Acromag XMCAP2022 Manual de usuario

XMCAP2022 XMC AcroPack Carrier Boards

For ARCX Applications

USER’S MANUAL

ACROMAG INCORPORATED

30765 South Wixom Road

Wixom, MI 48393-2417 U.S.A.

Tel: (248) 295-0310

Data and specifications are subject to change without notice.

8501131C

AcroPack Series XMCAP2022 XMC Carrier Board 
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Table of Contents 
1. GENERAL INFORMATION ...................................................................................................................... 4 
Intended Audience................................................................................................................................ 4 
Preface .................................................................................................................................................. 4 
Trademark, Trade Name and Copyright Information ........................................................................... 4 
Environmental Protection Statement................................................................................................... 4 
XMCAP2022 OVERVIEW........................................................................................................................ 4 
Ordering Information ......................................................................................................................... 5 
KEY XMCAP2022 FEATURES.................................................................................................................. 5 
SIGNAL INTERFACE PRODUCTS............................................................................................................. 5 
JTAG Adapter Cable............................................................................................................................ 5 
2. PREPARATION FOR USE ........................................................................................................................ 6 
UNPACKING AND INSPECTION.............................................................................................................. 6 
BOARD CONFIGURATION...................................................................................................................... 7 
CARRIER ADDRESS ASSIGNMENT.......................................................................................................... 8 
ACROPACK HEATSINKING ..................................................................................................................... 8 
ACROPACK MODULE INSTALLATION..................................................................................................... 9 
FIELD GROUNDING CONSIDERATIONS................................................................................................ 10 
CONNECTORS...................................................................................................................................... 10 
Rear Field I/O Connectors ................................................................................................................ 10 
AcroPack Field I/O Connectors......................................................................................................... 11 
ARCX 4000 Series Cross Reference................................................................................................... 17 
Mini-PCIe Connectors....................................................................................................................... 21 
XMC/PCIe Bus Connections.............................................................................................................. 22 
JTAG Programming/Debug Connector............................................................................................. 22 
3. PROGRAMMING INFORMATION......................................................................................................... 24 
4. THEORY OF OPERATION...................................................................................................................... 24 
PCIe SWITCH ....................................................................................................................................... 24 
DC/DC CONVERTERS ........................................................................................................................... 24 
SLOT ADDRESSING .............................................................................................................................. 24 
JTAG .................................................................................................................................................... 25 
POWER SUPPLY FET SWITCHES........................................................................................................... 25 
5. SERVICE AND REPAIR .......................................................................................................................... 26 
PRELIMINARY SERVICE PROCEDURE................................................................................................... 26 
WHERE TO GET HELP .......................................................................................................................... 26 
6. SPECIFICATIONS .................................................................................................................................. 27 
PHYSICAL............................................................................................................................................. 27 
Physical Configuration (conforms to VITA 42 air-cooled XMC Specification) .................................. 27 

AcroPack Series XMCAP2022 XMC Carrier Board

Connectors ....................................................................................................................................... 27

POWER................................................................................................................................................ 27

PCIe BUS COMPLIANCE....................................................................................................................... 28

ENVIRONMENTAL ............................................................................................................................... 28

EMC Compliance .............................................................................................................................. 28

Vibration and Shock Standard.......................................................................................................... 28

Reliability Prediction ........................................................................................................................ 29

7. APPENDIX A......................................................................................................................................... 30

Heatsink Installation ........................................................................................................................... 30

8. APPENDIX B......................................................................................................................................... 31

XMCAP202x Module Installation ........................................................................................................ 31

9. CERTIFICATE OF VOLATILITY ............................................................................................................... 33

10. REVISION HISTORY.............................................................................................................................. 34

AcroPack Series XMCAP2022 XMC Carrier Board

1. GENERAL INFORMATION

Intended Audience

This users’ manual was written for technically qualified personnel who will be

working with I/O devices using the AcroPack module.

Preface

The information contained in this manual is subject to change without notice,

and Acromag, Inc. (Acromag) does not guarantee its accuracy. Acromag

makes no warranty of any kind with regard to this material, including, but not

limited to, the implied warranties of merchantability and fitness for a

particular purpose. Further, Acromag assumes no responsibility for any errors

that may appear in this manual and makes no commitment to update, or keep

current, the information contained in this manual. No part of this manual may

be copied or reproduced in any form, without the prior written consent of

Acromag.

Trademark, Trade Name and Copyright Information

Acromag Incorporated. All other trademarks, registered trademarks, trade

names, and service marks are the property of their respective owners.

