Cypress Semiconductor CY62158E Manual de usuario

CY62158E MoBL®

8-Mbit (1M x 8) Static RAM

Cypress Semiconductor Corporation • 198 Champion Court • San Jose,CA 95134-1709 • 408-943-2600

Document #: 38-05684 Rev. *D Revised June 16, 2008

Features

■Very high speed: 45 ns

❐Wide voltage range: 4.5V – 5.5V

■Ultra low active power

❐Typical active current:1.8 mA @ f = 1 MHz

❐Typical active current: 18 mA @ f = fmax

■Ultra low standby power

❐Typical standby current: 2 μA

❐Maximum standby current: 8 μA

■Easy memory expansion with CE1, CE2 and OE features

■Automatic power down when deselected

■CMOS for optimum speed and power

■Offered in Pb-free 44-Pin TSOP II package

Functional Description

The CY62158E MoBL®is a high performance CMOS static RAM

organized as 1024K words by 8 bits. This device features

advanced circuit design to provide ultra low active current. This

is ideal for providing More Battery Life™ (MoBL®) in portable

applications such as cellular telephones. The device also has an

automatic power down feature that significantly reduces power

consumption. Placing the device into standby mode reduces

power consumption significantly when deselected (CE1 HIGH or

CE2LOW).

To write to the device, take Chip Enables (CE1 LOW and CE2

HIGH) and Write Enable (WE) input LOW. Data on the eight IO

pins (IO0through IO7) is then written into the location specified

on the address pins (A0through A19).

To read from the device, take Chip Enables (CE1 LOW and CE2

HIGH) and OE LOW while forcing the WE HIGH. Under these

conditions, the contents of the memory location specified by the

address pins appear on the IO pins.

The eight input and output pins (IO0through IO7) are placed in

a high impedance state when the device is deselected (CE1

HIGH or CE2LOW), the outputs are disabled (OE HIGH), or a

write operation is in progress (CE1 LOW and CE2HIGH and WE

LOW). See the Truth Table on page 8 for a complete description

of read and write modes.

For best practice recommendations, refer to the Cypress

application note AN1064, SRAM System Guidelines.

A0IO0

IO7

IO1

IO2

IO3

IO4

IO5

IO6

SENSE AMPS

POWER

DOWN

A13

A14

A15

A16

ROW DECODER

COLUMN DECODER

1024K x 8

ARRAY

DATA IN DRIVERS

A10

A11

A17

CE1

CE2

A12

A18

A19

Logic Block Diagram

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CY62158E MoBL®

Document #: 38-05684 Rev. *D Page 2 of 10

Pin Configuration

Figure 1. 44-Pin TSOP II (Top View) [1]

Product Portfolio

Product VCC Range (V) Speed

(ns)

Power Dissipation

Operating ICC (mA) Standby ISB2 (μA)

f = 1 MHz f = fmax

Min Typ [2] Max Typ [2] Max Typ [2] Max Typ [2] Max

CY62158ELL 4.5 5.0 5.5 45 1.8 3 18 25 2 8

14 31

15 29

NC NC

Notes

1. NC pins are not connected on the die.

2. Typical values are included for reference only and are not guaranteed or tested. Typical values are measured at VCC = VCC(typ), TA= 25°C.

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CY62158E MoBL®

Document #: 38-05684 Rev. *D Page 3 of 10

Maximum Ratings

Exceeding the maximum ratings may impair the useful life of the

device. These user guidelines are not tested.

Storage Temperature.................................. –65°C to +150°C

Ambient Temperature with

Power Applied ............................................ –55°C to +125°C

Supply Voltage to Ground Potential–0.5V to VCC(max) + 0.5V

DC Voltage Applied to Outputs

in High-Z State [3, 4] ........................–0.5V to VCC(max) + 0.5V

DC Input Voltage [3, 4].....................–0.5V to VCC(max) + 0.5V

Output Current into Outputs (LOW).............................20 mA

Static Discharge Voltage............................................>2001V

(MIL-STD-883, Method 3015)

Latch up Current......................................................>200 mA

Operating Range

Device Range Ambient

Temperature VCC [5]

