main parameter

Performance

Remark

Min.

Max.

Power supply（V）

5.5

Voltage over 5.5V will cause permanent

damage to module

Blocking power（dBm）

Chances of burn is slim when modules are

used in short distance

Operating temperature（℃）

-40

2.2 Operating parameter

Main parameter

Performance

Remark

Min.

Typ.

Max.

Operating voltage（V）

3.3

5.0

5.5

≥5.0 V ensures output power

Communication level（V）

3.3

For 5V TTL, it may be at risk of burning

down

Operating temperature（℃）

-40

Industrial design

Operating frequency（MHz）

900

915

931

Support ISM band

Power

consumpti

TX current（mA）

630

Instant power consumption

RX current（mA）

Sleep current （μA）

3.0

Software is shut down

Max Tx power（dBm）

28.5

Receiving sensitivity（dBm）

-146

-148

-150

Sensitivity test conditions：

air data rate: 0.3 kbps, Coding rate 4/5,

Spread Spectrum Factor 12.

Air data rate（bps）

1.2

300

Kbps

FSK

0.018

37.5

Kbps

LoRaTM

Main parameter

Description

Remark

Distance for reference

10000m

Test condition：clear and open area, antenna gain: 5dBi，

antenna height: 2.5m，air data rate: 0.3kbps

FIFO

256Byte

Max length transmitted each time

Crystal frequency

32MHz

Modulation

LoRaTM (recommended)

FSK/GFSK/MSK/GMSK/OOK

Package

SMD

Connector

1.27mm

Communication interface

SPI

0-10Mbps

Size

25.0*40.0 mm

Antenna

Stamp hole/IPX

50 ohm impedance

Chengdu Ebyte Electronic Technology Co., Ltd. E19-915M30S User Manual

3.Size and pin definition

Pin No

Pin item

Pin direction

Pin application

GND

Ground electrode, connected to the power reference ground

DIO5

Input/Output

Configurable IO port（Please find more on SX1276 datasheet）

DIO4

Input/Output

Configurable IO port（Please find more on SX1276 datasheet）

DIO3

Input/Output

Configurable IO port（Please find more on SX1276 datasheet）

DIO2

Input/Output

Configurable IO port（Please find more on SX1276 datasheet）

DIO1

Input/Output

Configurable IO port（Please find more on SX1276 datasheet）

DIO0

Input/Output

Configurable IO port（Please find more on SX1276 datasheet）

RST

Input

Reset

GND

Ground electrode, connected to the power reference ground.

GND

Ground electrode, connected to the power reference ground.

VCC

Power supply: 4.75~5.5V (Ceramic filter capacitoris advised to add)

Chengdu Ebyte Electronic Technology Co., Ltd. E19-915M30S User Manual

SCK

Input

SPI clock

MISO

Output

SPI clock

MOSI

Input

SPI clock

NSS

Input

Chip select

TXEN

Input

Radio frequency switch control, make sure the TXEN pinis in high level, RXEN pin is

in low level when transmitting.

RXEN

Input

Radio frequency switch control, make sure the TXEN pinis in high level, RXEN pin is

in low level when transmitting

GND

Ground electrode, connected to the power reference ground

ANT

Antenna

GND

Ground electrode, connected to the power reference ground

GND

Ground electrode, connected to the power reference ground

GND

Ground electrode, connected to the power reference ground

4. Basic operation

4.1 Hardware design

It is recommended to use a DC stabilized power supply. The power supply ripple factor is as small as possible, and

the module needs to be reliably grounded.；

Please pay attention to the correct connection of the positive and negative poles of the power supply. Reverse

connection may cause permanent damage to the module；

Please check the power supply to ensure it is within the recommended voltage otherwise when it exceeds the

maximum value the module will be permanently damaged；

Please check the stability of the power supply, the voltage can not be fluctuated frequently；

When designing the power supply circuit for the module, it is often recommended to reserve more than 30% of the

margin, so the whole machine is beneficial for long-term stable operation.；

The module should be as far away as possible from the power supply, transformers, high-frequency wiring and other

parts with large electromagnetic interference.；

High-frequency digital routing, high-frequency analog routing, and power routing must be avoided under the

module. If it is necessary to pass through the module, assume that the module is soldered to the Top Layer, and the

copper is spread on the Top Layer of the module contact part(well grounded), it must be close to the digital part of

the module and routed in the Bottom Layer；

Assuming the module is soldered or placed over the Top Layer, it is wrong to randomly route over the Bottom Layer

or other layers, which will affect the module's spurs and receiving sensitivity to varying degrees；

It is assumed that there are devices with large electromagnetic interference around the module that will greatly

affect the performance. It is recommended to keep them away from the module according to the strength of the

interference. If necessary, appropriate isolation and shielding can be done；

Assume that there are traces with large electromagnetic interference (high-frequency digital, high-frequency analog,

power traces) around the module that will greatly affect the performance of the module. It is recommended to stay

away from the module according to the strength of the interference.If necessary, appropriate isolation and shielding

Chengdu Ebyte Electronic Technology Co., Ltd. E19-915M30S User Manual

can be done.

