Ebyte E79-400DM2005S Manual de usuario

E79-400DM2005S User Manual

CC1352P Dual Band SoC Wireless Module

Chengdu Ebyte Electronic Technology Co.,Ltd E79-400DM2005S User Manual

CONTENTS

1.OVERVIEW..............................................................................................................................................................................................3

1.1 INTRODUCTION.............................................................................................................................................................. 3

1.2 MAIN FEATURES:...........................................................................................................................................................3

1.3 APPLICATIONS:...............................................................................................................................................................3

2. PARAMETERS:.......................................................................................................................................................................................4

2.1 LIMIT PARAMETERS:......................................................................................................................................................4

2.2 WORKING PARAMETERS:............................................................................................................................................... 4

3. SIZES AND PINS DEFINITION............................................................................................................................................................ 6

4. PROGRAMMING AND TESTING:....................................................................................................................................................... 7

5. USER GUIDE.......................................................................................................................................................................................... 7

5.1 NOTICE FOR HARDWARE............................................................................................................................................... 7

5.2 PROGRAMMING..............................................................................................................................................................8

6. FAQ.......................................................................................................................................................................................................... 9

6.1 COMMUNICATION RANGE IS TOO SHORT........................................................................................................................9

6.2 MODULE IS EASY TO DAMAGE....................................................................................................................................... 9

6.3 BER (BIT ERROR RATE)IS HIGH................................................................................................................................... 9

7.PRODUCTION GUIDANCE................................................................................................................................................................. 10

7.1 REFLOW SOLDERING TEMPERATURE........................................................................................................................... 10

7.2 REFLOW SOLDERING CURVE........................................................................................................................................ 10

8.PACKAGE FOR BATCH ORDER........................................................................................................................................................ 11

9.REVISION HISTORY............................................................................................................................................................................ 11

ABOUT US................................................................................................................................................................................................11

Chengdu Ebyte Electronic Technology Co.,Ltd E79-400DM2005S User Manual

1.Overview

1.1 Introduction

Based on TI CC1352P chip, E79-400DM2005S is a dual-band ARM-based RF SoC Module

The module integrates a high-performance wireless transceiver and a low temperature drift

industrial crystal oscillator.

Presenting all the IO interfaces of the micro-controller and integrating a powerful 48 MHz

Arm ® Cortex ® -M4F processor, high-performance power amplifier, powerful peripherals and up

to 26 GPIOs for multi-faceted development, The module can be developed into many application

fields. It is an excellent choice for wireless micro-controller for Smart home, IoT upgrading and industrial automation etc.

The module is a hardware platform and cannot be used directly. Users need to conduct secondary development (Ebyte can

customize standard LoRaWan and Alibaba linkWan nodes for you).

1.2 Main Features:

Built-in high-performance low-power Arm ® Cortex ® -M4F processor with clock speeds up to 48MHz;

Rich resources, 352KB FLASH, 80KB RAM;

2.1~3.8V power supply voltage, Above 3.3V can guarantee the best performance;

Maximum transmitting power 20dBm@ SUB-1GHz/5dBm@ 2.4GHz, multi-level adjustable from software;

Under ideal conditions, the communication distance can reach 1.5km@SUB-1GHz/[email protected];

Module contains 48M high speed crystal / 32.768k low speed crystal;

Industrial grade standard design, support long-term use from -40 to +85 °C;

Double antennas are optional (IPEX/stamp hole), users can choose according to your own needs;

2 pin cJTAG and JTAG debugging;

Wireless upgrade (OTA);

Dual-band sub-1GHz and 2.4GHz RF transceivers compatible with Bluetooth 5 and IEEE 802.15.4 PHY and MAC

standards;

Excellent receiver sensitivity: –122dBm (SimpleLink long-distance), –110dBm (50kbps), –103dBm (Low-Power

Bluetooth 5 encoding).

