TYAN THUNDER I7525 Manual de usuario

Thunder i7525 (S2676) User’s Manual

http://www.tyan.com

Thunder i7525 ///

S2676

Revision 1.01

may be reproduced or translated without prior written consent from TYAN Computer Corp.

All registered and unregistered trademarks and company names contained in this manual are

property of their respective owners including, but not limited to the following.

TYAN, Thunder i7525 and (S2676) are trademarks of TYAN Computer Corporation.

Intel, Xeon, and combinations thereof are trademarks ofIntel Corporation.

Phoenix, PhoenixBIOS are trademarks of Phoenix Technologies.

Microsoftand Windows are trademarks of Microsoft Corporation.

Linux is a trademark of Linus Torvalds.

IBM, PC, ATand PS/2 are trademarks of IBM Corporation.

ATI, ATI RAGE is a trademark of ATI Technologies Incorporated.

SMSC is a trademark of SMSC -Standard Microsystems Corporation.

Portable Document Format (PDF) is a trademark of Adobe Corporation.

Information contained in this document is furnished by TYAN Computer Corporation and has been

reviewed for accuracy and reliability prior to printing. TYAN assumes no liability whatsoever, and

disclaims any express or implied warranty, relating to sale and/or use of TYAN products including

liability or warranties relating to fitness for a particular purpose or merchantability. TYAN retains

the right to make changes to product descriptions and/or specifications at any time, without notice.

In no event will TYAN be held liable for any direct or indirect, incidental or consequential damage,

loss of use, loss of data or other malady resulting from errors or inaccuracies of information

contained in this document.

Thunder i7525 (S2676) Table of Contents

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Table of Contents

Chapter 1: Introduction................................................................................................................1

1.1 –Congratulations!..............................................................................................................1

1.2 –Hardware Specifications.................................................................................................1

1.3 –Board Diagram................................................................................................................3

Chapter 2: Choose Proper Parts For Your System....................................................................4

2.1 –Central Processor Unit (CPU) Considerations ................................................................4

2.2 –Memory Considerations..................................................................................................4

2.3 –Chassis/Enclosure Considerations..................................................................................5

2.4 –Power Supply Considerations.........................................................................................5

Chapter 3: Board Installation.......................................................................................................7

3.1 –Key Component View.......................................................................................................8

3.2 –Jumper Settings & Definitions.........................................................................................9

3.3 –Mounting the Motherboard............................................................................................16

3.4 –Installing the Processor and Heatsink...........................................................................16

3.5 –Installing the Memory....................................................................................................19

3.6 –Memory Installation Procedure......................................................................................19

3.7–Attaching Drive Cables...................................................................................................20

3.8 –Installing Add-In Cards..................................................................................................23

3.9 –Connecting External Devices........................................................................................24

3.10 –Installing the Power Supply.........................................................................................24

3.11 –Finishing Up ................................................................................................................25

Chapter 4: BIOS Setup................................................................................................................26

4.1 –Main BIOS Setup ..........................................................................................................27

4.2 –Main Submenu Standard / Native IDE..........................................................................30

4.3 –Advanced BIOS Features .............................................................................................32

4.4 –Security Menu...............................................................................................................44

4.5 –Power Menu..................................................................................................................46

4.6 –Boot Menu.....................................................................................................................48

4.7 –Exit Menu......................................................................................................................50

Chapter 5: Diagnostics...............................................................................................................51

5.1 Beep Codes.....................................................................................................................51

5.2 Flash Utility ......................................................................................................................51

Appendix I: Glossary..................................................................................................................54

Appendix II: Post Error Code for BIOS......................................................................................60

Technical Support..................................................................................................................65

Thunder i7525 (S2676) Before you begin…

iii

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Before you begin…

Check the box contents!