If the communication line uses a 5V level, a 1k-5.1k resistor must be connected in series (not recommended, there is

still a risk of damage)；

Try to stay away from some physical layers such as TTL protocol at 2.4GHz , for example: USB3.0；

The mounting structure of antenna has a great influence on the performance of the module. It is necessary to ensure

that the antenna is exposed, preferably vertically upward. When the module is mounted inside the case, use a good

antenna extension cable to extend the antenna to the outside；

The antenna must not be installed inside the metal case, which will cause the transmission distance to be greatly

weakened.

4.2 Software editing

SX1278/SX1276+PA+LNA，same drive way as SX1278/SX1276，user can refer to SX1278/SX1276 datasheet.

DIO0、DIO1、DIO2、DIO3、DIO4、DIO5 are configurable I/O ports for various application，see more in SX1276

datasheet. It can be floated when not used.

RST、TXEN、RXEN must be connected,among which RST control chip reset，TXEN, RXEN are for controlling RF

switch.

Make it ground well with large space for grounding and small power ripple. Filter capacitor is necessary and make

sure it is close to pin VCC and GND.

SPI communication rate should not be set too high, usually around 1Mbps.

In transmitting，set TXEN as high communication level，RXEN pin is low level; In receiving, set RXEN as high

communication level,TXEN is low level; Before powering off, set TXEN、RXEN as low level.

Re-initialize register configuration when the chip is idle for higher stability.

Chengdu Ebyte Electronic Technology Co., Ltd. E19-915M30S User Manual

5.Basic application

5.1 Basic circuit diagram

6.FAQ

6.1 Communication range is too short

The communication distance will be affected when obstacle exists.

Data lose rate will be affected by temperature, humidity and co-channel interference.

The ground will absorb and reflect wireless radio wave, so the performance will be poor when testing near ground.

Sea water has great ability in absorbing wireless radio wave, so performance will be poor when testing near the sea.

The signal will be affected when the antenna is near metal object or put in a metal case.

Power register was set incorrectly, air data rate is set as too high (the higher the air data rate, the shorter the

distance).

The power supply low voltage under room temperature is lower than 2.5V, the lower the voltage, the lower the

transmitting power.

Due to antenna quality or poor matching between antenna and module.

Chengdu Ebyte Electronic Technology Co., Ltd. E19-915M30S User Manual

6.2 Module is easy to damage

Please check the power supply source, ensure it is 2.0V~3.6V, voltage higher than 3.6V will damage the module.

Please check the stability of power source, the voltage cannot fluctuate too much.

Please make sure antistatic measure are taken when installing and using, high frequency devices have electrostatic

susceptibility.

Please ensure the humidity is within limited range, some parts are sensitive to humidity.

Please avoid using modules under too high or too low temperature.

6.3 BER(Bit Error Rate) is high

There are co-channel signal interference nearby, please be away from interference sources or modify frequency and

channel to avoid interference;

Poor power supply may cause messy code. Make sure that the power supply is reliable.

The extension line and feeder quality are poor or too long, so the bit error rate is high;

7.Production guidance

7.1 Reflow soldering temperature

Profile Feature

Curve characteristics

Sn-Pb Assembly

Pb-Free Assembly

Solder Paste

Solder paste

Sn63/Pb37

Sn96.5/Ag3/Cu0.5

Preheat Temperature min （Tsmin）

Min preheating temp.

100℃

150℃

Preheat temperature max (Tsmax)

Mx preheating temp.

150℃

200℃

Preheat Time (Tsmin to Tsmax)(ts)

Preheating time

60-120 sec

Average ramp-up rate(Tsmax to Tp)

Average ramp-up rate

3℃/second max

Liquidous Temperature (TL)

Liquid phase temp.

183℃

217℃

Time（tL）Maintained Above（TL）

Time below liquid phase line

60-90 sec

30-90 sec

Peak temperature（Tp）

Peak temp.

220-235℃

230-250℃

Aveage ramp-down rate（Tp to

Tsmax）

Aveage ramp-down rate

6℃/second max

Time 25℃ to peak temperature

Time to peak temperature for

25℃

max 6 minutes

max 8 minutes

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