1.3 Applications:

Smart grid and automatic meter reading

– water meters, gas meters and electricity meters

– heat distribution table

– gateway

Wireless sensor network

– Remote sensor security system, positioning system

Industry

– Asset tracking and management

Chengdu Ebyte Electronic Technology Co.,Ltd E79-400DM2005S User Manual

– Factory automation

– remote display

Wireless healthcare application

Energy harvesting application

Electronic shelf label (ESL)

Home and building automation

– Wireless alert and security system

– Security lock

– Lighting control

– Motion detector

– Household appliances

– HVAC

– Garage door opener wireless remote control, drone

2. Parameters:

2.1 Limit Parameters:

Main Parameters

Value

Remarks

Min.

Max

Input Voltage(V)

3.8

Permanent damage occurred

when voltage is over 3.8V

Blocking Power(dBm)

Low chance to be damaged for

short-distance transceiving

Working Temp.(℃)

-40

+85

Industrial Grade

2.2 Working Parameters:

SUB-1GHz Parameters:

Main Parameters

Value

Remarks

Min.

Typical

Max.

Working Voltage(V)

2.1

3.3

3.8

Voltage above 3.3V can guaranty Max TX power

Tx Electrical Level(V)

3.3

5V TTL could cause permanent damage

Working Temp (℃)

-40

+85

Industrial Grade

Working Frequency (MHz)

431

500

Applicable for ISM channel

Power

Consumption

TX Current(mA)

Instantaneous power

RX Current(mA)

6.5

Sleeping Current(μA)

Software off

Max TX Power(dBm)

20.0

20.5

RX Sensitivity(dBm)

-122

At 2.5 kbps air rate

Chengdu Ebyte Electronic Technology Co.,Ltd E79-400DM2005S User Manual

2.4G Parameters:

Main Parameters

Value

Remarks

Min.

Typic

Max.

Working Voltage(V)

1.8

3.3

3.8

Voltage above 3.3V can guaranty Max TX power

Tx Electrical Level(V)

3.3

5V TTL could cause permanent damage

Working Temp (℃)

-40

+85

Industrial Grade

Working Frequency (MHz)

2360

2500

Applicable for ISM channel

Power

Consumption

TX Current(mA)

10.5

Instantaneous power

RX Current(mA)

7.5

Max TX Power(dBm)

4.5

RX Sensitivity(dBm)

-103

BLE 5 Coding

Parameters

Value

Remarks

Reference Range

1500m@SUB-1GHz

Conditions: Clear Sky, Antenna Gain 5dBi,

Antenna Height 2.5m, Air rate 1kbps

[email protected]

Conditions: Clear Sky, Antenna Gain 5dBi,

Antenna Height 2.5m, Air rate 1Mbps

TCXO Frequency

48MHz/32.768k

High rate at 48MHz/Low Rate at 32.768k

Protocol

GFSK

Encapsulation

SMD

Interface Type

1.27mm Stamp Hole

IC Model

CC1352P1F3RGZ

FLASH

352KB

RAM

80KB

Core

Arm ® Cortex ® -M4F

Size

32*20mm

Antenna Interfaces

IPEX/Stamp Hole@sub-1G,

PCB [email protected]

Equivalent Impedance is around 50Ω

Chengdu Ebyte Electronic Technology Co.,Ltd E79-400DM2005S User Manual

3. Sizes and Pins Definition

No.

Name

Type

Functions

GND

Input/Output

Ground wire, connected to the power reference ground

ANT

Input/Output

Antenna interface, stamp hole (50 ohm characteristic impedance)

GND

Input/Output

Ground wire, connected to the power reference ground

GND

Input/Output

Ground wire, connected to the power reference ground

DIO_7

Input/Output

Configurable universal IO Port (see CC1352P1F3RGZ Manual)

DIO_8

Input/Output

Configurable universal IO Port (see CC1352P1F3RGZ Manual)

DIO_9

Input/Output

Configurable universal IO Port (see CC1352P1F3RGZ Manual)

DIO_10

Input/Output

Configurable universal IO Port (see CC1352P1F3RGZ Manual)

DIO_11

Input/Output

Configurable universal IO Port (see CC1352P1F3RGZ Manual)

DIO_12

Input/Output

Configurable universal IO Port (see CC1352P1F3RGZ Manual)

DIO_13

Input/Output

Configurable universal IO Port (see CC1352P1F3RGZ Manual)

