Ebyte E01C-ML01SP2 Manual de usuario

E01C-ML01SP2 User Manual

SI24R1+ 2.4GHz 100mW SPI SMD wireless module

Chengdu Ebyte Electronic Technology Co.,Ltd. E01C-ML01SP2 User Manual

Contents

Disclaimer...............................................................................................................................................................................2

Chapter1. Overview................................................................................................................................................................ 3

1.1 Brief introduction......................................................................................................................................................3

1.2 Features.....................................................................................................................................................................3

1.3 Application................................................................................................................................................................3

Chapter2. Specifications......................................................................................................................................................... 4

2.1 Limit parameter .......................................................................................................................................................4

2.2 Operating parameter.............................................................................................................................................. 4

Chapter3. Size and pin definition.......................................................................................................................................... 5

Chapter4. Basic operation.......................................................................................................................................................6

4.1 Hardware design....................................................................................................................................................... 6

4.2 Software editing........................................................................................................................................................7

Chapter5. Circuit diagram.......................................................................................................................................................8

Chapter6. FAQ........................................................................................................................................................................ 8

6.1 Communication range is too short............................................................................................................................ 8

6.2 Module is easy to damage.........................................................................................................................................8

6.3 BER(Bit Error Rate) is high...................................................................................................................................9

Chapter7. Soldering guidance.................................................................................................................................................9

7.1 Reflow soldering temperature...................................................................................................................................9

7.2 Reflow soldering curve...........................................................................................................................................10

Chapter8. Related models..................................................................................................................................................... 10

Chapter9. Antenna Guide......................................................................................................................................................10

Chapter10. Antenna selection............................................................................................................................................... 11

Chapter11. Bulk packaging...................................................................................................................................................12

Revision history.................................................................................................................................................................... 12

About us................................................................................................................................................................................13

Chengdu Ebyte Electronic Technology Co.,Ltd. E01C-ML01SP2 User Manual

Disclaimer

EBYTE reserves all rights to this document and the information contained herein.

Products, names, logos and designs described herein may in whole or in part be

subject to intellectual property rights. Reproduction, use, modification or disclosure to

third parties of this document or any part thereof without the express permission of

EBYTE is strictly prohibited.

The information contained herein is provided “as is” and EBYTE assumes no

liability for the use of the information. No warranty, either express or implied, is given,

including but not limited, with respect to the accuracy, correctness, reliability and

fitness for a particular purpose of the information. This document may be revised by

EBYTE at any time. For most recent documents, visit www.ebyte.com.

Chengdu Ebyte Electronic Technology Co.,Ltd. E01C-ML01SP2 User Manual

Chapter1. Overview

1.1 Brief introduction

E01C-ML01SP2 is a small size, self-contained PCB antenna and a 2.4GHz patch

type wireless module with a maximum transmission power of 100mW based on the

domestic SI24R1.

Built-in power amplifier (PA) and low noise amplifier (LNA) on the original basis,

so that the maximum transmission power reaches 100mW, while the receiving

sensitivity is further improved, and the overall communication stability is less than

there is no power amplifier and low noise amplifier The products have been greatly

improved.

This product has obtained FCC, CE, RoHS and other authoritative certification reports at home and abroad, and uses

industrial-grade high-precision 16MHz crystal oscillator.

Since E01C-ML01SP2 is a pure radio frequency transceiver module, it needs to use MCU driver or use a dedicated SPI

debugging tool.

1.2 Features

Ultra-small size, only 12.8x25mm;

RFX2401C power amplifier scheme, the maximum transmission power is 100mW, and the software is multi-level

adjustable;

Under ideal conditions, the communication distance can reach 1.8km;

At the same time, it has PCB onboard antenna and IPX interface, users can choose to use according to their own

needs;

Professional radio frequency shield, anti-interference and anti-static;

Support the global license-free ISM 2.4GHz frequency band;

Support 2Mbps, 1Mbps and 250kbps air rate;

125 communication channels to meet application requirements such as multipoint communication, grouping, and

frequency hopping;

Connect with MCU through SPI interface, rate 0～10Mbps;

Support 2.0～3.6V power supply, power supply greater than 3.3V can guarantee the best performance;

Industrial standard design, support -40～+85℃ long time use；

1.3 Application

Wearable device;

Smart home and industrial sensors, etc.;

Security system, positioning system;

Wireless remote control, UAV;

Wireless game remote control;

Chengdu Ebyte Electronic Technology Co.,Ltd. E01C-ML01SP2 User Manual

Healthcare products;

Wireless voice, wireless headset;

Automotive industry applications.

Chapter2. Specifications

2.1 Limit parameter

Main parameter

Performance

备注

Min.

Max.