The retail motherboard package should contain the following:

1x Thunder i7525 (S2676) motherboard

1x 34-pin floppy drive cable

1x 80-pin Ultra-DMA-133/100/66/33 IDE cable

1x 68-pin Ultra 320 SCSI cable (Optional)

1x Thunder i7525 (S2676) User’s Manual

1x Thunder i7525 (S2676) Quick Reference

1x TYAN driver CD

1x I/O shield

1 x Serial ATA driver diskette

SCSI Driver Disk (Optional)

1x Serial ATA power cable

2x Serial ATA cables

If any of these items are missing, please contact your vendor/dealer for replacement before

continuing with the installation process.

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Chapter 1: Introduction

1.1 –Congratulations!

You have purchased one of the most powerful Intel Xeon-basedworkstation solutions in a

standard SSI EEB v3.5 form factor. Based on the Intel E7210 chipset, the Thunder i7525 (S2676)

features some state-of-the-art technologies such as dual/single 800 MHz FSB Xeonprocessor

support, multiple PCI-Express buses, dual channel DDR2 memory design, onboard PCI-Express

Gigabit Ethernet port, Serial-ATA IDE ports,and multiple USB2.0 (Universal Serial Bus) ports.By

doubling the capability of existing AGP8x designs with transfer rates of 4.0 Gigabytes per second

over a x16 PCI Express lane for graphics controllers, the onboard x16 PCI-Express slot supports

a high performance graphics infrastructure for high-end gaming or multimedia.

Visit Tyan’s website at http://www.tyan.com. There,you can find information on all of Tyan’s

products with up-to-date FAQs, a list of worldwide distributors, Tyan software utilities, the latest

drivers, memory compatibility listings, and BIOS setting explanations.

1.2 –Hardware Specifications

Processors

-Dual mPGA604 ZIF sockets

-Supportssingle or dual Intel Xeon

processors (Nocona)

-800MHz Front-Side Bus

-Dual onboard 4-phaseVRM10.1 complaint

voltage regulation design

Chipset

-Intel E7525 chipset

§E7525 MCH (North Bridge)

§ICH5R (South Bridge)

§PXH (PCI-X hub)

-SMSC LPC47B397 Super I/O chip

Expansion Slots

-One x16 PCI-Express high-performance

Graphicsslot

-One PCI-X 64-bit 133/100/66MHz (3.3-

Volt)slot

-Two PCI-X 64-bit 100/66MHz (3.3-volt)

slots

-One PCI 32-bit 33MHz (5-Volt) slots

-Total of six usable slots

Memory

-Eight 240-pin 1.8-Volt DDR2 400 DIMM

sockets

-Dual channel memory bus

-Supports Registered/ECC or registered

/non-ECC memory

-Supports up to 32GB*of Registered

DDR2-400 DIMM modules

IntegratedLAN

-Broadcom BCM5751 PCI Express Gigabit

Ethernet Controller

System Hardware Health Monitor

-Total four 3-pin fan headers with

tachometer monitoring and five of them

with PWM control

-Chassis intrusion header

-Temperature and voltage monitoring

-Watchdog timer

BIOS

-Phoenix BIOS 4Mbit flash ROM

-Supports ACPI 1.0b, PnP, DMI 2.0

-Auto configuration of IDE devices

-Multiple boot options

-Power Management: ACPI S1, S3, S4 and

S5 modes

Other Integrated I/O Interfaces

-One floppy connector for up to two drives

-One UART serial port connector

-One ECP/EPP/SPP parallel connector

-One OPTION USB header with 2-4 USB

ports (2 front USB ports via an optional

cable)

-PS/2 mouse & keyboard ports

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*Not validated at time of print. (16GB

validated at time of release)

IntegratedAudio

-Intel ICH5R AC’97 compliant audio link

-Analog Device AD1981B CODEC

-Line-in,Line-out, Mic-in rear vertical jacks

and a front panel audio header

-One 4-pin CD-ROM audio input header

-One 4-pin Auxiliary header

Integrated MassStorage Port

-Two ICH5-S integrated SATA ports up to

1.5 Gbit/s with SATA RAID 0,1 (Microsoft

OS support only)

-Two bus-master UDMA ATA100/66/33

Parallel IDE channels support up to 4

ATA/ATAPI complaint devices

Form Factor

-SSI EEB 3.5 footprint (12”x13”,

305x330mm)

-EPS12V V3.51 power connectors

-Rear I/O

§Stacked PS/2 mouse and keyboard

connectors

§One parallel connector

§One GbE RJ45 connector

§One stack of four USB ports

§Stacked audio connector for MIC,

Line_out and Line_in.