DIO_14

Input/Output

Configurable universal IO Port (see CC1352P1F3RGZ Manual)

DIO_15

Input/Output

Configurable universal IO Port (see CC1352P1F3RGZ Manual)

GND

Input/Output

Ground wire, connected to the power reference ground

GND

Input/Output

Ground wire, connected to the power reference ground

JTAG_TMSC

Input/Output

JTAG_TMSC

Chengdu Ebyte Electronic Technology Co.,Ltd E79-400DM2005S User Manual

JTAG_TCKC

Input

JTAG_TCKC

DIO_16

Input/Output

Configurable universal IO, JYAG Port (see CC1352P1F3RGZ Manual)

DIO_17

Input/Output

Configurable universal IO, JYAG Port (see CC1352P1F3RGZ Manual)

DIO_18

Input/Output

Configurable universal IO Port (see CC1352P1F3RGZ Manual)

DIO_19

Input/Output

Configurable universal IO Port (see CC1352P1F3RGZ Manual)

DIO_20

Input/Output

Configurable universal IO Port (see CC1352P1F3RGZ Manual)

DIO_21

Input/Output

Configurable universal IO Port (see CC1352P1F3RGZ Manual)

DIO_22

Input/Output

Configurable universal IO Port (see CC1352P1F3RGZ Manual)

RESET_N

Input

Reset Pin

GND

Input/Output

Ground wire, connected to the power reference ground

GND

Input/Output

Ground wire, connected to the power reference ground

DIO_23

Input/Output

Configurable universal IO Port (see CC1352P1F3RGZ Manual)

DIO_28

Input/Output

Configurable universal IO Port (see CC1352P1F3RGZ Manual)

DIO_27

Input/Output

Configurable universal IO Port (see CC1352P1F3RGZ Manual)

DIO_24

Input/Output

Configurable universal IO Port (see CC1352P1F3RGZ Manual)

DIO_25

Input/Output

Configurable universal IO Port (see CC1352P1F3RGZ Manual)

DIO_26

Input/Output

Configurable universal IO Port (see CC1352P1F3RGZ Manual)

DIO_29

Input/Output

Configurable universal IO Port (see CC1352P1F3RGZ Manual)

DIO_30

Input/Output

Configurable universal IO Port (see CC1352P1F3RGZ Manual)

VCC

Input/Output

Module power supply positive reference voltage, voltage range 1.8 ~ 3.8V

GND

Input/Output

Ground wire, connected to the power reference ground

4. Programming and Testing:

Name

Notice

Burning

Program

The module is a SOC module, comes with a GPIO port, please download

program by XDS100 downloader.

Test Board

Not available from Ebyte

5. User Guide

5.1 Notice for Hardware

It is recommended to use DC stabilized power supply. The power supply ripple factor should be as small as possible, and

the module should be reliably grounded.

Please ensure that the positive and negative poles of the power supply are properly connected. If the reverse connection is

made, the module may be permanently damaged.

Please ensure the power supply voltage is within the working voltage range. If the maximum voltage is exceeded, the

module will be permanently damaged.

Please check the stability of the power supply, and the voltage cannot be fluctuated frequently;

Chengdu Ebyte Electronic Technology Co.,Ltd E79-400DM2005S User Manual

When designing the power supply circuit for the module, it is recommended to reserve more than 30% of the margin to

achieve long-term stable operation of the system;

The installation location of the module should be as far away as possible from the power supply, transformers,

high-frequency wiring and other parts with large electromagnetic interference;

High-frequency digital routing, high-frequency analog routing, and power routing must avoid module locations. If the

wiring must pass under the module, assuming that the module is soldered to the Top Layer, the area where the module is in

contact with the Top Layer should be covered with copper (all copper is well grounded), and the area must be close to the digital

part of the module and routed in the Bottom Layer;

If the module is soldered or placed in the Top Layer, it is wrong to randomly route on the Bottom Layer or other layers,

which will affect the spurs and receiving sensitivity of the module to varying degrees;