Power supply（V）

3.6

Voltage over 3.6V will cause permanent damage

to module

Blocking power（dBm）

Chances of burn is slim when modules are used

in short distance

Operating temperature（℃）

-40

Industrial grade

2.2 Operating parameter

Main parameter

Performance

Remark

Min.

Typ.

Max.

Operating voltage（V）

2.0

3.3

3.6

≥3.3V ensures output power

Communication level（V）

3.3

For 5V TTL, it may be at risk of burning

down

Operating temperature（℃）

-40

Industrial design

Operating frequency（GHz）

2.4

2.525

Support ISM band

Power

consumptio

Tx current

120

Instantaneous power consumption

Rx current

28.5

Sleep current(μA)

Software is shut down

Max Tx power（dBm）

19.7

20.2

Receiving sensitivity（dBm）

-96.5

-96

-97.5

Air data rate is 250kbps

Air data rate（bps）

250k

Controlled via user’s programming

Main parameter

Description

Remark

Reference distance

1800m

Test condition：clear and open area, antenna gain: 5dBi，antenna

height: 2.5m，air data rate: 250kbps

FIFO

32Byte

Max length transmitted each time

Crystal frequency

16MHz

Chengdu Ebyte Electronic Technology Co.,Ltd. E01C-ML01SP2 User Manual

Modulation

GFSK

Package

SMD

Connector

1.27mm pin header

Communication interface

SPI

0～10Mbps

Size

12.8 * 25mm

With out SMA

Antenna

PCB/IPEX

The factory default PCB antenna, the equivalent impedance is about

50Ω

Chapter3. Size and pin definition

Pin No.

Pin item

Pin direction

Pin application

VCC

The power supply must be between 2.0～3.6V

Input

Module control pin

CSN

Input

Module chip select pin, used to start a SPI communication

Chengdu Ebyte Electronic Technology Co.,Ltd. E01C-ML01SP2 User Manual

SCK

Input

Module SPI bus clock

MOSI

Input

Module SPI data input pin

MISO

Output

Module SPI data output pin

IRQ

Output

Module terminal signal output, active low

GND

Ground wire, connected to the power reference ground

GND

Ground wire, connected to the power reference ground

GND

Ground wire, connected to the power reference ground

Chapter4. Basic operation

4.1 Hardware design

It is recommended to use a DC stabilized power supply. The power supply ripple factor is as small as possible, and

the module needs to be reliably grounded；

Please pay attention to the correct connection of the positive and negative poles of the power supply. Reverse

connection may cause permanent damage to the module；

Please check the power supply to ensure it is within the recommended voltage otherwise when it exceeds the

maximum value the module will be permanently damaged;

Please check the stability of the power supply, the voltage can not be fluctuated frequently；

When designing the power supply circuit for the module, it is often recommended to reserve more than 30% of the

margin, so the whole machine is beneficial for long-term stable operation;

The module should be as far away as possible from the power supply, transformers, high-frequency wiring and other

parts with large electromagnetic interference;

High-frequency digital routing, high-frequency analog routing, and power routing must be avoided under the

module. If it is necessary to pass through the module, assume that the module is soldered to the Top Layer, and the

copper is spread on the Top Layer of the module contact part(well grounded), it must be close to the digital part of

the module and routed in the Bottom Layer；

Assuming the module is soldered or placed over the Top Layer, it is wrong to randomly route over the Bottom Layer

or other layers, which will affect the module's spurs and receiving sensitivity to varying degrees；

It is assumed that there are devices with large electromagnetic interference around the module that will greatly

affect the performance. It is recommended to keep them away from the module according to the strength of the

interference. If necessary, appropriate isolation and shielding can be done；

Assume that there are traces with large electromagnetic interference (high-frequency digital, high-frequency analog,

power traces) around the module that will greatly affect the performance of the module. It is recommended to stay

away from the module according to the strength of the interference. If necessary, appropriate isolation and shielding

can be done.

If the communication line uses a 5V level, a 1k-5.1k resistor must be connected in series (not recommended, there is

still a risk of damage)；

Try to stay away from some physical layers such as TTL protocol at 2.4GHz , for example: USB3.0；

The mounting structure of antenna has a great influence on the performance of the module. It is necessary to ensure

that the antenna is exposed, preferably vertically upward. When the module is mounted inside the case, use a good

antenna extension cable to extend the antenna to the outside；

Chengdu Ebyte Electronic Technology Co.,Ltd. E01C-ML01SP2 User Manual

The antenna must not be installed inside the metal case, which will cause the transmission distance to be greatly

weakened.

Conductors or other sources of interference should be avoided around the onboard PCB antenna.