CY62158ELL Industrial –40°C to +85°C 4.5V – 5.5V

Electrical Characteristics

Over the Operating Range

Parameter Description Test Conditions -45 UnitMin Typ [2] Max

VOH Output HIGH Voltage IOH = –1 mA 2.4 V

VOL Output LOW Voltage IOL = 2.1 mA 0.4 V

VIH Input HIGH Voltage VCC = 4.5V to 5.5V 2.2 VCC + 0.5V V

VIIL Input LOW Voltage VCC = 4.5V to 5.5V –0.5 0.8 V

IIX Input Leakage Current GND <VI< VCC –1 +1 μA

IOZ Output Leakage Current GND <VO <VCC, Output Disabled –1 +1 μA

ICC VCC Operating Supply

Current f = fMAX = 1/tRC VCC = VCCmax

IOUT = 0 mA

CMOS levels

18 25 mA

f = 1 MHz 1.8 3 mA

ISB1 Automatic CE Power down

Current — CMOS Inputs CE1> VCC− 0.2V, CE2 <0.2V

VIN >VCC – 0.2V, VIN < 0.2V)

f = fMAX (Address and Data Only),

f = 0 (OE, and WE), VCC = VCCmax

28μA

ISB2 [6] Automatic CE Power-down

Current — CMOS Inputs CE1> VCC – 0.2V or CE2< 0.2V,

VIN > VCC – 0.2V or VIN < 0.2V,

f = 0, VCC = VCCmax

28μA

Capacitance

Tested initially and after any design or process changes that may affect these parameters.

Parameter Description Test Conditions Max Unit

CIN Input Capacitance TA= 25°C, f = 1 MHz,

VCC = VCC(typ) 10 pF

COUT Output Capacitance 10 pF

Thermal Resistance

Tested initially and after any design or process changes that may affect these parameters.

Parameter Description Test Conditions TSOP II Unit

ΘJA Thermal Resistance

(Junction to Ambient) Still Air, soldered on a 3 × 4.5 inch,

two-layer printed circuit board 75.13 °C/W

ΘJC Thermal Resistance

(Junction to Case) 8.95 °C/W

Notes

3. VIL(min) = –2.0V for pulse durations less than 20 ns.

4. VIH(max) = VCC + 0.75V for pulse durations less than 20 ns.

5. Full Device AC operation assumes a 100 μs ramp time from 0 to VCC (min) and 200 μs wait time after VCC stabilization.

6. Only chip enables (CE1 and CE2), must be tied to CMOS levels to meet the ISB2 / ICCDR spec. Other inputs can be left floating.

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CY62158E MoBL®

Document #: 38-05684 Rev. *D Page 4 of 10

Figure 2. AC Test Loads and Waveforms

Parameters 5.0V Unit

R1 1838 Ω

R2 994 Ω

RTH 645 Ω

VTH 1.75 V

Data Retention Characteristics

Over the Operating Range

Parameter Description Conditions Min Typ [2] Max Unit

VDR VCC for Data Retention 2 V

ICCDR [6] Data Retention Current VCC = VDR

CE1> VCC −0.2V, CE2< 0.2V,

VIN > VCC −0.2V or VIN < 0.2V

8μA

tCDR [7] Chip Deselect to Data

Retention Time 0ns

tR [8] Operation Recovery Time tRC ns

Figure 3. Data Retention Waveform

VCC

OUTPUT

100 pF

INCLUDING

JIG AND

SCOPE

GND 90%

10% 90%

10%

Rise Time = 1 V/ns Fall Time = 1 V/ns

OUTPUT V

Equivalent to: THÉVENIN EQUIVALENT

ALL INPUT PULSES

RTH

Notes

7. Tested initially and after any design or process changes that may affect these parameters.

8. Full device operation requires linear VCC ramp from VDR to VCC(min) > 100 μs or stable at VCC(min) > 100 μs.

VCC(min)

tCDR VDR >2.0 V

DATA RETENTION MODE

CE1

VCC

CE2

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CY62158E MoBL®

Document #: 38-05684 Rev. *D Page 5 of 10

Switching Characteristics

Over the Operating Range [9]