Environmental Protection Statement

This product has been manufactured to satisfy environmental protection

requirements where possible. Many components used (structural parts,

circuit boards, connectors, etc.) are capable of being recycled. Final

disposition of this product after its service life must be conducted in

accordance with applicable country, state, or local laws or regulations.

XMCAP2022 OVERVIEW

The XMCAP2022 is a carrier for mini-PCIe or AcroPack mezzanine modules in

an XMC form factor. This carrier board provides a modular approach to

system assembly, since each carrier can be populated with any combination

of analog input/output, digital input/output, communication, etc. AcroPack

modules. Thus, the user can create a board which is customized to the

application. This saves money and space - a single carrier board populated

with AcroPack modules may replace several dedicated function XMC modules.

AcroPack Series XMCAP2022 XMC Carrier Board

Ordering Information

The XMCAP2022-LF was designed for use in the ARCX4000 series. It is the

same as the XMCAP2021-LF but with different routing to the Rear I/O

connectors P14 and P16.

Model

I/O Type

XMCAP2022-LF

Rear (P14 & P16) For

ARCX4000

applications

KEY XMCAP2022 FEATURES

Interface for AcroPack modules –The XMCAP2022 provides an electrical and

mechanical interface for up to two industry standard mini-PCIe or AcroPack

modules. AcroPack modules are available from Acromag. Mini-PCIe cards are

available from other vendors in a wide variety of input/output configurations

to meet the needs of varied applications.

PCI Express Version 2.1 Compliant Carrier: - Includes a PCIe switch to allow

two PCIe devices (AcroPack or mini-PCIe) to share a single XMC slot on the

XMC carrier.

Board Identification –A unique carrier and site number can be set for each

AcroPack site automatically by geographical address bits or by DIP switch. This

feature provides the capability to distinguish a particular AcroPack module

from others when multiple instances of the same module are used in a

system.

JTAG Programming Header –JTAG programming is supported both through

the XMC P15 connector, as well as through a Molex 78171-5006 6-pin micro

connector (J3). This connection is provided for programming and debugging

the FPGA on some AcroPack modules. The JTAG ports of the two AcroPack

modules are daisy-chained.

SIGNAL INTERFACE PRODUCTS

This AcroPack carrier board will mate directly to most industry standard mini-

PCIe and AcroPack modules. Acromag provides the following interface

products (all connections to field signals are made through the carrier board

which passes them to the individual AcroPack modules):

JTAG Adapter Cable

Model 5028-564 JTAG Adapter Cable connects between J3 and a Xilinx USB

programmer. This cable is only required if JTAG is not available on the XMC

carrier through the P15 XMC connector.

AcroPack Series XMCAP2022 XMC Carrier Board

2. PREPARATION FOR USE

IMPORTANT PERSONAL AND PRODUCT SAFETY CONSIDERATIONS

It is very important for the user to consider the possible safety implications of

power, wiring, component, sensor, or software failures in designing any type

of control or monitoring system. This is especially important where personal

injury or the loss of economic property or human life is possible. It is

important that the user employ satisfactory overall system design. It is

understood and agreed by the Buyer and Acromag that this is the Buyer's

responsibility.

WARNING: This board utilizes static sensitive components and should only

be handled at a static-safe workstation. This product is an electrostatic

sensitive device and is packaged accordingly. Do not open or handle this

product except at an electrostatic-free workstation. Additionally, do not ship

or store this product near strong electrostatic, electromagnetic, magnetic, or

radioactive fields unless the device is contained within its original

manufacturer’s packaging. Be aware that failure to comply with these

guidelines will void the Acromag Limited Warranty.

UNPACKING AND INSPECTION

Upon receipt of this product, inspect the shipping carton for evidence of

mishandling during transit. If the shipping carton is badly damaged or water

stained, request that the carrier's agent be present when the carton is

opened. If the carrier's agent is absent when the carton is opened and the

contents of the carton are damaged, keep the carton and packing material for

the agent's inspection.

For repairs to a product damaged in shipment, refer to the Acromag Service

Policy to obtain return instructions. It is suggested that salvageable shipping

cartons and packing material be saved for future use in the event the product

must be shipped.

This board is physically protected with packing material and electrically

protected with an anti-static bag during shipment. It is recommended that the

board be visually inspected for evidence of mishandling prior to applying

power.

The board utilizes static sensitive components and should only be handled at

a static-safe workstation.

AcroPack Series XMCAP2022 XMC Carrier Board

BOARD CONFIGURATION

Power should be removed from the board when changing switch

configurations or when installing AcroPack modules, cables and field wiring.