Regulatory

-FCC Class B (Declaration of Conformity)

-European Community CE (Declaration of

Conformity)

Note: TYAN reserves the right to add support or discontinue support for any OS with or without

notice.

Software Specifications

OS (Operating System) Support

Win2k Pro Advanced Server

WinXP Pro

RedHat (x32) 9.0

SuSE (x32) 9.0, 9.1

SuSE (x64) 9.0

Other distributions of Linux pending validation

TYAN reserves the right to add support or discontinue support for any OS with or without

notice.

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1.3 –Board Diagram

The above picture is purely representative. Due to engineering updates and new board

revisions, certain components may change and or be repositioned. The picture above may

or may not look exactly like the board you received.

The following page includes details on the vital components of this motherboard.

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Chapter 2: Choose Proper Parts For Your System

Before you installa system with this motherboard, make sure your major system parts meet the

following basic guidelines and requirements:

2.1 –Central Processor Unit (CPU) Considerations

§Process Type and Package

Thunder i7525 (S2676) board supports Intel Xeonprocessors in 604-pin Pin Grid

Array package.

§Front Side Bus (FSB)

The processor host bus, or called Front Side Bus (FSB), always operates at 800 MHz.

Choose Intel Xeon800 MHz FSB processors for Thunder i7525 (S2676) board.

The system will not operate with 400MHz FSB or 533MHz FSB Intel XeonCPUs.

§Single/Dual Processor System

The S2676 will only support a dual CPU configuration where BOTH CPUs have the

same FSB, Core Frequency and internal cache sizes. Using CPUs that do not follow

these guidelines can/would result in damage to the CPUs or the motherboard.

Single Processor System:

When installing only a single CPU, that CPU must be installed on CPU1 socket to

operatecorrectly.

Dual Processor System:

Thunder i7525 (S2676) board supports dual processor configurations only in which both

processors operate with the same FSB frequency, core frequency, and have the same

internal cache sizes. Mixing processors operating at different FSB frequency, core

frequency, or cache sizes may cause system non-operation or damages on processors

and/or the motherboard.

2.2 –Memory Considerations

§MemoryType

The S2676 motherboard supports up to eight 240-pin, 1.8 volt DDR2-400 Reg/ECC

modules. The 8 slots support 256MB, 512MB, 1GB, 2GB and 4*GB memory sticks up

to 32*GB the maximum in total. (*Not validated at the time of release)

DDR-I or Unbuffered DDR memory modules are not supported by Thunder i7525

(S2676) design.

Visit Tyan’s web site for the memory recommendation list.

§Memory Installation

The Thunder i7525 is based on Intel’s e7525 Tumwater chipset which supports a 144-

bit wide dual memory channel in an interleaved scheme. The motherboard requires a

minimum of 2 memory modules installed in order to boot/POST. You must install these

2 memory modules starting in DIMM slots 1 and 2. Do not mix and match different sizes,

brands or speeds for the best performance and stability possible.

Thunder i7525 (S2676)

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2.3 –Chassis/Enclosure Considerations

§Motherboardsize

Thunder i7525 (S2676) board is in the board size of12” (W) x13” (L).

§Motherboard and CPU Heat-sink Mounting Holes

There are six motherboard-mounting holes and eight CPU heat-sink mounting holes on

Thunder i7525 (S2676) board design. The motherboard and CPU mounting hole

locations follow SSI EEB v3.51 (AServer System Infrastructure specification for Entry

Pedestal Servers and Workstations) specifications. Ensure that the SSI-EEB chassis

you purchase is designed to accommodate the new Nacona heat sink mounting

process.