4.2 Software editing

The drive mode of this module SI24R1+PA+LNA is completely equivalent to SI24R1, and users can operate

according to the SI24R1 chip manual (see SI24R1 manual for details);

Power bin:

SI24R1 register setting table:

Address(Hex)

Mnemonic

Bit

Reset Value

Description

RF_SETUP

RF configuration

RF_PWR

2:0

110

Set TX power

111:7dBm 110:4dBm

101:3dBm 100:1dBm

011:0dBm 010:-4dBm

001:-6dBm 000:-12dBm

011：Pre-stage-0dBm, Output 20dBm；

010：Pre-stage-4dBm, Output 16dBm；

011：Pre-stage-6dBm, Output 12dBm;

000：Pre-stage-12dBm, Output 6dBm;

IRQ is an interrupt pin, which can be used to wake up the microcontroller and achieve fast response; it can be

disconnected, and the interrupt status can be obtained by SPI query (not recommended, not conducive to overall

power consumption, and low efficiency);

CE can be connected to the high level for a long time, but the module must be set to POWER DOWN power-down

mode when writing the register. It is recommended that CE be controlled by the MCU pin;

The CE pin is connected to the LNA enable pin. When CE=1, the LNA is turned on, and when CE=0, the LNA is

turned off. This operation is completely consistent with the transceiver mode of nRF24L01; that is, the user does not

need to care about LNA operation at all;

If the user needs to answer automatically, the CE pin must be kept high during the transmission process, and the

high level time cannot be longer than 10us as mentioned in the nRF24L01+ manual. The correct operation is: CE=1

to trigger the transmission. After knowing that the transmission is completed, CE=0, instead of CE=0 after 10us.

The reason is: After SI24R1+ is sent, it will immediately switch to receiving mode. At this time, if CE= 0, the LNA

has been turned off, which is not conducive to receiving sensitivity.

Chengdu Ebyte Electronic Technology Co.,Ltd. E01C-ML01SP2 User Manual

Chapter5. Circuit diagram

Chapter6. FAQ

6.1 Communication range is too short

When there is a straight line communication obstacle, the communication distance will be attenuated accordingly;

Temperature, humidity, and co-frequency interference will increase the communication packet loss rate;

The ground absorbs and reflects radio waves, and the test results near the ground are poor;

Sea water has a strong ability to absorb radio waves, so the seaside test results are poor;

If there is a metal object near the antenna or placed in a metal shell, the signal attenuation will be very serious;

The power register setting is wrong, the air speed setting is too high (the higher the air speed, the closer the

distance);

The low voltage of the power supply at room temperature is lower than the recommended value, the lower the

voltage, the lower the power output;

The poor matching degree of the antenna and the module or the quality of the antenna itself.

6.2 Module is easy to damage

Please check the power supply to ensure that it is within the recommended power supply voltage. If it exceeds the

maximum value, it will cause permanent damage to the module;

Please check the stability of the power supply, the voltage should not fluctuate greatly and frequently;

Please ensure anti-static operation during installation and use, and high-frequency components are electrostatically

sensitive;

Please ensure that the humidity during installation and use should not be too high, and some components are

humidity sensitive devices;

If there is no special requirement, it is not recommended to use at too high or too low temperature.

Chengdu Ebyte Electronic Technology Co.,Ltd. E01C-ML01SP2 User Manual

6.3 BER(Bit Error Rate) is high

There is co-frequency signal interference nearby, stay away from the interference source or modify the frequency

and channel to avoid interference;

The clock waveform on SPI is not standard, check whether there is interference on the SPI line, and the SPI bus line

should not be too long;

Unsatisfactory power supply may also cause garbled codes. Ensure the reliability of the power supply;

Poor or too long extension cords and feeders will also cause high bit error rates.

Chapter7. Soldering guidance

7.1 Reflow soldering temperature

Profile Feature

Curve characteristics

Sn-Pb Assembly

Pb-Free Assembly

Solder Paste

Solder paste

Sn63/Pb37

Sn96.5/Ag3/Cu0.5

Preheat Temperature min （Tsmin）

Min preheating temp.

100℃

150℃

Preheat temperature max (Tsmax)

Mx preheating temp.

150℃

200℃

Preheat Time (Tsmin to Tsmax)(ts)

Preheating time

60-120 sec

Average ramp-up rate(Tsmax to Tp)

Average ramp-up rate

3℃/second max

Liquidous Temperature (TL)

Liquid phase temp.

183℃

217℃

Time（tL）Maintained Above（TL）

Time below liquid

phase line

60-90 sec

30-90 sec

Peak temperature（Tp）

Peak temp.

220-235℃

230-250℃

Aveage ramp-down rate（Tp to Tsmax）

Average ramp-down

rate

6℃/second max

Time 25℃ to peak temperature

Time to peak

temperature for 25℃

6 minutes max

8 minutes max

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