Parameter Description 45 ns Unit

Min Max

Read Cycle

tRC Read Cycle Time 45 ns

tAA Address to Data Valid 45 ns

tOHA Data Hold from Address Change 10 ns

tACE CE1 LOW and CE2 HIGH to Data Valid 45 ns

tDOE OE LOW to Data Valid 22 ns

tLZOE OE LOW to Low Z [10] 5ns

tHZOE OE HIGH to High Z [10, 11] 18 ns

tLZCE CE1 LOW and CE2 HIGH to Low Z [10] 10 ns

tHZCE CE1 HIGH or CE2 LOW to High Z [10, 11] 18 ns

tPU CE1 LOW and CE2 HIGH to Power Up 0 ns

tPD CE1 HIGH or CE2 LOW to Power Down 45 ns

Write Cycle [12]

tWC Write Cycle Time 45 ns

tSCE CE1 LOW and CE2 HIGH to Write End 35 ns

tAW Address Setup to Write End 35 ns

tHA Address Hold from Write End 0 ns

tSA Address Setup to Write Start 0 ns

tPWE WE Pulse Width 35 ns

tSD Data Setup to Write End 25 ns

tHD Data Hold from Write End 0 ns

tHZWE WE LOW to High Z [10, 11] 18 ns

tLZWE WE HIGH to Low Z [10] 10 ns

Notes

9. Test conditions for all parameters other than tri-state parameters assume signal transition time of 3 ns or less (1V/ns), timing reference levels of VCC(typ)/2, input pulse

levels of 0 to VCC(typ), and output loading of the specified IOL/IOH as shown in “AC Test Loads and Waveforms” on page 4.

10.At any given temperature and voltage condition, tHZCE is less than tLZCE, tHZOE is less than tLZOE, and tHZWE is less than tLZWE for any given device.

11. tHZOE, tHZCE, and tHZWE transitions are measured when the outputs enter a high impedance state.

12.The internal write time of the memory is defined by the overlap of WE, CE1 = VIL, and CE2 = VIH. All signals must be ACTIVE to initiate a write and any of these signals

can terminate a write by going INACTIVE. The data input setup and hold timing should be referenced to the edge of the signal that terminates the write.

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CY62158E MoBL®

Document #: 38-05684 Rev. *D Page 6 of 10

Switching Waveforms

Figure 4 shows address transition controlled read cycle waveforms.[13, 14]

Figure 4. Read Cycle No. 1

Figure 5 shows OE controlled read cycle waveforms.[14, 15]

Figure 5. Read Cycle No. 2

ADDRESS

DATA OUT PREVIOUS DATA VALID DATA VALID

tRC

tAA

tOHA

50%

DATA VALID

tRC

tACE

tDOE

tLZOE

tLZCE

tPU

HIGH IMPEDANCE

tHZOE tHZCE

tPD

HIGH

ICC

ISB

IMPEDANCE

CE1

ADDRESS

CE2

DATA OUT

SUPPLY

CURRENT

VCC

Notes

13.Device is continuously selected. OE, CE1= VIL, CE2= VIH.

14.WE is HIGH for read cycle.

15.Address valid before or similar to CE1transition LOW and CE2transition HIGH.

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CY62158E MoBL®

Document #: 38-05684 Rev. *D Page 7 of 10

Figure 6 shows WE controlled write cycle waveforms.[12, 16, 17]

Figure 6. Write Cycle No. 1

Figure 7 shows CE1or CE2controlled write cycle waveforms.[12, 16, 17]

Figure 7. Write Cycle No. 2

Switching Waveforms (continued)

tHD

tSD

tPWE

tSA

tHA

tAW

tSCE

tWC

HZOE

VALID DATA

NOTE 18

CE1

ADDRESS

CE2

DATA IO

tWC

VALID DATA

tAW

tSA

tPWE

tHA

tHD

tSD

tSCE

CE1

ADDRESS

CE2

DATA IO

Notes

16.Data IO is high impedance if OE = VIH.

17.If CE1goes HIGH or CE2goes LOW simultaneously with WE HIGH, the output remains in high impedance state.

18.During this period, the IOs are in output state. Do not apply input signals.