NOTE: There are many SSI-EEB chassis, but not all will accommodate the Nacona

design for the direct heat sink attachment to thechassis.Check with your vendor to

make sure thechassis supports the design.

Thunder i7525 (S2676) supports Intel’s CEK (Common Enabling Kit) for securing Intel’s

Xeon800 MHz FSB processors in the chassis. Two CEK springs for the dual

processors are pre-assembled with the motherboard or enclosed in the motherboard

accessory package. The CPU heat-sinks must be mounted down to the chassis base

panwithstand-offs. Any additional chassis standoffs, besides the 6 motherboard-

mounting holes and 8 CPU heat-sink mounting holes, should be removed to preventing

from short-circuit or motherboard damage.

§Others

As a system integrator, the air-flow/thermal, EMI/EMC, shock/vibration, and system

packing should be also considered for choosing a proper enclosure.

2.4 –Power Supply Considerations

§Power connectors

Thunder i7525 (S2676) board supports EPS/12V power supply unit (PSU) with three

power connectors listed below.

EPS/12V Power Connectors

24-pin system power connector 8-pin CPU power connector

(split CPU power planes)

§Split processor power planes

Thunder i7525 (S2676) board supports dual Intel’s 800 MHz FSB Xeonprocessors,

which could reach up to 140 Watts per processor. (Check Intel’s web for the processor

specifications.) By following SSI EEB v3.51 specifications, the Thunder i7525 (S2676)

is designed with two separate voltage regulator circuits to provide the power for both

onboard processors in separate power rails. Using a power supply with a combined

CPU power plane from the CPU power connector is not allowed and may causethe

system to fail to power up or damage to the power supply.

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§Powerrequirements

Check your power supply specifications to ensure sufficient power currents for each

power rail based on your system configuration.

The major system components/parts power sources are listed below as reference:

Components/Parts Main Power Source Power Connectors

CPU1 +12V_CPU1 8-pin CPU power connector

CPU2 +12V_CPU2 8-pin CPU power connector

Memory (Normal) +12V 24-pin and 6-pin power connectors

Memory

(Suspend to RAM) +5Vstandby 24-pin power connector

System logic +3.3V 24-pin and 6-pin power connectors

x16 PCI-Express

Graphic card +12V and +3.3V 24-pin and 6-pin power connectors

x8 PCI-Express +12V and +3.3V 24-pin and 6-pin power connectors

32-bit PCI +12V, +5V and +3.3V 24-pin and 6-pin power connectors

Cooling fans +12V 24-pin and 6-pin power connectors

IDE/SATA hard drives +12V and +5V From PSU

CDROM/DVD drives +12V and +5V From PSU

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Chapter 3: Board Installation

How to install our products right….the first time!

The first thing you should do read this user’s manual. It contains important information that will

make configuration and setup much easier. Here are some precautions you should take when

installing your motherboard:

(1) Ground yourself properly before removing your motherboard from the antistatic bag.

Unplug the power from your computer power supply and then touch a safely grounded

object to release static charge (i.e. power supply case). For the safest conditions,

TYANrecommends wearing a static safety wrist strap.

(2) Inspect the mounting holespattern of the Thunder i7525 (S2676) to match your chassis

standoff locations and remove the additional standoffs.

(3) Hold the motherboard by its edges and do not touch the bottom of the board, or flex the

board in any way.

(4) Avoid touching the motherboard components, IC chips, connectors, memory modules

and leads.

(5) Place the motherboard on a grounded antistatic surface or on the antistatic bag that the

board was shipped in.

(6) Inspect the board for damage.

(7) Check the jumper settings and connector locations as described in next sections.

In last sections of this chapter, we will cover the details on how to install your motherboard into

your chassis, as well as installing the processor, memory, disk drives andcables.

NOTE: Do not apply power to the board if it has been damaged.

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