If there is a device with large electromagnetic interference around the module, it will greatly affect the performance of the

module. It is recommended to maintain the distance from the module according to the strength of the interference. If

circumstances permit, it is recommended to do proper isolation and shielding;

If there are wirings with large electromagnetic interference around the module (such as high frequency digital, high

frequency analog, power line), the performance of the module will be greatly affected. It is recommended to do proper isolation

and shielding;

Try to keep the module away from some physical layers such as the 2.4GHz TTL protocol, for example: USB3.0;

The antenna installation structure has a great influence on the performance of the module. Make sure that the antenna is

exposed and preferably vertical. When the module is installed inside the casing, it is recommended to use a good antenna

extension cable to extend the antenna to the outside of the casing;

The antenna must not be installed inside the metal case, which will greatly reduce the transmission distance.

5.2 Programming

The core of this module is CC1352P, and the user can operate according to the CC1352P chip manual.

Note:

The chip used inside the module is DC/DC mode.

The Sub-1G band module comes with our own RF switch. Please follow the truth table strictly.

Truth Table

DIO_6

DIO_5

Transmit(TX)

Receive(RX)

Low

High

OFF

High

Low

OFF

Burning program: The module is a SOC module with its own GPIO port. Download the program using the XDS100

downloader.

Program download interface definition:

E79 Pins

XDS100 Interfaces

JATG_TMSC

TMS

JTAG_TCKC

TCK

RESET_N

SRSTN

GND

DGND

VCC

TVD

Chengdu Ebyte Electronic Technology Co.,Ltd E79-400DM2005S User Manual

6. FAQ

6.1 Communication range is too short

The communication distance will be affected when obstacle exists.

Data lose rate will be affected by temperature, humidity and co-channel interference.

The ground will absorb and reflect wireless radio wave, so the performance will be poor when testing near ground.

Sea water has great ability in absorbing wireless radio wave, so performance will be poor when testing near the sea.

The signal will be affected when the antenna is near metal object or put in a metal case.

Power register was set incorrectly, air data rate is set as too high (the higher the air data rate, the shorter the

distance).

The power supply low voltage under room temperature is lower than 2.5V, the lower the voltage, the lower the

transmitting power.

Due to antenna quality or poor matching between antenna and module.

6.2 Module is easy to damage

Please check the power supply source, ensure it is 2.0V~3.6V, voltage higher than 3.6V will damage the module.

Please check the stability of power source, the voltage cannot fluctuate too much.

Please make sure antistatic measure are taken when installing and using, high frequency devices have electrostatic

susceptibility.

Please ensure the humidity is within limited range, some parts are sensitive to humidity.

Please avoid using modules under too high or too low temperature.

6.3 BER (Bit Error Rate) is high

There are co-channel signal interference nearby, please be away from interference sources or modify frequency and

channel to avoid interference;

Poor power supply may cause messy code. Make sure that the power supply is reliable.

The extension line and feeder quality are poor or too long, so the bit error rate is high;

Chengdu Ebyte Electronic Technology Co.,Ltd E79-400DM2005S User Manual

7.Production Guidance

7.1 Reflow Soldering Temperature

Profile Feature

Curve characteristics

Sn-Pb Assembly

Pb-Free Assembly

Solder Paste

Solder paste

Sn63/Pb37

Sn96.5/Ag3/Cu0.5

Preheat Temperature min (Tsmin)

Min preheating temp.

100℃

150℃

Preheat temperature max (Tsmax)

Mx preheating temp.

150℃

200℃

Preheat Time (Tsmin to Tsmax)(ts)

Preheating time

60-120 sec

Average ramp-up rate(Tsmax to Tp)

Average ramp-up rate

3℃/second max

Liquidous Temperature (TL)

Liquid phase temp.

183℃

217℃

Time(tL)Maintained Above(TL)

Time below liquid phase

line

60-90 sec

30-90 sec

Peak temperature(Tp)

Peak temp.

220-235℃

230-250℃

Average ramp-down rate(Tp to Tsmax)

Average ramp-down rate

6℃/second max

Time 25℃ to peak temperature

Time to peak temperature

for 25℃

6 minutes max

8 minutes max

7.2 Reflow soldering curve

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