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CY62158E MoBL®

Document #: 38-05684 Rev. *D Page 8 of 10

Figure 8 shows WE controlled, OE LOW write cycle waveforms.[17]

Figure 8. Write Cycle No. 3

Truth Table

CE1CE2WE OE Inputs/Outputs Mode Power

HXXXHigh Z Deselect/Power Down Standby (ISB)

XLXXHigh Z Deselect/Power Down Standby (ISB)

L H H L Data Out Read Active (ICC)

LHHHHigh Z Output Disabled Active (ICC)

L H L X Data in Write Active (ICC)

Ordering Information

Speed

(ns) Ordering Code Package

Diagram Package Type Operating

Range

45 CY62158ELL-45ZSXI 51-85087 44-Pin TSOP II (Pb-free) Industrial

Switching Waveforms (continued)

VALID DATA

tHD

tSD

tLZWE

tPWE

tSA

tHA

tAW

tSCE

tWC

tHZWE

NOTE 18

CE1

ADDRESS

CE2

DATA IO

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CY62158E MoBL®

Document #: 38-05684 Rev. *D Page 9 of 10

Package Diagrams

Figure 9. 44-Pin TSOP II, 51-85087

51-85087-*A

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Document #: 38-05684 Rev. *D Revised June 16, 2008 Page 10 of 10

All products and company names mentioned in this document may be the trademarks of their respective holders.

CY62158E MoBL®

circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be used for medical,

life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its products for use as critical

components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress products in life-support systems

application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges.

Any Source Code (software and/or firmware) is owned by Cypress Semiconductor Corporation (Cypress) and is protected by and subject to worldwide patent protection (United States and foreign),

United States copyright laws and international treaty provisions. Cypress hereby grants to licensee a personal, non-exclusive, non-transferable license to copy, use, modify, create derivative works of,

and compile the Cypress Source Code and derivative works for the sole purpose of creating custom software and or firmware in support of licensee product to be used only in conjunction with a Cypress

integrated circuit as specified in the applicable agreement. Any reproduction, modification, translation, compilation, or representation of this SourceCode except as specified above is prohibited without

the express written permission of Cypress.

Disclaimer: CYPRESS MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARD TO THIS MATERIAL, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES

OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE. Cypress reserves the right to make changes without further notice to the materials described herein. Cypress does not

assume any liability arising out of the application or use of any product or circuit described herein. Cypress does not authorize its products for use as critical components in life-support systems where

a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress’ product in a life-support systems application implies that the manufacturer

assumes all risk of such use and in doing so indemnifies Cypress against all charges.

Use may be limited by and subject to the applicable Cypress software license agreement.

Document History Page

Document Title: CY62158E MoBL®8-Mbit (1M x 8) Static RAM

Document Number: 38-05684

REV. ECN NO. Issue Date Orig. of

Change Description of Change

** 270350 See ECN PCI New Data Sheet

*A 291271 See ECN SYT Converted from Advance Information to Preliminary

Changed input pulse level from VCC to 3V in the AC Test Loads and Waveforms

Modified footnote #9 to include timing reference level of 1.5V and input pulse

level of 3V

*B 1462592 See ECN VKN/AESA Converted from preliminary to final

Removed 35 ns speed bin

Removed “L” parts

Removed 48-Ball VFBGA package

Changed ICC(max) spec from 2.3 mA to 3 mA at f=1 MHz

Changed ICC(typ) spec from 16 mA to 18 mA at f=fMAX

Changed ICC(max) spec from 28 mA to 25 mA at f=fMAX

Changed ISB1(typ) and ISB2(typ) spec from 0.9 μA to 2 μA

Changed ISB1(max) and ISB2(max) spec from 4.5 μA to 8 μA

Changed ICCDR(max) spec from 4.5 μA to 8 μA

Changed tLZOE spec from 3 ns to 5 ns

Changed tLZCE spec from 6 ns to 10 ns

Changed tHZCE spec from 22 ns to 18 ns

Changed tPWE spec from 30 ns to 35 ns

Changed tSD spec from 22 ns to 25 ns

Changed tLZWE spec from 6 ns to 10 ns

Added footnote# 6 related to ISB2 and ICCDR

Updated Ordering information table

*C 2428708 See ECN VKN/PYRS Corrected typo in the Ordering Information table

*D 2516494 See ECN PYRS Corrected ECN number

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