Figure 1 XMCAP2022 Primary Side

Refer to the specifications for loading and power requirements. Be sure that

the system power supplies are able to accommodate the power requirements

of the carrier board, plus the installed AcroPack modules within the voltage

tolerances specified.

IMPORTANT: Adequate thermos conduction must be provided to prevent a temperature rise above the

maximum operating temperature.

The lack of thermo conduction from the XMC carrier could be a cause for

some concern. Adequate thermo conduction must be provided to prevent a

temperature rise above the maximum operating temperature and to prolong

the life of the electronics.

AcroPack Series XMCAP2022 XMC Carrier Board

CARRIER ADDRESS ASSIGNMENT

Following are the instructions for setting the slot address of the carrier. By

assigning a unique address to each carrier, system software can distinguish

this carrier from other similarly configured carriers installed in a system.

Address bits A0, A1, and A2 are connected to the corresponding Geographical

Addressing (GA) bits of the XMC P15 connector. This should automatically

assign a unique address to the XMCAP2022 board.

If the GA bits are not supplied by the XMC carrier onto which the XMCAP2022

board is installed, SW1 may be used to select address bits A3 and A4. Figure 1

shows the location of switch SW1. Set the switch state as shown in Table 1

below to assign a unique slot address to this carrier.

Table 1 Switch SW1 assignments

SW1 Position

Address Bit

Value

1-2

2-3

4-5

5-6

ACROPACK HEATSINKING

Most applications require the use of a nonstandard heatsink. Consult the

factory for each application. See Appendix A for the installation of the

heatsink.

Available XMCAP202x heatsinks for use in ARCX box applications:

•AP-CC-02: Dual generic AcroPack (left rail or single wide ARCX)

•AP-CC-03: AP57x with generic AP (left rail or single wide ARCX)

•AP-CC-05: Dual generic AP (right rail)

Where “generic” AcroPack refers to:

•AP220-16E-LF

•AP225-16E-LF

•AP226-8E-LF

•AP231-16E-LF

•AP235-16E-LF

•AP236-8E-LF

•AP323E-LF

•AP341E-LF

•AP342E-LF

•AP408E-LF

AcroPack Series XMCAP2022 XMC Carrier Board

•AP418E-LF

•AP445E-LF

•AP471E-LF

•AP482/3/4E-LF

•AP500E-LF

•AP512E-LF

•AP520-64E-LF

•AP521-64E-LF

•AP522E-LF

•APA7-201/2/3/4E-LF

•APA7-501/2/3/4E-LF

ACROPACK MODULE INSTALLATION

Power should be removed from the carrier board when installing AcroPack

modules, cables, termination panels, and field wiring. Refer to Figure 4 while

reading this section. Place the XMCAP2022 flat on an anti-static surface for

support. To install, first insert the edge of the AcroPack module into the

carrier connector at an angle similar to that shown in the figure. Next, using a

rocking motion while gently applying force to keep the edge of the board

against the back of the carrier connector, position the module such that the

field I/O connector is just above the mating connector. Verify that the two

connectors are properly aligned. Once alignment is achieved, you can fully

seat the connector. It will snap into place. Install four M2.5 screws as shown.

Refer to Appendix B for the installation of the XMC card into the ARCX XMC

site.

Note: The AP441E-LF is not recommended for use with the XMC AcroPack

carrier.

WARNING: When installing a commercial mini-PCIe module onto the

XMCAP2022 board be sure that pin 45 on the module's mini-PCIe connector

is not grounded or damage to the module may result.

AcroPack Series XMCAP2022 XMC Carrier Board

Figure 4 AcroPack Module Installation

FIELD GROUNDING CONSIDERATIONS

Care should be taken in designing installations without isolation to avoid

ground loops and noise pickup. This is particularly important for analog I/O

applications when a high level of accuracy/resolution is needed (12-bits or

more). Contact your Acromag representative for information on our many

isolated signal conditioning products that could be used to interface to the

AcroPack input/output modules.

CONNECTORS

The XMCAP2022 carrier uses two AcroPack module field I/O connectors, two

mini-PCIe connectors, two field I/O connectors (rear P14 & P16 connectors for

XMCAP2022) and one XMC bus interface connector. These are discussed in

the following sections.

Rear Field I/O Connectors

Field I/O connections on the XMCAP2022 model are made via the P14 and

P16 connectors. The Field I/O connections from the AcroPack module in Site A

are available through the XMC P16 and PMC P14 connector. The Field I/O

connections from the AcroPack module in Site B are available through the

PMC P14 connector.

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