TIM-5H-HardwareIntegrationManual Contents
GPS.G5-MS5-07015-A-1u-bloxproprietaryPage 6
your position is our focus
2.9.2 ActiveAntenna ........................................................................................................................... 23
2.9.3 ActiveAntennaBiasPower.......................................................................................................... 24
2.9.4 ActiveAntennaSupervisor........................................................................................................... 24
3Product Handling........................................................................................................28
3.1 Packaging........................................................................................................................................... 28
3.1.1 Reels ........................................................................................................................................... 28
3.1.2 Tapes .......................................................................................................................................... 29
3.2 Shipment,StorageandHandling ........................................................................................................ 29
3.2.1 Handling ..................................................................................................................................... 29
3.2.2 Shipment..................................................................................................................................... 29
3.2.3 Storage ....................................................................................................................................... 30
3.2.4 Handling ..................................................................................................................................... 30
3.2.5 FloorLife ..................................................................................................................................... 31
3.3 Processing .......................................................................................................................................... 32
3.3.1 MoisturePreconditioning ............................................................................................................ 32
3.3.2 SolderingPaste............................................................................................................................ 32
3.3.3 ReflowSoldering ......................................................................................................................... 33
3.3.4 OpticalInspection........................................................................................................................ 34
3.3.5 Cleaning...................................................................................................................................... 35
3.3.6 RepeatedReflowSoldering.......................................................................................................... 35
3.3.7 WaveSoldering ........................................................................................................................... 35
3.3.8 HandSoldering ........................................................................................................................... 35
3.3.9 Rework........................................................................................................................................ 35
3.3.10 ConformalCoating ..................................................................................................................... 36
3.3.11 Casting........................................................................................................................................ 36
3.3.12 GroundingMetalCovers ............................................................................................................. 36
3.3.13 UseofUltrasonicProcesses.......................................................................................................... 36
4Product Testing...........................................................................................................37
4.1 u-bloxIn-SeriesProductionTest.......................................................................................................... 37
4.2 TestParametersforOEMManufacturer.............................................................................................. 37
4.3 SystemSensitivityTest ........................................................................................................................ 38
4.3.1 GuidelinesforSensitivityTests..................................................................................................... 38
4.3.2 ‘Go/Nogo’testsforintegrateddevices........................................................................................ 38
Appendix..........................................................................................................................39
AMigration to u-blox 5 receivers.................................................................................39
